DE69326213D1 - Optischer Abtastkopf - Google Patents

Optischer Abtastkopf

Info

Publication number
DE69326213D1
DE69326213D1 DE69326213T DE69326213T DE69326213D1 DE 69326213 D1 DE69326213 D1 DE 69326213D1 DE 69326213 T DE69326213 T DE 69326213T DE 69326213 T DE69326213 T DE 69326213T DE 69326213 D1 DE69326213 D1 DE 69326213D1
Authority
DE
Germany
Prior art keywords
optical scanning
scanning head
head
optical
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69326213T
Other languages
English (en)
Other versions
DE69326213T2 (de
Inventor
Hideya Seki
Masatoshi Yonekubo
Toshio Arimura
Takashi Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4307322A external-priority patent/JPH05334711A/ja
Priority claimed from JP08653093A external-priority patent/JP3484717B2/ja
Priority claimed from JP9289393A external-priority patent/JPH06301998A/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of DE69326213D1 publication Critical patent/DE69326213D1/de
Publication of DE69326213T2 publication Critical patent/DE69326213T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1493—Electro-Magnetic Interference [EMI] or Radio Frequency Interference [RFI] shielding; grounding of static charges
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/123—Integrated head arrangements, e.g. with source and detectors mounted on the same substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/126—Circuits, methods or arrangements for laser control or stabilisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06817—Noise reduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optical Head (AREA)
  • Semiconductor Lasers (AREA)
DE69326213T 1992-11-17 1993-11-16 Optischer Abtastkopf Expired - Lifetime DE69326213T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP4307322A JPH05334711A (ja) 1992-04-02 1992-11-17 半導体レーザダイオード及び光ヘッド
JP31534292 1992-11-25
JP2035493 1993-02-08
JP08653093A JP3484717B2 (ja) 1993-02-08 1993-04-13 光ヘッド及び光学式情報記録再生装置
JP9289393A JPH06301998A (ja) 1993-04-20 1993-04-20 光ヘッド及び光学式情報記録再生装置

Publications (2)

Publication Number Publication Date
DE69326213D1 true DE69326213D1 (de) 1999-10-07
DE69326213T2 DE69326213T2 (de) 1999-12-30

Family

ID=27520221

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69326213T Expired - Lifetime DE69326213T2 (de) 1992-11-17 1993-11-16 Optischer Abtastkopf

Country Status (3)

Country Link
US (2) US5581523A (de)
EP (1) EP0598592B1 (de)
DE (1) DE69326213T2 (de)

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US6731585B2 (en) 2000-03-03 2004-05-04 Matsushita Electric Industrial Co., Ltd. Optical pick-up head with semiconductor laser
US6791592B2 (en) * 2000-04-18 2004-09-14 Laserink Printing a code on a product
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US6555903B2 (en) * 2000-12-19 2003-04-29 Truelight Corporation Package structure of hybrid device in optical signal transmitter
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US6868104B2 (en) * 2001-09-06 2005-03-15 Finisar Corporation Compact laser package with integrated temperature control
US20050224902A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US20050224899A1 (en) * 2002-02-06 2005-10-13 Ramsey Craig C Wireless substrate-like sensor
US20050233770A1 (en) * 2002-02-06 2005-10-20 Ramsey Craig C Wireless substrate-like sensor
US7289230B2 (en) * 2002-02-06 2007-10-30 Cyberoptics Semiconductors, Inc. Wireless substrate-like sensor
JP4645008B2 (ja) * 2002-06-10 2011-03-09 日亜化学工業株式会社 半導体レーザ装置
US7276986B2 (en) * 2003-02-05 2007-10-02 Hewlett-Packard Development Company, L.P. Method and apparatus for improving signal integrity in a high speed flex cable
US7317674B2 (en) * 2003-03-11 2008-01-08 Intersil Americas Inc. Optical pick-up units and laser drivers with increased functionality
CN100380479C (zh) * 2003-03-11 2008-04-09 英特赛尔美国股份有限公司 具有增强功能的光学拾音器单元和激光驱动器
EP1622158A4 (de) * 2003-05-08 2009-04-29 Panasonic Corp Halbleiterlaserbauelement
JP2005056461A (ja) * 2003-08-06 2005-03-03 Pioneer Electronic Corp 光学式情報記録装置
TWI295464B (en) * 2003-08-22 2008-04-01 Mediatek Inc Control circuit for an optical pickup head in a disk drive
KR100574953B1 (ko) * 2003-11-10 2006-04-28 삼성전자주식회사 열전소자를 구비하는 열원, 이를 채용한 광픽업 어셈블리및 이들 내부의 온도를 낮추기 위한 방법
EP1714277A1 (de) * 2004-02-05 2006-10-25 Koninklijke Philips Electronics N.V. Integrierte fotomonitorschaltung und optische abnehmereinheit
US20060092642A1 (en) * 2004-10-29 2006-05-04 Hideki Nakata Light emitting module, optical head, and optical disc recording and reproducing apparatus
US20060120226A1 (en) * 2004-11-16 2006-06-08 Matsushita Electric Industrial Co., Ltd. Optical pick-up device and optical disk device
US20070165511A1 (en) * 2006-01-13 2007-07-19 Tse-Hsiang Hsu Signal processing method and optical pickup for keeping available information during high speed optical recording
CN101410690B (zh) * 2006-02-21 2011-11-23 赛博光学半导体公司 半导体加工工具中的电容性距离感测
US7893697B2 (en) 2006-02-21 2011-02-22 Cyberoptics Semiconductor, Inc. Capacitive distance sensing in semiconductor processing tools
US7808872B2 (en) * 2006-07-06 2010-10-05 Intersil Americas Inc. Hybrid laser diode drivers that include a state machine
DE112007002309T5 (de) 2006-09-29 2009-07-30 Cyberoptics Semiconductor, Inc., Beaverton Substratähnlicher Teilchensensor
TW200849444A (en) * 2007-04-05 2008-12-16 Cyberoptics Semiconductor Inc Semiconductor processing system with integrated showerhead distance measuring device
US8018809B2 (en) * 2007-05-16 2011-09-13 Intersil Americas Inc. Hybrid laser diode drivers
US7720337B2 (en) * 2007-12-20 2010-05-18 Intel Corporation Wafer based optical interconnect
JP2009151872A (ja) * 2007-12-20 2009-07-09 Toshiba Corp 光ディスク駆動装置および傾き補正装置
DE202009011697U1 (de) * 2009-06-12 2010-05-12 Schäfter + Kirchhoff GmbH Laserdiodenstrahlquelle
CN107565374B (zh) 2012-05-08 2020-08-07 镁可微波技术有限公司 具有光束形状修改的激光器
US10512155B2 (en) * 2016-01-27 2019-12-17 Kyocera Corporation Wiring board, optical semiconductor element package, and optical semiconductor device
WO2019205153A1 (zh) * 2018-04-28 2019-10-31 深圳市大疆创新科技有限公司 激光二极管封装模块及发射装置、测距装置、电子设备
US10583668B2 (en) 2018-08-07 2020-03-10 Markem-Imaje Corporation Symbol grouping and striping for wide field matrix laser marking

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Also Published As

Publication number Publication date
EP0598592A2 (de) 1994-05-25
EP0598592B1 (de) 1999-09-01
EP0598592A3 (en) 1995-09-27
US5680384A (en) 1997-10-21
US5581523A (en) 1996-12-03
DE69326213T2 (de) 1999-12-30

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Legal Events

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8364 No opposition during term of opposition