DE69323958D1 - Optische Wellenleiter-Anordnung und Herstellungsmethode - Google Patents
Optische Wellenleiter-Anordnung und HerstellungsmethodeInfo
- Publication number
- DE69323958D1 DE69323958D1 DE69323958T DE69323958T DE69323958D1 DE 69323958 D1 DE69323958 D1 DE 69323958D1 DE 69323958 T DE69323958 T DE 69323958T DE 69323958 T DE69323958 T DE 69323958T DE 69323958 D1 DE69323958 D1 DE 69323958D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- optical waveguide
- waveguide arrangement
- arrangement
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12004—Combinations of two or more optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/125—Bends, branchings or intersections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12038—Glass (SiO2 based materials)
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12061—Silicon
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12104—Mirror; Reflectors or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30429992 | 1992-11-16 | ||
JP30429892 | 1992-11-16 | ||
JP30430092 | 1992-11-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69323958D1 true DE69323958D1 (de) | 1999-04-22 |
DE69323958T2 DE69323958T2 (de) | 1999-09-16 |
Family
ID=27338671
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69323958T Expired - Fee Related DE69323958T2 (de) | 1992-11-16 | 1993-11-16 | Optische Wellenleiter-Anordnung und Herstellungsmethode |
Country Status (4)
Country | Link |
---|---|
US (2) | US5485540A (de) |
EP (1) | EP0598395B1 (de) |
KR (1) | KR0137125B1 (de) |
DE (1) | DE69323958T2 (de) |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5747857A (en) * | 1991-03-13 | 1998-05-05 | Matsushita Electric Industrial Co., Ltd. | Electronic components having high-frequency elements and methods of manufacture therefor |
EP0657900B1 (de) * | 1993-12-06 | 1998-03-25 | Matsushita Electric Industrial Co., Ltd. | Hybrid Magnetstruktur und deren Herstellungsverfahren |
US5652674A (en) * | 1994-08-31 | 1997-07-29 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing domain-inverted region, optical wavelength conversion device utilizing such domain-inverted region and method for fabricating such device |
DE19607107A1 (de) * | 1996-02-26 | 1997-08-28 | Sel Alcatel Ag | Anordnung zur Kopplung von Signallicht zwischen einem Lichtwellenleiter und einer optoelektronischen Komponente |
DK0881195T3 (da) * | 1996-07-19 | 2004-02-09 | Kurita Water Ind Ltd | Fremgangsmåde og anordning til biologisk behandling af organisk affaldsvæske |
JP4108790B2 (ja) * | 1997-07-23 | 2008-06-25 | 浜松ホトニクス株式会社 | ガラス部材の接合方法 |
GB2334789B (en) * | 1998-06-12 | 2000-01-19 | Bookham Technology Ltd | A waveguide end face |
GB9816168D0 (en) * | 1998-07-25 | 1998-09-23 | Secr Defence | Etching method |
GB2341454B (en) * | 1998-09-14 | 2003-01-29 | Univ Southampton | Optical waveguide and method of fabricating the same |
JP2000162460A (ja) * | 1998-11-27 | 2000-06-16 | Sharp Corp | 有機光導波路およびその製造方法並びにそれを用いた光学部品 |
US6316332B1 (en) * | 1998-11-30 | 2001-11-13 | Lo Yu-Hwa | Method for joining wafers at a low temperature and low stress |
US6984571B1 (en) | 1999-10-01 | 2006-01-10 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US6500694B1 (en) * | 2000-03-22 | 2002-12-31 | Ziptronix, Inc. | Three dimensional device integration method and integrated device |
US20020048900A1 (en) * | 1999-11-23 | 2002-04-25 | Nova Crystals, Inc. | Method for joining wafers at a low temperature and low stress |
JP4414535B2 (ja) * | 2000-01-13 | 2010-02-10 | 進 野田 | 半導体装置の製造方法 |
US6902987B1 (en) | 2000-02-16 | 2005-06-07 | Ziptronix, Inc. | Method for low temperature bonding and bonded structure |
US7058245B2 (en) * | 2000-04-04 | 2006-06-06 | Waveguide Solutions, Inc. | Integrated optical circuits |
EP1285290A1 (de) | 2000-04-28 | 2003-02-26 | Edgelight Biosciences, Inc. | Mikroarray-leckwellen-fluoreszenzdetektionseinrichtung |
US6563133B1 (en) * | 2000-08-09 | 2003-05-13 | Ziptronix, Inc. | Method of epitaxial-like wafer bonding at low temperature and bonded structure |
GB2370409A (en) * | 2000-12-14 | 2002-06-26 | Bookham Technology Plc | Integrated optical devices |
US6785052B2 (en) * | 2001-05-21 | 2004-08-31 | Jds Uniphase Corporation | Stress free and thermally stabilized dielectric fiber |
US6996324B2 (en) * | 2001-09-19 | 2006-02-07 | Matsushita Electric Industrial Co., Ltd. | Optical waveguide and method for fabricating the same |
US20030164006A1 (en) * | 2001-10-26 | 2003-09-04 | Buchanan Karl H. | Direct bonding of glass articles for drawing |
US6814833B2 (en) * | 2001-10-26 | 2004-11-09 | Corning Incorporated | Direct bonding of articles containing silicon |
US20030079503A1 (en) * | 2001-10-26 | 2003-05-01 | Cook Glen B. | Direct bonding of glass articles for drawing |
US20030081906A1 (en) * | 2001-10-26 | 2003-05-01 | Filhaber John F. | Direct bonding of optical components |
US6836602B2 (en) | 2001-10-26 | 2004-12-28 | Corning Incorporated | Direct bonding of optical components |
US20030188553A1 (en) * | 2002-04-08 | 2003-10-09 | Mann Larry G. | Direct bonding methods using lithium |
EP1502135A2 (de) * | 2002-04-16 | 2005-02-02 | Xloom Photonics Ltd. | Elektrooptische schaltkreise mit integriertem verbinder und verfahren zu ihrer herstellung |
US20040021214A1 (en) * | 2002-04-16 | 2004-02-05 | Avner Badehi | Electro-optic integrated circuits with connectors and methods for the production thereof |
US6791748B2 (en) | 2002-05-02 | 2004-09-14 | Corning Incorporated | Optical isolators and methods of manufacture |
US6950235B2 (en) * | 2002-05-02 | 2005-09-27 | Corning Incorporated | Optical isolators and methods of manufacture |
US6885781B2 (en) * | 2002-05-03 | 2005-04-26 | Fujitsu Limited | Thin film electro-optical deflector device and a method of fabrication of such a device |
US6777252B2 (en) * | 2002-05-24 | 2004-08-17 | Alphion Corporation | Method and apparatus for testing an individual lightwave chip on a wafer |
US20030230113A1 (en) * | 2002-06-12 | 2003-12-18 | Patrick Gedeon | Methods for manufacturing glass articles |
FR2847990B1 (fr) * | 2002-11-29 | 2005-02-18 | Thales Sa | Procede de realisation de reseaux optiques non lineaires epais |
AU2003300348A1 (en) * | 2002-12-30 | 2004-07-29 | Corning Incorporated | Fast-switching scalable optical interconnection design with fast contention resolution |
JP2004281686A (ja) * | 2003-03-14 | 2004-10-07 | Sumitomo Electric Ind Ltd | 半導体発光デバイス及びその製造方法 |
US7109092B2 (en) | 2003-05-19 | 2006-09-19 | Ziptronix, Inc. | Method of room temperature covalent bonding |
EP1676160A4 (de) | 2003-10-15 | 2008-04-09 | Xloom Photonics Ltd | Elektrooptische schaltkreise mit integriertem verbinder und verfahren zu ihrer herstellung |
TWI235412B (en) * | 2004-08-10 | 2005-07-01 | Ind Tech Res Inst | Method for manufacturing bonded wafer with ultra-thin single crystal ferroelectricity film |
JP2006080314A (ja) * | 2004-09-09 | 2006-03-23 | Canon Inc | 結合基板の製造方法 |
US20090093137A1 (en) * | 2007-10-08 | 2009-04-09 | Xloom Communications, (Israel) Ltd. | Optical communications module |
JP2010263153A (ja) * | 2009-05-11 | 2010-11-18 | Sumitomo Electric Ind Ltd | 半導体集積光デバイス及びその作製方法 |
US9434145B2 (en) | 2012-12-07 | 2016-09-06 | Semrock, Inc. | Dichroic filter conformed to optical surface |
US10401099B2 (en) | 2016-10-05 | 2019-09-03 | Raytheon Company | Transparent heat exchanger |
EP3399228B1 (de) * | 2016-12-19 | 2021-12-29 | NGK Insulators, Ltd. | Phosphorelement und beleuchtungsvorrichtung |
US10629577B2 (en) | 2017-03-16 | 2020-04-21 | Invensas Corporation | Direct-bonded LED arrays and applications |
US11169326B2 (en) | 2018-02-26 | 2021-11-09 | Invensas Bonding Technologies, Inc. | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects |
US11762200B2 (en) | 2019-12-17 | 2023-09-19 | Adeia Semiconductor Bonding Technologies Inc. | Bonded optical devices |
CN111399116A (zh) * | 2020-04-24 | 2020-07-10 | 罕王微电子(辽宁)有限公司 | 一种堆叠式光波导结构及制备方法 |
CN115951454B (zh) * | 2023-03-13 | 2023-05-30 | 中科鑫通微电子技术(北京)有限公司 | 铌酸锂-氮化硅波导与激光器异质集成结构及其制备方法 |
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JPS51115794A (en) * | 1975-04-02 | 1976-10-12 | Mitsubishi Electric Corp | Thin film photo switch element |
JPS5223355A (en) * | 1975-08-18 | 1977-02-22 | Nippon Telegr & Teleph Corp <Ntt> | Process for fabricating a flush type light wave guiding path |
US4403825A (en) * | 1978-11-16 | 1983-09-13 | Hughes Aircraft Company | Integrated optics thin film devices and fabrication thereof |
US4615962A (en) * | 1979-06-25 | 1986-10-07 | University Patents, Inc. | Diacetylenes having liquid crystal phases |
JPS56131219A (en) * | 1980-03-17 | 1981-10-14 | Ngk Spark Plug Co Ltd | Energy-confined type piezoelectric filter |
US4582390A (en) * | 1982-01-05 | 1986-04-15 | At&T Bell Laboratories | Dielectric optical waveguide and technique for fabricating same |
JPS5967710A (ja) * | 1982-10-12 | 1984-04-17 | Seikosha Co Ltd | 厚みすべり圧電振動子 |
EP0192850A1 (de) * | 1985-01-07 | 1986-09-03 | Siemens Aktiengesellschaft | Monolithisch integriertes optoelektronisches Halbleiterbauelement |
GB2191603A (en) * | 1986-06-13 | 1987-12-16 | Northern Telecom Ltd | Optical conductor having at least three layers |
DE3641285A1 (de) * | 1986-12-03 | 1988-06-09 | Schott Glaswerke | Verfahren zur messung von (alpha) und ss-strahlen geringer intensitaet |
JPS63261219A (ja) * | 1987-04-20 | 1988-10-27 | Fujitsu Ltd | 光変調素子 |
JPH01189614A (ja) * | 1988-01-26 | 1989-07-28 | Nippon Telegr & Teleph Corp <Ntt> | 石英系光導波路及びその製造方法 |
US5070488A (en) * | 1988-06-29 | 1991-12-03 | Atsuko Fukushima | Optical integrated circuit and optical apparatus |
JP2788652B2 (ja) * | 1989-06-30 | 1998-08-20 | 日立電線株式会社 | 希土類元素添加ガラス導波路の製造方法 |
JPH0375608A (ja) * | 1989-08-17 | 1991-03-29 | Nippon Telegr & Teleph Corp <Ntt> | 光導波路部品の実装方法 |
DE59010811D1 (de) * | 1989-09-01 | 1998-04-23 | Siemens Ag | Integriert optische Anordnung mit wenigstens einem auf einem Substrat aus Halbleitermaterial integrierten optischen Wellenleiter |
EP0420173A3 (en) * | 1989-09-26 | 1992-09-09 | Omron Corporation | Rib optical waveguide and method of manufacturing the same |
DE69126155T2 (de) * | 1990-03-02 | 1997-12-18 | Toshiba Kawasaki Kk | Optische Wellenlängenwandlervorrichtung zur Erzeugung der zweiten Harmonischen mit Cerenkovstrahlung in einem Wellenleiter |
US5122852A (en) * | 1990-04-23 | 1992-06-16 | Bell Communications Research, Inc. | Grafted-crystal-film integrated optics and optoelectronic devices |
JPH04110831A (ja) * | 1990-08-31 | 1992-04-13 | Nec Corp | 光制御デバイス |
JPH04131805A (ja) * | 1990-09-25 | 1992-05-06 | Sumitomo Electric Ind Ltd | 石英系光導波路及びその製造方法 |
US5157748A (en) * | 1990-09-28 | 1992-10-20 | Siemens Aktiengesellschaft | Controllable integrated optical directional coupler |
JP2643620B2 (ja) * | 1991-03-13 | 1997-08-20 | 松下電器産業株式会社 | 電圧制御発振器とその製造方法 |
US5281305A (en) * | 1992-05-22 | 1994-01-25 | Northrop Corporation | Method for the production of optical waveguides employing trench and fill techniques |
EP0575948B1 (de) * | 1992-06-23 | 1997-04-23 | Matsushita Electric Industrial Co., Ltd. | Quartzgerät und Verfahren zur Herstellung |
KR0138006B1 (ko) * | 1992-10-26 | 1998-06-15 | 모리시타 요이찌 | 광도파로 및 그 제조방법 |
-
1993
- 1993-11-13 KR KR1019930024103A patent/KR0137125B1/ko not_active IP Right Cessation
- 1993-11-16 DE DE69323958T patent/DE69323958T2/de not_active Expired - Fee Related
- 1993-11-16 EP EP93118522A patent/EP0598395B1/de not_active Expired - Lifetime
-
1995
- 1995-02-14 US US08/389,070 patent/US5485540A/en not_active Expired - Fee Related
- 1995-08-04 US US08/511,554 patent/US5785874A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5785874A (en) | 1998-07-28 |
EP0598395A1 (de) | 1994-05-25 |
DE69323958T2 (de) | 1999-09-16 |
US5485540A (en) | 1996-01-16 |
KR0137125B1 (ko) | 1998-06-15 |
KR940011975A (ko) | 1994-06-22 |
EP0598395B1 (de) | 1999-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |