DE69311478T2 - Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente - Google Patents

Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente

Info

Publication number
DE69311478T2
DE69311478T2 DE69311478T DE69311478T DE69311478T2 DE 69311478 T2 DE69311478 T2 DE 69311478T2 DE 69311478 T DE69311478 T DE 69311478T DE 69311478 T DE69311478 T DE 69311478T DE 69311478 T2 DE69311478 T2 DE 69311478T2
Authority
DE
Germany
Prior art keywords
producing
block
semiconductor component
carrier body
shaped carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69311478T
Other languages
English (en)
Other versions
DE69311478D1 (de
Inventor
Poorter Johannes Antonius De
Rudolf Paulus Tijburg
De Pas Hermanus Antonius Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of DE69311478D1 publication Critical patent/DE69311478D1/de
Application granted granted Critical
Publication of DE69311478T2 publication Critical patent/DE69311478T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/162Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/0201Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01014Silicon [Si]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69311478T 1992-09-07 1993-08-31 Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente Expired - Fee Related DE69311478T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92202694 1992-09-07

Publications (2)

Publication Number Publication Date
DE69311478D1 DE69311478D1 (de) 1997-07-17
DE69311478T2 true DE69311478T2 (de) 1998-01-02

Family

ID=8210893

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69311478T Expired - Fee Related DE69311478T2 (de) 1992-09-07 1993-08-31 Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente

Country Status (4)

Country Link
US (1) US5578866A (de)
JP (1) JPH06188525A (de)
DE (1) DE69311478T2 (de)
TW (1) TW312022B (de)

Families Citing this family (29)

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US6517532B1 (en) * 1997-05-15 2003-02-11 Palomar Medical Technologies, Inc. Light energy delivery head
US20080294152A1 (en) * 1996-12-02 2008-11-27 Palomar Medical Technologies, Inc. Cooling System For A Photocosmetic Device
US8182473B2 (en) 1999-01-08 2012-05-22 Palomar Medical Technologies Cooling system for a photocosmetic device
US7204832B2 (en) 1996-12-02 2007-04-17 Pálomar Medical Technologies, Inc. Cooling system for a photo cosmetic device
US6653618B2 (en) 2000-04-28 2003-11-25 Palomar Medical Technologies, Inc. Contact detecting method and apparatus for an optical radiation handpiece
JP4056091B2 (ja) 1997-05-15 2008-03-05 パロマー・メディカル・テクノロジーズ・インコーポレーテッド 皮膚科的治療方法及び装置
EP1566149A1 (de) 1998-03-12 2005-08-24 Palomar Medical Technologies, Inc. System zur elektromagnetischen Bestrahlung der Haut
ES2403359T3 (es) 1998-03-27 2013-05-17 The General Hospital Corporation Procedimiento y aparato para la determinación selectiva de tejidos ricos en lípidos
US6514242B1 (en) 1998-12-03 2003-02-04 David Vasily Method and apparatus for laser removal of hair
IL150604A0 (en) * 2000-01-25 2003-02-12 Palomar Medical Tech Inc Method and apparatus for medical treatment utilizing long duration electromagnetic radiation
CN103251453A (zh) * 2000-12-28 2013-08-21 帕洛玛医疗技术有限公司 用于皮肤的emr治疗处理的方法和装置
US6888319B2 (en) 2001-03-01 2005-05-03 Palomar Medical Technologies, Inc. Flashlamp drive circuit
AU2002316500A1 (en) 2001-07-02 2003-01-21 Palomar Medical Technologies, Inc. Laser device for medical/cosmetic procedures
WO2003057059A1 (en) 2001-12-27 2003-07-17 Palomar Medical Technologies, Inc. Method and apparatus for improved vascular related treatment
JP2005519692A (ja) 2002-03-12 2005-07-07 パロマー・メディカル・テクノロジーズ・インコーポレーテッド 毛の成長の管理のための方法及び装置
US7135033B2 (en) 2002-05-23 2006-11-14 Palomar Medical Technologies, Inc. Phototreatment device for use with coolants and topical substances
CN100482182C (zh) 2002-06-19 2009-04-29 帕洛玛医疗技术公司 对一定深度的组织进行光热治疗的方法和装置
WO2004000098A2 (en) 2002-06-19 2003-12-31 Palomar Medical Technologies, Inc. Method and apparatus for treatment of cutaneous and subcutaneous conditions
US7309335B2 (en) 2003-12-31 2007-12-18 Palomar Medical Technologies, Inc. Dermatological treatment with visualization
US8535299B2 (en) * 2004-01-23 2013-09-17 Joseph Giovannoli Method and apparatus for skin reduction
EP2343021A1 (de) 2004-04-01 2011-07-13 The General Hospital Corporation Verfahren und Vorrichtung zur dermatologischen Behandlung und Gewebeneuformung
US7856985B2 (en) 2005-04-22 2010-12-28 Cynosure, Inc. Method of treatment body tissue using a non-uniform laser beam
CA2622560A1 (en) 2005-09-15 2007-03-29 Palomar Medical Technologies, Inc. Skin optical characterization device
US7586957B2 (en) 2006-08-02 2009-09-08 Cynosure, Inc Picosecond laser apparatus and methods for its operation and use
US9919168B2 (en) 2009-07-23 2018-03-20 Palomar Medical Technologies, Inc. Method for improvement of cellulite appearance
US9623527B2 (en) 2011-05-06 2017-04-18 Osram Opto Semiconductors Gmbh Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
KR102136901B1 (ko) 2012-04-18 2020-07-22 싸이노슈어, 엘엘씨 피코초 레이저 장치 및 그를 사용한 표적 조직의 치료 방법
WO2014145707A2 (en) 2013-03-15 2014-09-18 Cynosure, Inc. Picosecond optical radiation systems and methods of use
EP3759770A4 (de) 2018-02-26 2021-12-08 Cynosure, LLC Gütegeschalteter cavity-dump-subnanosekundenlaser

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3267653D1 (en) * 1981-04-09 1986-01-09 Fujitsu Ltd Laser apparatus
JPS59983A (ja) * 1982-06-25 1984-01-06 Toshiba Corp 半導体レ−ザ装置の製造方法
US4734380A (en) * 1983-04-08 1988-03-29 American Telephone And Telegraph Company, At&T Bell Laboratories Multicavity optical device held together by metallic film
JPS6414985A (en) * 1987-07-08 1989-01-19 Nec Corp Heat sink for semiconductor light emitting element
US5094970A (en) * 1988-11-07 1992-03-10 Mitsubishi Denki Kabushiki Kaisha Method of making a light emitting diode array

Also Published As

Publication number Publication date
JPH06188525A (ja) 1994-07-08
DE69311478D1 (de) 1997-07-17
TW312022B (de) 1997-08-01
US5578866A (en) 1996-11-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee