DE69319299T2 - Verfahren zur Herstellung eines transparenten Musters aus leitendem Film - Google Patents

Verfahren zur Herstellung eines transparenten Musters aus leitendem Film

Info

Publication number
DE69319299T2
DE69319299T2 DE69319299T DE69319299T DE69319299T2 DE 69319299 T2 DE69319299 T2 DE 69319299T2 DE 69319299 T DE69319299 T DE 69319299T DE 69319299 T DE69319299 T DE 69319299T DE 69319299 T2 DE69319299 T2 DE 69319299T2
Authority
DE
Germany
Prior art keywords
producing
conductive film
transparent pattern
transparent
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69319299T
Other languages
English (en)
Other versions
DE69319299D1 (de
Inventor
Akiyoshi Hattori
Yoshihiro Hori
Akihiko Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE69319299D1 publication Critical patent/DE69319299D1/de
Application granted granted Critical
Publication of DE69319299T2 publication Critical patent/DE69319299T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
DE69319299T 1992-10-27 1993-03-18 Verfahren zur Herstellung eines transparenten Musters aus leitendem Film Expired - Fee Related DE69319299T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4289069A JPH06139845A (ja) 1992-10-27 1992-10-27 パターン化した透明導電膜の形成方法

Publications (2)

Publication Number Publication Date
DE69319299D1 DE69319299D1 (de) 1998-07-30
DE69319299T2 true DE69319299T2 (de) 1999-01-21

Family

ID=17738427

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69319299T Expired - Fee Related DE69319299T2 (de) 1992-10-27 1993-03-18 Verfahren zur Herstellung eines transparenten Musters aus leitendem Film

Country Status (4)

Country Link
US (1) US5403616A (de)
EP (1) EP0594932B1 (de)
JP (1) JPH06139845A (de)
DE (1) DE69319299T2 (de)

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JP3724592B2 (ja) * 1993-07-26 2005-12-07 ハイニックス セミコンダクター アメリカ インコーポレイテッド 半導体基板の平坦化方法
FR2721788B1 (fr) * 1994-06-24 1996-09-06 Bernard Tavernier Film chauffant.
US5935717A (en) * 1996-06-28 1999-08-10 Hitachi, Ltd. Functional film having inorganic thin on surface of organic film article using the same and process for producing the same
JPH10237078A (ja) * 1996-10-14 1998-09-08 Dainippon Printing Co Ltd 金属錯体溶液、感光性金属錯体溶液及び金属酸化物膜の形成方法
US6327011B2 (en) * 1997-10-20 2001-12-04 Lg Electronics, Inc. Liquid crystal display device having thin glass substrate on which protective layer formed and method of making the same
KR100352892B1 (ko) * 2000-05-22 2002-09-16 주식회사 팍스텍 박막 발열체의 제조방법 및 이것을 이용한 발열장치
WO2002011792A1 (en) * 2000-08-10 2002-02-14 Novo Nordisk A/S A support for a cartridge for transferring an electronically readable information to an electronic circuit, and use of a composite material in a support
US6994261B2 (en) * 2000-08-10 2006-02-07 Novo Nirdisk A/S Support for a cartridge for transferring an electronically readable item of information from the cartridge to an electronic circuit
KR100950133B1 (ko) * 2002-12-27 2010-03-30 엘지디스플레이 주식회사 인쇄방식에 의한 패턴형성방법
EP1608305B1 (de) * 2003-03-24 2008-07-30 Novo Nordisk A/S Transparentes elektronisches markieren eines medikamentenbehälters
US20060243804A1 (en) * 2003-10-03 2006-11-02 Novo Nordisk A/S Container comprising code information elements
US8053171B2 (en) 2004-01-16 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television
ATE495775T1 (de) 2005-05-10 2011-02-15 Novo Nordisk As Injektionsvorrichtung mit optischem sensor
EP1929248B1 (de) * 2005-09-22 2015-11-11 Novo Nordisk A/S Einrichtung und verfahren zur kontaktfreien absolutpositionsbestimmung
PL1999691T3 (pl) * 2006-03-20 2011-02-28 Novo Nordisk As Bezkontaktowy odczyt kodów identyfikacyjnych wkładu
US8994382B2 (en) 2006-04-12 2015-03-31 Novo Nordisk A/S Absolute position determination of movably mounted member in medication delivery device
JP2009534147A (ja) * 2006-04-26 2009-09-24 ノボ・ノルデイスク・エー／エス 薬剤送達装置における運動エレメントの非接触式の絶対位置測定
EP2125083B1 (de) * 2007-03-21 2013-08-21 Novo Nordisk A/S Medizinisches abgabesystem mit behältererkennung und behälter zur verwendung mit dem medizinischen abgabesystem
US20100194537A1 (en) * 2007-06-09 2010-08-05 Novo Nordisk A/S Contact free reading of reservoir identification codes
GB0720268D0 (en) * 2007-10-17 2007-11-28 Pilkington Group Ltd Glazing
EP2257120B1 (de) * 2008-03-17 2013-06-26 LG Chem, Ltd. Heizelement und herstellungsverfahren dafür
JP2011515809A (ja) * 2008-03-17 2011-05-19 エルジー・ケム・リミテッド 発熱体およびその製造方法
US20090280175A1 (en) * 2008-05-09 2009-11-12 Ishwar Chauhan Multilayer Proton Pump Inhibitor Tablets
JP5021842B2 (ja) 2008-06-13 2012-09-12 エルジー・ケム・リミテッド 発熱体およびその製造方法
US10412788B2 (en) 2008-06-13 2019-09-10 Lg Chem, Ltd. Heating element and manufacturing method thereof
KR20090129927A (ko) 2008-06-13 2009-12-17 주식회사 엘지화학 발열체 및 이의 제조방법
TR201808203T4 (tr) 2008-11-06 2018-07-23 Novo Nordisk As Elektronik destekli ilaç aktarım cihazı.
JP5896747B2 (ja) 2009-02-13 2016-03-30 ノボ・ノルデイスク・エー／エス 医療用デバイス及びカートリッジ
DE102009053688A1 (de) 2009-11-19 2011-05-26 Ferro Gmbh Siebdruckfähige Zusammensetzung und Verfahren zur Herstellung einer leitfähigen und transparenten Schicht
KR101141688B1 (ko) * 2010-02-10 2012-05-04 김철하 케미컬 습식 식각을 통한 기판 절단 방법
US10575449B1 (en) * 2017-06-19 2020-02-25 Rockwell Collins, Inc. Combined high frequency EMI shield and substrate heater using a thin film
US11065642B2 (en) * 2018-01-06 2021-07-20 Kohler Co. Multicolor fixture finishes
CN108684156A (zh) * 2018-03-30 2018-10-19 广州安檀科技有限公司 一种电路印制方法
CN108834322A (zh) * 2018-03-30 2018-11-16 广州大正新材料科技有限公司 一种印刷电路的方法
US20220073424A1 (en) * 2018-11-14 2022-03-10 Saint-Gobain Glass France Method for the selective etching of a layer or a stack of layers on a glass substrate
CN114174237A (zh) * 2019-06-28 2022-03-11 维特罗平板玻璃有限责任公司 具有可燃涂层掩模的基底
CN110769529A (zh) * 2019-11-12 2020-02-07 中国商用飞机有限责任公司 电加热膜结构以及电加热膜的成型方法

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US4187340A (en) * 1973-05-14 1980-02-05 Asahi Glass Company, Ltd. Method of forming patterned transparent electro-conductive film on the substrate of liquid crystal display
US4113895A (en) * 1976-11-19 1978-09-12 American Can Company Method for producing multilayered coated substrate
GB2068834A (en) * 1980-01-25 1981-08-19 Bfg Glassgroup Coating vitreous or ceramic supports
US4344817A (en) * 1980-09-15 1982-08-17 Photon Power, Inc. Process for forming tin oxide conductive pattern
JPS57138708A (en) * 1981-02-20 1982-08-27 Hitachi Ltd Composition for forming transparent conductive film and method of forming transparent conductive film
DE3368949D1 (en) * 1982-10-08 1987-02-12 Johnson Matthey Plc Printing ink
JPS62129846A (ja) * 1985-12-02 1987-06-12 Dainippon Screen Mfg Co Ltd フオトレジストの塗布方法及び塗布装置
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
US5059454A (en) * 1989-04-26 1991-10-22 Flex Products, Inc. Method for making patterned thin film

Also Published As

Publication number Publication date
EP0594932B1 (de) 1998-06-24
DE69319299D1 (de) 1998-07-30
EP0594932A1 (de) 1994-05-04
JPH06139845A (ja) 1994-05-20
US5403616A (en) 1995-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee