DE69319964T2 - System zur Umwandlung eines Infrarotbilds in ein Bild im sichtbaren oder nahen infraroten Bereich - Google Patents

System zur Umwandlung eines Infrarotbilds in ein Bild im sichtbaren oder nahen infraroten Bereich

Info

Publication number
DE69319964T2
DE69319964T2 DE69319964T DE69319964T DE69319964T2 DE 69319964 T2 DE69319964 T2 DE 69319964T2 DE 69319964 T DE69319964 T DE 69319964T DE 69319964 T DE69319964 T DE 69319964T DE 69319964 T2 DE69319964 T2 DE 69319964T2
Authority
DE
Germany
Prior art keywords
transmitter
light
infrared
detector
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69319964T
Other languages
German (de)
English (en)
Other versions
DE69319964D1 (de
Inventor
Daniel F-38000 Grenoble Amingual
Michel F-38000 Grenoble Wolny
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69319964D1 publication Critical patent/DE69319964D1/de
Publication of DE69319964T2 publication Critical patent/DE69319964T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
    • H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H10F39/1843—Infrared image sensors of the hybrid type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/191—Photoconductor image sensors
    • H10F39/193—Infrared image sensors
    • H10F39/1935—Infrared image sensors of the hybrid type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/10—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices
    • H10F55/15—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/155—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices control the electric light source, e.g. image converters, image amplifiers or image storage devices wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Telescopes (AREA)
  • Closed-Circuit Television Systems (AREA)
DE69319964T 1992-05-21 1993-05-18 System zur Umwandlung eines Infrarotbilds in ein Bild im sichtbaren oder nahen infraroten Bereich Expired - Fee Related DE69319964T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9206209A FR2691579A1 (fr) 1992-05-21 1992-05-21 Système de conversion d'une image infrarouge en image visible ou proche infrarouge.

Publications (2)

Publication Number Publication Date
DE69319964D1 DE69319964D1 (de) 1998-09-03
DE69319964T2 true DE69319964T2 (de) 1999-03-04

Family

ID=9430036

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69319964T Expired - Fee Related DE69319964T2 (de) 1992-05-21 1993-05-18 System zur Umwandlung eines Infrarotbilds in ein Bild im sichtbaren oder nahen infraroten Bereich

Country Status (5)

Country Link
US (1) US5332899A (enExample)
EP (1) EP0571268B1 (enExample)
JP (1) JPH06121232A (enExample)
DE (1) DE69319964T2 (enExample)
FR (1) FR2691579A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2715250B1 (fr) * 1994-01-19 1996-04-05 Commissariat Energie Atomique Dispositif tridimensionnel de détection de rayonnement et procédé de fabrication de ce dispositif.
US5567955A (en) * 1995-05-04 1996-10-22 National Research Council Of Canada Method for infrared thermal imaging using integrated gasa quantum well mid-infrared detector and near-infrared light emitter and SI charge coupled device
US5751344A (en) * 1995-07-05 1998-05-12 Schnee; Robert Alan Navigation system for a marine vessel in low light conditions
US5710428A (en) * 1995-08-10 1998-01-20 Samsung Electronics Co., Ltd. Infrared focal plane array detecting apparatus having light emitting devices and infrared camera adopting the same
US5703363A (en) * 1996-04-25 1997-12-30 He Holdings, Inc. Infrared to visible light image conversion device
US6157854A (en) 1999-01-13 2000-12-05 Bales Scientific Inc. Photon irradiation human pain treatment monitored by thermal imaging
US6930298B2 (en) * 2000-11-15 2005-08-16 The Johns Hopkins University Method and structure for minimizing error sources in image and position sensing detectors
WO2010023408A1 (fr) * 2008-08-25 2010-03-04 Commissariat A L'energie Atomique Imageur biface
US10354366B2 (en) 2015-01-16 2019-07-16 Nec Corporation Image processing device, image processing method, and recording medium
FR3039926A1 (fr) * 2015-08-04 2017-02-10 Commissariat Energie Atomique Procede d'assemblage de dispositifs electroniques
US10754142B2 (en) * 2017-06-07 2020-08-25 The United States Of America, As Represented By The Secretary Of The Navy Electronic up-conversions of a scene using a pixelated detector array
CN111916469B (zh) * 2020-08-31 2022-06-28 山西国惠光电科技有限公司 一种新型双色InGaAs红外焦平面探测器的制备方法
FR3149130A1 (fr) * 2023-05-24 2024-11-29 Airbus Defence And Space Sas Circuit de lecture pour capteur hybride

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR373807A (fr) * 1906-01-22 1907-05-28 Emile Adrien Vignes Jeu
FR371868A (fr) * 1906-11-28 1907-03-18 Eugene De Dorlodot Bandage élastique
US3649838A (en) * 1968-07-25 1972-03-14 Massachusetts Inst Technology Semiconductor device for producing radiation in response to incident radiation
US4205227A (en) * 1976-11-26 1980-05-27 Texas Instruments Incorporated Single junction emitter array
US4067104A (en) * 1977-02-24 1978-01-10 Rockwell International Corporation Method of fabricating an array of flexible metallic interconnects for coupling microelectronics components
GB2014395B (en) * 1978-02-14 1982-08-18 Emi Ltd Infra-red imager
US4362938A (en) * 1980-11-14 1982-12-07 The United States Of America As Represented By The Secretary Of The Army Infrared viewing system
DE3133641A1 (de) * 1981-08-26 1983-03-10 Philips Patentverwaltung Gmbh, 2000 Hamburg Ir-sichtgeraet
DE3531666A1 (de) * 1985-09-05 1987-03-12 Zeiss Carl Fa Vorrichtung zur erzeugung eines bildes einer szene, vorzugsweise eines waermebildes
US4914296A (en) * 1988-04-21 1990-04-03 The Boeing Company Infrared converter
FR2639784B1 (fr) * 1988-11-29 1991-01-11 Commissariat Energie Atomique Structure monolithique de detection ou d'imagerie infrarouge et son procede de fabrication
GB8829035D0 (en) * 1988-12-13 1989-07-05 Emi Plc Thorn Thermal imaging device
US4998688A (en) * 1989-06-29 1991-03-12 Hughes Aircraft Company Operating temperature hybridizing for focal plane arrays
US4943491A (en) * 1989-11-20 1990-07-24 Honeywell Inc. Structure for improving interconnect reliability of focal plane arrays

Also Published As

Publication number Publication date
DE69319964D1 (de) 1998-09-03
JPH06121232A (ja) 1994-04-28
FR2691579A1 (fr) 1993-11-26
EP0571268B1 (fr) 1998-07-29
FR2691579B1 (enExample) 1994-07-13
EP0571268A1 (fr) 1993-11-24
US5332899A (en) 1994-07-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee