DE69322140T2 - Halbleiterpackung - Google Patents

Halbleiterpackung

Info

Publication number
DE69322140T2
DE69322140T2 DE69322140T DE69322140T DE69322140T2 DE 69322140 T2 DE69322140 T2 DE 69322140T2 DE 69322140 T DE69322140 T DE 69322140T DE 69322140 T DE69322140 T DE 69322140T DE 69322140 T2 DE69322140 T2 DE 69322140T2
Authority
DE
Germany
Prior art keywords
terminals
supports
printed circuit
pcb
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69322140T
Other languages
German (de)
English (en)
Other versions
DE69322140D1 (de
Inventor
Hyeon Jo Puk-Gu Inchon Jeong
Kyung Sub Kwanak-Gu Seoul Kim
Oh-Sik Unpyong-Gu Seoul Kwon
Joon Ki Songdong-Gu Seoul Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE69322140D1 publication Critical patent/DE69322140D1/de
Publication of DE69322140T2 publication Critical patent/DE69322140T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DE69322140T 1992-09-08 1993-08-02 Halbleiterpackung Expired - Lifetime DE69322140T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920016337A KR950014123B1 (ko) 1992-09-08 1992-09-08 반도체 패키지

Publications (2)

Publication Number Publication Date
DE69322140D1 DE69322140D1 (de) 1998-12-24
DE69322140T2 true DE69322140T2 (de) 1999-05-06

Family

ID=19339249

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322140T Expired - Lifetime DE69322140T2 (de) 1992-09-08 1993-08-02 Halbleiterpackung

Country Status (6)

Country Link
US (1) US5349235A (enExample)
EP (1) EP0587294B1 (enExample)
JP (1) JP2878564B2 (enExample)
KR (1) KR950014123B1 (enExample)
DE (1) DE69322140T2 (enExample)
TW (1) TW227627B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5204287A (en) * 1991-06-28 1993-04-20 Texas Instruments Incorporated Integrated circuit device having improved post for surface-mount package
US5619067A (en) * 1994-05-02 1997-04-08 Texas Instruments Incorporated Semiconductor device package side-by-side stacking and mounting system
EP0682366A3 (en) * 1994-05-12 1996-03-06 Texas Instruments Inc Assembly of integrated circuit components.
JP3150253B2 (ja) * 1994-07-22 2001-03-26 三菱電機株式会社 半導体装置およびその製造方法並びに実装方法
DE9415052U1 (de) * 1994-09-16 1994-11-03 Mannesmann Kienzle Gmbh, 78052 Villingen-Schwenningen Beschleunigungsgeber
US6310782B1 (en) 1996-10-31 2001-10-30 Compaq Computer Corporation Apparatus for maximizing memory density within existing computer system form factors
EP1004141A4 (en) * 1997-05-23 2001-01-24 Alpine Microsystems Inc SYSTEM AND ENCLOSURE METHOD OF INTEGRATED CIRCUITS
US6175161B1 (en) 1998-05-22 2001-01-16 Alpine Microsystems, Inc. System and method for packaging integrated circuits
US6043558A (en) * 1997-09-12 2000-03-28 Micron Technology, Inc. IC packages including separated signal and power supply edge connections, systems and devices including such packages, and methods of connecting such packages
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
US6291894B1 (en) * 1998-08-31 2001-09-18 Micron Technology, Inc. Method and apparatus for a semiconductor package for vertical surface mounting
US6326687B1 (en) 1998-09-01 2001-12-04 Micron Technology, Inc. IC package with dual heat spreaders
US6777261B2 (en) * 2000-12-26 2004-08-17 Micron Technology, Inc. Method and apparatus for a semiconductor package for vertical surface mounting
US6991960B2 (en) * 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
JP4917296B2 (ja) * 2005-10-28 2012-04-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4266282A (en) * 1979-03-12 1981-05-05 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
JPS63169055A (ja) * 1987-01-06 1988-07-13 Nec Corp シングルインラインモジユ−ル装置
US4855809A (en) * 1987-11-24 1989-08-08 Texas Instruments Incorporated Orthogonal chip mount system module and method
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
JPH02125648A (ja) * 1988-11-05 1990-05-14 Mitsubishi Electric Corp 半導体装置パッケージ
JPH03129866A (ja) * 1989-10-16 1991-06-03 Nec Kyushu Ltd 半導体装置
US4967262A (en) * 1989-11-06 1990-10-30 Micron Technology, Inc. Gull-wing zig-zag inline lead package having end-of-package anchoring pins
US5032953A (en) * 1990-08-15 1991-07-16 Pulse Engineering, Inc. Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
JP2862437B2 (ja) * 1991-07-10 1999-03-03 三菱電機株式会社 面実装形パッケージ
JP3013575B2 (ja) * 1992-01-29 2000-02-28 松下電器産業株式会社 縦型電子部品の実装方法

Also Published As

Publication number Publication date
KR940008026A (ko) 1994-04-28
EP0587294B1 (en) 1998-11-18
DE69322140D1 (de) 1998-12-24
TW227627B (enExample) 1994-08-01
EP0587294A1 (en) 1994-03-16
JPH06177282A (ja) 1994-06-24
KR950014123B1 (ko) 1995-11-21
JP2878564B2 (ja) 1999-04-05
US5349235A (en) 1994-09-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition