DE69328285D1 - Thermoplastisches Polyimid, Polyamidsäureee, und thermoschmelzbarer Verbundfilm zum Beziehen von leitenden Drähten - Google Patents
Thermoplastisches Polyimid, Polyamidsäureee, und thermoschmelzbarer Verbundfilm zum Beziehen von leitenden DrähtenInfo
- Publication number
- DE69328285D1 DE69328285D1 DE69328285T DE69328285T DE69328285D1 DE 69328285 D1 DE69328285 D1 DE 69328285D1 DE 69328285 T DE69328285 T DE 69328285T DE 69328285 T DE69328285 T DE 69328285T DE 69328285 D1 DE69328285 D1 DE 69328285D1
- Authority
- DE
- Germany
- Prior art keywords
- thermofusible
- polyamic acid
- composite film
- conductive wires
- thermoplastic polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002131 composite material Substances 0.000 title 1
- 229920005575 poly(amic acid) Polymers 0.000 title 1
- 229920006259 thermoplastic polyimide Polymers 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35500592 | 1992-12-16 | ||
JP35817892 | 1992-12-25 | ||
JP20588593A JP3451401B2 (ja) | 1992-12-16 | 1993-07-27 | 超電導線材被覆用熱融着性積層フィルム |
JP20588693A JPH06239998A (ja) | 1992-12-25 | 1993-07-27 | 熱可塑性ポリイミド及びポリアミド酸 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69328285D1 true DE69328285D1 (de) | 2000-05-11 |
DE69328285T2 DE69328285T2 (de) | 2000-09-21 |
Family
ID=27476280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1993628285 Expired - Lifetime DE69328285T2 (de) | 1992-12-16 | 1993-12-15 | Thermoplastisches Polyimid, Polyamidsäureee, und thermoschmelzbarer Verbundfilm zum Beziehen von leitenden Drähten |
Country Status (5)
Country | Link |
---|---|
US (1) | US5668247A (de) |
EP (1) | EP0603725B1 (de) |
CA (1) | CA2111294A1 (de) |
DE (1) | DE69328285T2 (de) |
RU (1) | RU2139892C1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0673262A (ja) * | 1992-08-28 | 1994-03-15 | Sumitomo Chem Co Ltd | 熱可塑性樹脂組成物 |
EP0663417B1 (de) * | 1993-08-03 | 2000-03-29 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Polyimid-laminat umfassend ein thermoplastisches polyimidpolymer oder einen thermoplastischen polyimidfilm und verfahren zur herstellung des laminats |
US6156438A (en) * | 1998-04-09 | 2000-12-05 | E. I. Du Pont De Nemours And Company | Monolithic polyimide laminate containing encapsulated design and preparation thereof |
US6350844B1 (en) | 1998-11-05 | 2002-02-26 | Kaneka Corporation | Polyimide film and electric/electronic equipment bases with the use thereof |
US6693162B2 (en) * | 1999-04-09 | 2004-02-17 | Kaneka Japan Corporation | Polyimide resin and resin composition, adhesive solution, film-state joining component,and adhesive laminate film improved in moisture resistance using it, and production methods therefor |
US7252881B2 (en) | 2000-04-12 | 2007-08-07 | Kaneka Corporation | Multilayer structure and multilayer wiring board using the same |
WO2001099124A1 (fr) * | 2000-06-21 | 2001-12-27 | Dai Nippon Printing Co., Ltd. | Stratifie et son utilisation |
US6852826B2 (en) * | 2001-12-21 | 2005-02-08 | Kanera Corporation | Manufacturing method of polyamic acid, and polyamic acid solution |
US6740728B2 (en) * | 2002-05-24 | 2004-05-25 | Praxair Technology, Inc. | Methods for the preparation of polyesters, poly(ester amide)s and poly(ester imide)s and uses of the materials obtained therefrom |
US7267883B2 (en) * | 2002-09-25 | 2007-09-11 | Kaneka Corporation | Polyimide film and laminate having metal layer and same |
JP4225036B2 (ja) * | 2002-11-20 | 2009-02-18 | 日本電気株式会社 | 半導体パッケージ及び積層型半導体パッケージ |
KR101444694B1 (ko) * | 2009-05-25 | 2014-10-01 | 에스케이이노베이션 주식회사 | 연성금속박적층체 및 이의 제조방법 |
CN102385948B (zh) * | 2010-08-25 | 2015-08-19 | 日立金属株式会社 | 聚酯酰亚胺树脂绝缘涂料和使用该涂料的绝缘电线及线圈 |
US8343108B2 (en) | 2010-09-29 | 2013-01-01 | Interrad Medical, Inc. | Systems and methods for anchoring medical devices |
CN110857332B (zh) * | 2018-08-22 | 2022-10-21 | 臻鼎科技股份有限公司 | 高分子树脂、高分子树脂组合物及覆铜板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3179634A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Aromatic polyimides and the process for preparing them |
US3179630A (en) * | 1962-01-26 | 1965-04-20 | Du Pont | Process for preparing polyimides by treating polyamide-acids with lower fatty monocarboxylic acid anhydrides |
US3505168A (en) * | 1964-09-04 | 1970-04-07 | Du Pont | Heat-sealable laminar structures of polyimides and methods of laminating |
US3770573A (en) * | 1971-06-08 | 1973-11-06 | Du Pont | Interdiffusionally bonded structures of polyimide polymeric material |
JPS5234756B2 (de) * | 1974-05-01 | 1977-09-05 | ||
US4629777A (en) * | 1983-05-18 | 1986-12-16 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use |
JPS61111359A (ja) * | 1984-11-06 | 1986-05-29 | Ube Ind Ltd | ポリイミド膜 |
DE3542857A1 (de) * | 1985-12-04 | 1987-06-11 | Basf Ag | Vollaromatische mesomorphe polyesterimide |
JP2573595B2 (ja) * | 1987-03-09 | 1997-01-22 | 鐘淵化学工業株式会社 | ポリイミド膜 |
US5260413A (en) * | 1990-02-05 | 1993-11-09 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
US5106667A (en) * | 1990-02-05 | 1992-04-21 | E. I. Du Pont De Nemours And Company | Coated, heat-sealable aromatic polyimide film having superior compressive strength |
EP0456515B1 (de) * | 1990-05-10 | 1995-11-08 | Hitachi Chemical Co., Ltd. | Polyimide und diese enthaltende wärmehärtbare Harzzusammensetzungen |
US5322920A (en) * | 1990-07-25 | 1994-06-21 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Thermosetting esterimide oligomer and its production method |
JP2927531B2 (ja) * | 1990-10-24 | 1999-07-28 | 鐘淵化学工業株式会社 | フレキシブルプリント基板及びその製造方法 |
JPH04207094A (ja) * | 1990-11-30 | 1992-07-29 | Kanegafuchi Chem Ind Co Ltd | フレキシブルプリント基板およびその製造方法 |
-
1993
- 1993-12-13 CA CA 2111294 patent/CA2111294A1/en not_active Abandoned
- 1993-12-15 DE DE1993628285 patent/DE69328285T2/de not_active Expired - Lifetime
- 1993-12-15 EP EP19930120211 patent/EP0603725B1/de not_active Expired - Lifetime
- 1993-12-16 RU RU93055869A patent/RU2139892C1/ru active
- 1993-12-16 US US08/167,024 patent/US5668247A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69328285T2 (de) | 2000-09-21 |
RU2139892C1 (ru) | 1999-10-20 |
EP0603725B1 (de) | 2000-04-05 |
EP0603725A1 (de) | 1994-06-29 |
US5668247A (en) | 1997-09-16 |
CA2111294A1 (en) | 1994-06-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |