DE69318957D1 - Herstellungsverfahren für Druckwandler mittels der Silicium auf Isolation Technologie sowie derart hergestellte Wandler - Google Patents

Herstellungsverfahren für Druckwandler mittels der Silicium auf Isolation Technologie sowie derart hergestellte Wandler

Info

Publication number
DE69318957D1
DE69318957D1 DE69318957T DE69318957T DE69318957D1 DE 69318957 D1 DE69318957 D1 DE 69318957D1 DE 69318957 T DE69318957 T DE 69318957T DE 69318957 T DE69318957 T DE 69318957T DE 69318957 D1 DE69318957 D1 DE 69318957D1
Authority
DE
Germany
Prior art keywords
transducers
silicon
way
manufacturing process
manufactured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69318957T
Other languages
English (en)
Other versions
DE69318957T2 (de
Inventor
Bernard Diem
Marie-Therese Delaye
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69318957D1 publication Critical patent/DE69318957D1/de
Application granted granted Critical
Publication of DE69318957T2 publication Critical patent/DE69318957T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158Diaphragms, membranes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00Specific applications of microelectromechanical systems
    • B81B2201/02Sensors
    • B81B2201/0264Pressure sensors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/135Removal of substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/159Strain gauges
DE69318957T 1992-12-28 1993-12-23 Herstellungsverfahren für Druckwandler mittels der Silicium auf Isolation Technologie sowie derart hergestellte Wandler Expired - Lifetime DE69318957T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9215772A FR2700003B1 (fr) 1992-12-28 1992-12-28 Procédé de fabrication d'un capteur de pression utilisant la technologie silicium sur isolant et capteur obtenu.

Publications (2)

Publication Number Publication Date
DE69318957D1 true DE69318957D1 (de) 1998-07-09
DE69318957T2 DE69318957T2 (de) 1998-12-17

Family

ID=9437154

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69318957T Expired - Lifetime DE69318957T2 (de) 1992-12-28 1993-12-23 Herstellungsverfahren für Druckwandler mittels der Silicium auf Isolation Technologie sowie derart hergestellte Wandler

Country Status (5)

Country Link
US (2) US5510276A (de)
EP (1) EP0605302B1 (de)
JP (1) JP3444639B2 (de)
DE (1) DE69318957T2 (de)
FR (1) FR2700003B1 (de)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4314888C1 (de) * 1993-05-05 1994-08-18 Ignaz Eisele Verfahren zum Abscheiden einer ganzflächigen Schicht durch eine Maske und optionalem Verschließen dieser Maske
US5738731A (en) 1993-11-19 1998-04-14 Mega Chips Corporation Photovoltaic device
US6162667A (en) * 1994-03-28 2000-12-19 Sharp Kabushiki Kaisha Method for fabricating thin film transistors
FR2732467B1 (fr) * 1995-02-10 1999-09-17 Bosch Gmbh Robert Capteur d'acceleration et procede de fabrication d'un tel capteur
JPH08274350A (ja) * 1995-03-29 1996-10-18 Yokogawa Electric Corp 半導体圧力センサ及びその製造方法
EP0822578B1 (de) * 1996-07-31 2003-10-08 STMicroelectronics S.r.l. Verfahren zur Herstellung von integrierten Halbleiteranordnungen mit chemoresistivem Gasmikrosensor
EP0822398B1 (de) * 1996-07-31 2003-04-23 STMicroelectronics S.r.l. Integrierter piezoresistiver Druckwandler und Herstellungsverfahren dazu
US6379990B1 (en) * 1997-01-03 2002-04-30 Infineon Technologies Ag Method of fabricating a micromechanical semiconductor configuration
EP0863392B1 (de) * 1997-03-04 2000-08-09 STMicroelectronics S.r.l. Methode zur Herstellung von mikromechanischen Drucksensoren
US6707121B2 (en) * 1997-03-28 2004-03-16 Interuniversitair Microelektronica Centrum (Imec Vzw) Micro electro mechanical systems and devices
FR2762389B1 (fr) 1997-04-17 1999-05-21 Commissariat Energie Atomique Microsysteme a membrane souple pour capteur de pression et procede de realisation
FR2763745B1 (fr) * 1997-05-23 1999-08-27 Sextant Avionique Procede de fabrication d'un micro-capteur en silicium usine
US6211558B1 (en) * 1997-07-18 2001-04-03 Kavlico Corporation Surface micro-machined sensor with pedestal
WO1999032890A1 (de) * 1997-12-19 1999-07-01 Siemens Aktiengesellschaft Mikromechanische vorrichtung und entsprechendes herstellungsverfahren
US6085594A (en) * 1998-09-04 2000-07-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration High resolution and large dynamic range resonant pressure sensor based on Q-factor measurement
US6236096B1 (en) * 1998-10-06 2001-05-22 National Science Council Of Republic Of China Structure of a three-electrode capacitive pressure sensor
KR20010041742A (ko) * 1999-01-13 2001-05-25 다니구찌 이찌로오, 기타오카 다카시 실리콘 디바이스의 제조방법
US6635910B1 (en) * 1999-07-22 2003-10-21 Measurement Specialties, Inc. Silicon strain gage having a thin layer of highly conductive silicon
US6720635B1 (en) * 1999-12-17 2004-04-13 Motorola, Inc. Electronic component
DE10005555A1 (de) * 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
EP1259976A2 (de) 2000-02-23 2002-11-27 National Center for Scientific Research Demokritos Institute of Microelectronics Kapazitive druckempfindliche vorrichtungen und ihre herstellung
US6448604B1 (en) * 2000-09-12 2002-09-10 Robert Bosch Gmbh Integrated adjustable capacitor
US6552404B1 (en) * 2001-04-17 2003-04-22 Analog Devices, Inc. Integratable transducer structure
DE10121394A1 (de) * 2001-05-02 2002-11-07 Bosch Gmbh Robert Halbleiterbauelement, insbesondere ein mikromechanischer Drucksensor
DE10123627B4 (de) * 2001-05-15 2004-11-04 Robert Bosch Gmbh Sensorvorrichtung zum Erfassen einer mechanischen Deformation eines Bauelementes im Kraftfahrzeugbereich
KR100404904B1 (ko) * 2001-06-09 2003-11-07 전자부품연구원 차동 용량형 압력센서 및 그 제조방법
FI114755B (fi) * 2001-10-01 2004-12-15 Valtion Teknillinen Menetelmä ontelorakenteen muodostamiseksi SOI-kiekolle sekä SOI-kiekon ontelorakenne
SE0103471D0 (sv) 2001-10-15 2001-10-15 Silex Microsystems Ab Electrum Pressure sensor
US6828171B2 (en) * 2002-01-16 2004-12-07 Xerox Corporation Systems and methods for thermal isolation of a silicon structure
US6707236B2 (en) 2002-01-29 2004-03-16 Sri International Non-contact electroactive polymer electrodes
DE10316776B4 (de) * 2003-04-11 2005-03-17 Infineon Technologies Ag Verfahren zum Erzeugen einer Schutzabdeckung für ein Bauelement
FR2857002B1 (fr) * 2003-07-04 2005-10-21 Commissariat Energie Atomique Procede de desolidarisation d'une couche utile et composant obtenu par ce procede
DE10352001A1 (de) * 2003-11-07 2005-06-09 Robert Bosch Gmbh Mikromechanisches Bauelement mit einer Membran und Verfahren zur Herstellung eines solchen Bauelements
DE102004036035B4 (de) * 2003-12-16 2015-10-15 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein Halbleiterbauelement, insbesondere ein Membransensor
EP1544163B1 (de) * 2003-12-16 2021-02-24 Robert Bosch GmbH Verfahren zur Herstellung eines Membransensors und entsprechender Membransensor
DE602004027597D1 (de) * 2004-03-19 2010-07-22 St Microelectronics Srl Halbleiterdrucksensor und Verfahren zur Herstellung
WO2006031595A2 (en) * 2004-09-13 2006-03-23 Pall Corporation Pressure sensing devices and fluid assemblies
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
US7775966B2 (en) 2005-02-24 2010-08-17 Ethicon Endo-Surgery, Inc. Non-invasive pressure measurement in a fluid adjustable restrictive device
US7699770B2 (en) 2005-02-24 2010-04-20 Ethicon Endo-Surgery, Inc. Device for non-invasive measurement of fluid pressure in an adjustable restriction device
US8016744B2 (en) 2005-02-24 2011-09-13 Ethicon Endo-Surgery, Inc. External pressure-based gastric band adjustment system and method
US7658196B2 (en) 2005-02-24 2010-02-09 Ethicon Endo-Surgery, Inc. System and method for determining implanted device orientation
US7927270B2 (en) 2005-02-24 2011-04-19 Ethicon Endo-Surgery, Inc. External mechanical pressure sensor for gastric band pressure measurements
US7775215B2 (en) 2005-02-24 2010-08-17 Ethicon Endo-Surgery, Inc. System and method for determining implanted device positioning and obtaining pressure data
US8066629B2 (en) 2005-02-24 2011-11-29 Ethicon Endo-Surgery, Inc. Apparatus for adjustment and sensing of gastric band pressure
CN100535816C (zh) * 2005-02-28 2009-09-02 罗斯蒙德公司 用于过程诊断的过程连接装置和方法
US7129138B1 (en) * 2005-04-14 2006-10-31 International Business Machines Corporation Methods of implementing and enhanced silicon-on-insulator (SOI) box structures
CN101589543B (zh) 2005-05-18 2012-10-31 科隆科技公司 微机电换能器
CA2607918A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
US20060276008A1 (en) * 2005-06-02 2006-12-07 Vesa-Pekka Lempinen Thinning
CA2608164A1 (en) * 2005-06-17 2006-12-21 Kolo Technologies, Inc. Micro-electro-mechanical transducer having an insulation extension
CA2613241A1 (en) 2005-06-21 2007-01-04 Cardiomems, Inc. Method of manufacturing implantable wireless sensor for in vivo pressure measurement
US7709313B2 (en) * 2005-07-19 2010-05-04 International Business Machines Corporation High performance capacitors in planar back gates CMOS
US8152710B2 (en) 2006-04-06 2012-04-10 Ethicon Endo-Surgery, Inc. Physiological parameter analysis for an implantable restriction device and a data logger
US8870742B2 (en) 2006-04-06 2014-10-28 Ethicon Endo-Surgery, Inc. GUI for an implantable restriction device and a data logger
JP4739164B2 (ja) * 2006-10-20 2011-08-03 三菱電機株式会社 車両用エンジンの吸入空気圧力測定用の半導体感歪センサ
DE102008000128B4 (de) * 2007-01-30 2013-01-03 Denso Corporation Halbleitersensorvorrichtung und deren Herstellungsverfahren
DE102007014468A1 (de) 2007-03-22 2008-09-25 Endress + Hauser Gmbh + Co. Kg Drucksensor-Chip
US7412892B1 (en) 2007-06-06 2008-08-19 Measurement Specialties, Inc. Method of making pressure transducer and apparatus
WO2009006318A1 (en) 2007-06-29 2009-01-08 Artificial Muscle, Inc. Electroactive polymer transducers for sensory feedback applications
JP4607153B2 (ja) * 2007-07-12 2011-01-05 株式会社日立製作所 微小電気機械システム素子の製造方法
US8898036B2 (en) 2007-08-06 2014-11-25 Rosemount Inc. Process variable transmitter with acceleration sensor
US7484416B1 (en) * 2007-10-15 2009-02-03 Rosemount Inc. Process control transmitter with vibration sensor
FR2923475B1 (fr) * 2007-11-09 2009-12-18 Commissariat Energie Atomique Procede de realisation d'un dispositif a membrane suspendue
US20100109104A1 (en) * 2008-10-30 2010-05-06 Radi Medical Systems Ab Pressure sensor and wire guide assembly
EP2182340A1 (de) 2008-10-30 2010-05-05 Radi Medical Systems AB Drucksensor und Führungsdrahtanordnung
EP2239793A1 (de) 2009-04-11 2010-10-13 Bayer MaterialScience AG Elektrisch schaltbarer Polymerfilmaufbau und dessen Verwendung
JP2011244425A (ja) * 2010-04-23 2011-12-01 Canon Inc 電気機械変換装置及びその作製方法
US9856132B2 (en) 2010-09-18 2018-01-02 Fairchild Semiconductor Corporation Sealed packaging for microelectromechanical systems
EP2616772B1 (de) 2010-09-18 2016-06-22 Fairchild Semiconductor Corporation Mikroverarbeitetes monolithisches 3-achsen-gyroskop mit einzelantrieb
DE112011103124T5 (de) 2010-09-18 2013-12-19 Fairchild Semiconductor Corporation Biegelager zum Verringern von Quadratur für mitschwingende mikromechanische Vorrichtungen
US9278846B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation Micromachined monolithic 6-axis inertial sensor
KR101332701B1 (ko) 2010-09-20 2013-11-25 페어차일드 세미컨덕터 코포레이션 기준 커패시터를 포함하는 미소 전자기계 압력 센서
KR20140008416A (ko) 2011-03-01 2014-01-21 바이엘 인텔렉쳐 프로퍼티 게엠베하 변형가능한 중합체 장치 및 필름을 제조하기 위한 자동화 제조 방법
CN103703404A (zh) 2011-03-22 2014-04-02 拜耳知识产权有限责任公司 电活化聚合物致动器双凸透镜系统
US11896365B2 (en) 2011-06-30 2024-02-13 Endotronix, Inc. MEMS device for an implant assembly
IN2014CN00337A (de) 2011-06-30 2015-04-03 Endotronix Inc
US10638955B2 (en) 2011-06-30 2020-05-05 Endotronix, Inc. Pressure sensing implant
US10226218B2 (en) 2011-06-30 2019-03-12 Endotronix, Inc. Pressure sensing implant
WO2014070316A1 (en) 2012-09-14 2014-05-08 Endotronix, Inc. Pressure sensor, anchor, delivery system and method
SE1151051A1 (sv) 2011-11-09 2013-05-10 Koninklijke Philips Electronics Nv Sensorstyrtråd
JP5429696B2 (ja) * 2011-12-02 2014-02-26 横河電機株式会社 振動式トランスデューサの製造方法
US8749000B2 (en) * 2012-02-15 2014-06-10 Robert Bosch Gmbh Pressure sensor with doped electrode
EP2828901B1 (de) 2012-03-21 2017-01-04 Parker Hannifin Corporation Rolle-an-rolle-herstellungsverfahren zur herstellung selbstheilender elektroaktiver polymervorrichtungen
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
EP2647952B1 (de) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Automatische Verstärkungsregelungsschleife einer MEMS-Vorrichtung für mechanischen Amplitudenantrieb
EP2647955B8 (de) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS-Vorrichtung mit Quadraturphasenverschiebungsauslöschung
KR102058489B1 (ko) 2012-04-05 2019-12-23 페어차일드 세미컨덕터 코포레이션 멤스 장치 프론트 엔드 전하 증폭기
US9625272B2 (en) 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
KR20150031285A (ko) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 연신 공정을 위한 연신 프레임
DE102013014881B4 (de) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien
WO2014066576A1 (en) 2012-10-24 2014-05-01 Bayer Intellectual Property Gmbh Polymer diode
KR20140067650A (ko) * 2012-11-27 2014-06-05 현대자동차주식회사 토크 센서
US9249008B2 (en) 2012-12-20 2016-02-02 Industrial Technology Research Institute MEMS device with multiple electrodes and fabricating method thereof
CN105241600B (zh) * 2015-08-17 2017-12-29 中国科学院地质与地球物理研究所 一种mems压力计芯片及其制造工艺
ES2627013B1 (es) * 2015-11-06 2018-05-03 Consejo Superior De Investigaciones Científicas (Csic) Sensor de presión capacitivo con capacitancias de referencia y método de obtención del mismo
IT201700006845A1 (it) * 2017-01-23 2018-07-23 B810 Soc A Responsabilita Limitata Sensore di pressione
EP3612084A1 (de) 2017-04-20 2020-02-26 Endotronix, Inc. Verankerungssystem für eine per katheter freigesetzte vorrichtung
CA3236972A1 (en) 2017-07-19 2019-01-24 Endotronix, Inc. Physiological monitoring system

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3323358A (en) * 1964-06-02 1967-06-06 Bendix Corp Solid state pressure transducer
US4262399A (en) * 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
JPS56111243A (en) * 1980-02-06 1981-09-02 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparation of semiconductor device
US4420790A (en) * 1982-04-02 1983-12-13 Honeywell Inc. High sensitivity variable capacitance transducer
US4680606A (en) * 1984-06-04 1987-07-14 Tactile Perceptions, Inc. Semiconductor transducer
US4674319A (en) * 1985-03-20 1987-06-23 The Regents Of The University Of California Integrated circuit sensor
US4665610A (en) * 1985-04-22 1987-05-19 Stanford University Method of making a semiconductor transducer having multiple level diaphragm structure
JPH0750789B2 (ja) * 1986-07-18 1995-05-31 日産自動車株式会社 半導体圧力変換装置の製造方法
GB2198611B (en) * 1986-12-13 1990-04-04 Spectrol Reliance Ltd Method of forming a sealed diaphragm on a substrate
NL8800847A (nl) * 1988-04-05 1989-11-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting met een soi-struktuur.
US5095401A (en) * 1989-01-13 1992-03-10 Kopin Corporation SOI diaphragm sensor
DE4004179A1 (de) * 1990-02-12 1991-08-14 Fraunhofer Ges Forschung Integrierbarer, kapazitiver drucksensor und verfahren zum herstellen desselben
DE4017265A1 (de) * 1990-05-29 1991-12-05 Fraunhofer Ges Forschung Mikromechanisches bauelement und verfahren zur herstellung desselben
US5289721A (en) * 1990-09-10 1994-03-01 Nippondenso Co., Ltd. Semiconductor pressure sensor
DE9102748U1 (de) * 1991-01-14 1991-07-04 Ploechinger, Heinz, Dipl.-Ing., 8130 Starnberg, De
JP2595829B2 (ja) * 1991-04-22 1997-04-02 株式会社日立製作所 差圧センサ、及び複合機能形差圧センサ
US5291534A (en) * 1991-06-22 1994-03-01 Toyoda Koki Kabushiki Kaisha Capacitive sensing device
US5241864A (en) * 1992-06-17 1993-09-07 Motorola, Inc. Double pinned sensor utilizing a tensile film
US5258097A (en) * 1992-11-12 1993-11-02 Ford Motor Company Dry-release method for sacrificial layer microstructure fabrication
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
US5316619A (en) * 1993-02-05 1994-05-31 Ford Motor Company Capacitive surface micromachine absolute pressure sensor and method for processing
US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor

Also Published As

Publication number Publication date
FR2700003A1 (fr) 1994-07-01
US5912499A (en) 1999-06-15
JPH077160A (ja) 1995-01-10
US5510276A (en) 1996-04-23
DE69318957T2 (de) 1998-12-17
EP0605302A3 (en) 1994-09-28
FR2700003B1 (fr) 1995-02-10
EP0605302A2 (de) 1994-07-06
JP3444639B2 (ja) 2003-09-08
EP0605302B1 (de) 1998-06-03

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