DE69618501T2 - Verfahren zur Herstellung eines Musters - Google Patents
Verfahren zur Herstellung eines MustersInfo
- Publication number
- DE69618501T2 DE69618501T2 DE69618501T DE69618501T DE69618501T2 DE 69618501 T2 DE69618501 T2 DE 69618501T2 DE 69618501 T DE69618501 T DE 69618501T DE 69618501 T DE69618501 T DE 69618501T DE 69618501 T2 DE69618501 T2 DE 69618501T2
- Authority
- DE
- Germany
- Prior art keywords
- pattern
- making
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4844995 | 1995-03-08 | ||
JP31505295 | 1995-12-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69618501D1 DE69618501D1 (de) | 2002-02-21 |
DE69618501T2 true DE69618501T2 (de) | 2002-06-13 |
Family
ID=26388722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69618501T Expired - Fee Related DE69618501T2 (de) | 1995-03-08 | 1996-03-06 | Verfahren zur Herstellung eines Musters |
Country Status (4)
Country | Link |
---|---|
US (2) | US5756262A (de) |
EP (3) | EP0747767B1 (de) |
KR (1) | KR0183271B1 (de) |
DE (1) | DE69618501T2 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1098162A (ja) * | 1996-09-20 | 1998-04-14 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6053058A (en) * | 1996-09-30 | 2000-04-25 | Dainippon Screen Mfg. Co., Ltd. | Atmosphere concentration monitoring for substrate processing apparatus and life determination for atmosphere processing unit of substrate processing apparatus |
US6254936B1 (en) * | 1998-09-14 | 2001-07-03 | Silicon Valley Group, Inc. | Environment exchange control for material on a wafer surface |
US6780461B2 (en) | 1998-09-14 | 2004-08-24 | Asml Holding N.V. | Environment exchange control for material on a wafer surface |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD160756A3 (de) * | 1981-04-24 | 1984-02-29 | Gudrun Dietz | Anordnung zur verbesserung fotochemischer umsetzungsprozesse in fotoresistschichten |
US4857435A (en) * | 1983-11-01 | 1989-08-15 | Hoechst Celanese Corporation | Positive photoresist thermally stable compositions and elements having deep UV response with maleimide copolymer |
JPS648620A (en) * | 1987-07-01 | 1989-01-12 | Hitachi Ltd | Coating method |
JPH01157527A (ja) * | 1987-12-14 | 1989-06-20 | Toshiba Corp | フォトレジストのパターン形成方法 |
US5127362A (en) * | 1989-05-22 | 1992-07-07 | Tokyo Electron Limited | Liquid coating device |
US5164278A (en) * | 1990-03-01 | 1992-11-17 | International Business Machines Corporation | Speed enhancers for acid sensitized resists |
EP0520654A1 (de) * | 1991-06-21 | 1992-12-30 | Hoechst Celanese Corporation | Tief-UV-empfindliche, positive Photoresistzusammensetzungen |
-
1996
- 1996-03-06 DE DE69618501T patent/DE69618501T2/de not_active Expired - Fee Related
- 1996-03-06 EP EP96103506A patent/EP0747767B1/de not_active Expired - Lifetime
- 1996-03-06 EP EP01113823A patent/EP1143297A3/de not_active Withdrawn
- 1996-03-06 EP EP01113822A patent/EP1143296A3/de not_active Withdrawn
- 1996-03-07 KR KR1019960005986A patent/KR0183271B1/ko not_active IP Right Cessation
- 1996-03-11 US US08/612,798 patent/US5756262A/en not_active Expired - Fee Related
-
1997
- 1997-07-01 US US08/886,446 patent/US5856069A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1143297A3 (de) | 2003-12-10 |
KR960035770A (ko) | 1996-10-28 |
KR0183271B1 (ko) | 1999-04-15 |
EP1143297A2 (de) | 2001-10-10 |
EP0747767B1 (de) | 2002-01-16 |
EP1143296A3 (de) | 2003-12-17 |
US5756262A (en) | 1998-05-26 |
DE69618501D1 (de) | 2002-02-21 |
EP1143296A2 (de) | 2001-10-10 |
US5856069A (en) | 1999-01-05 |
EP0747767A2 (de) | 1996-12-11 |
EP0747767A3 (de) | 1997-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |
|
8339 | Ceased/non-payment of the annual fee |