DE69311478D1 - Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente - Google Patents
Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine HalbleiterkomponenteInfo
- Publication number
- DE69311478D1 DE69311478D1 DE69311478T DE69311478T DE69311478D1 DE 69311478 D1 DE69311478 D1 DE 69311478D1 DE 69311478 T DE69311478 T DE 69311478T DE 69311478 T DE69311478 T DE 69311478T DE 69311478 D1 DE69311478 D1 DE 69311478D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- block
- semiconductor component
- carrier body
- shaped carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0201—Separation of the wafer into individual elements, e.g. by dicing, cleaving, etching or directly during growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92202694 | 1992-09-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69311478D1 true DE69311478D1 (de) | 1997-07-17 |
DE69311478T2 DE69311478T2 (de) | 1998-01-02 |
Family
ID=8210893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69311478T Expired - Fee Related DE69311478T2 (de) | 1992-09-07 | 1993-08-31 | Verfahren zur Herstellung eines blockförmigen Trägerkörpers für eine Halbleiterkomponente |
Country Status (4)
Country | Link |
---|---|
US (1) | US5578866A (de) |
JP (1) | JPH06188525A (de) |
DE (1) | DE69311478T2 (de) |
TW (1) | TW312022B (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8182473B2 (en) | 1999-01-08 | 2012-05-22 | Palomar Medical Technologies | Cooling system for a photocosmetic device |
US6508813B1 (en) | 1996-12-02 | 2003-01-21 | Palomar Medical Technologies, Inc. | System for electromagnetic radiation dermatology and head for use therewith |
US6517532B1 (en) * | 1997-05-15 | 2003-02-11 | Palomar Medical Technologies, Inc. | Light energy delivery head |
US6653618B2 (en) | 2000-04-28 | 2003-11-25 | Palomar Medical Technologies, Inc. | Contact detecting method and apparatus for an optical radiation handpiece |
US7204832B2 (en) | 1996-12-02 | 2007-04-17 | Pálomar Medical Technologies, Inc. | Cooling system for a photo cosmetic device |
US20080294152A1 (en) * | 1996-12-02 | 2008-11-27 | Palomar Medical Technologies, Inc. | Cooling System For A Photocosmetic Device |
DK0991372T3 (da) | 1997-05-15 | 2004-12-06 | Palomar Medical Tech Inc | Apparat til dermatologisk behandling |
WO1999049937A1 (en) | 1998-03-27 | 1999-10-07 | The General Hospital Corporation | Method and apparatus for the selective targeting of lipid-rich tissues |
US6514242B1 (en) | 1998-12-03 | 2003-02-04 | David Vasily | Method and apparatus for laser removal of hair |
CA2398238A1 (en) * | 2000-01-25 | 2001-08-02 | Palomar Medical Technologies, Inc. | Method and apparatus for medical treatment utilizing long duration electromagnetic radiation |
DE60124585T2 (de) * | 2000-12-28 | 2007-10-04 | Palomar Medical Technologies, Inc., Burlington | Apparat zur therapeutischen elektromagnetischen Strahlentherapie von der Haut |
US6888319B2 (en) | 2001-03-01 | 2005-05-03 | Palomar Medical Technologies, Inc. | Flashlamp drive circuit |
US6723090B2 (en) | 2001-07-02 | 2004-04-20 | Palomar Medical Technologies, Inc. | Fiber laser device for medical/cosmetic procedures |
WO2003057059A1 (en) | 2001-12-27 | 2003-07-17 | Palomar Medical Technologies, Inc. | Method and apparatus for improved vascular related treatment |
CN1652729A (zh) | 2002-03-12 | 2005-08-10 | 帕洛玛医疗技术公司 | 处理毛发生长的方法与设备 |
JP2006500972A (ja) | 2002-06-19 | 2006-01-12 | パロマー・メディカル・テクノロジーズ・インコーポレイテッド | ある深さの組織を輻射熱によって治療する方法および装置 |
BR0312430A (pt) | 2002-06-19 | 2005-04-26 | Palomar Medical Tech Inc | Método e aparelho para tratamento de condições cutâneas e subcutâneas |
EP1555948A2 (de) | 2002-10-23 | 2005-07-27 | Palomar Medical Technologies, Inc. | Lichtbehandlungseinrichtung zur verwendung mit kühlmitteln und topischen substanzen |
US7220254B2 (en) | 2003-12-31 | 2007-05-22 | Palomar Medical Technologies, Inc. | Dermatological treatment with visualization |
US8535299B2 (en) * | 2004-01-23 | 2013-09-17 | Joseph Giovannoli | Method and apparatus for skin reduction |
EP1742588B1 (de) | 2004-04-01 | 2016-10-19 | The General Hospital Corporation | Gerät für die dermatologische behandlung und gewebeumformung |
US7856985B2 (en) | 2005-04-22 | 2010-12-28 | Cynosure, Inc. | Method of treatment body tissue using a non-uniform laser beam |
AU2006292526A1 (en) | 2005-09-15 | 2007-03-29 | Palomar Medical Technologies, Inc. | Skin optical characterization device |
US7586957B2 (en) | 2006-08-02 | 2009-09-08 | Cynosure, Inc | Picosecond laser apparatus and methods for its operation and use |
US9919168B2 (en) | 2009-07-23 | 2018-03-20 | Palomar Medical Technologies, Inc. | Method for improvement of cellulite appearance |
DE112011105215A5 (de) * | 2011-05-06 | 2014-05-15 | Osram Opto Semiconductors Gmbh | Bauelementträgerverbund mit einer bauelementträgerbereiche abtrennenden Grabenstruktur und Verfahren zur Herstellung einer Mehrzahl von Bauelementträgerbereichen |
EP2839552A4 (de) | 2012-04-18 | 2015-12-30 | Cynosure Inc | Pikosekunderlaservorrichtung und verfahren zur behandlung von zielgewebe damit |
US10285757B2 (en) | 2013-03-15 | 2019-05-14 | Cynosure, Llc | Picosecond optical radiation systems and methods of use |
WO2019165426A1 (en) | 2018-02-26 | 2019-08-29 | Cynosure, Inc. | Q-switched cavity dumped sub-nanosecond laser |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0063309B1 (de) * | 1981-04-09 | 1985-11-27 | Fujitsu Limited | Laservorrichtung |
JPS59983A (ja) * | 1982-06-25 | 1984-01-06 | Toshiba Corp | 半導体レ−ザ装置の製造方法 |
US4734380A (en) * | 1983-04-08 | 1988-03-29 | American Telephone And Telegraph Company, At&T Bell Laboratories | Multicavity optical device held together by metallic film |
JPS6414985A (en) * | 1987-07-08 | 1989-01-19 | Nec Corp | Heat sink for semiconductor light emitting element |
US5094970A (en) * | 1988-11-07 | 1992-03-10 | Mitsubishi Denki Kabushiki Kaisha | Method of making a light emitting diode array |
-
1993
- 1993-08-31 DE DE69311478T patent/DE69311478T2/de not_active Expired - Fee Related
- 1993-09-01 US US08/115,335 patent/US5578866A/en not_active Expired - Fee Related
- 1993-09-02 TW TW082107158A patent/TW312022B/zh active
- 1993-09-06 JP JP5221035A patent/JPH06188525A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH06188525A (ja) | 1994-07-08 |
DE69311478T2 (de) | 1998-01-02 |
US5578866A (en) | 1996-11-26 |
TW312022B (de) | 1997-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N |
|
8339 | Ceased/non-payment of the annual fee |