DE69305012T2 - Chipträger mit einer Schutzschicht für die Schaltungsoberfläche - Google Patents

Chipträger mit einer Schutzschicht für die Schaltungsoberfläche

Info

Publication number
DE69305012T2
DE69305012T2 DE69305012T DE69305012T DE69305012T2 DE 69305012 T2 DE69305012 T2 DE 69305012T2 DE 69305012 T DE69305012 T DE 69305012T DE 69305012 T DE69305012 T DE 69305012T DE 69305012 T2 DE69305012 T2 DE 69305012T2
Authority
DE
Germany
Prior art keywords
chip carrier
encapsulation
chip
composition
encapsulant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69305012T
Other languages
German (de)
English (en)
Other versions
DE69305012D1 (de
Inventor
Brenda Diane Frey
Charles Arnold Joseph
Francis John Olshefski
James Warren Wilson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69305012D1 publication Critical patent/DE69305012D1/de
Publication of DE69305012T2 publication Critical patent/DE69305012T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W72/071—
    • H10W74/012—
    • H10W74/15—
    • H10W74/47—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/856—
    • H10W72/877—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Paints Or Removers (AREA)
DE69305012T 1992-07-06 1993-07-01 Chipträger mit einer Schutzschicht für die Schaltungsoberfläche Expired - Fee Related DE69305012T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/909,368 US5249101A (en) 1992-07-06 1992-07-06 Chip carrier with protective coating for circuitized surface

Publications (2)

Publication Number Publication Date
DE69305012D1 DE69305012D1 (de) 1996-10-31
DE69305012T2 true DE69305012T2 (de) 1997-04-03

Family

ID=25427125

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69305012T Expired - Fee Related DE69305012T2 (de) 1992-07-06 1993-07-01 Chipträger mit einer Schutzschicht für die Schaltungsoberfläche

Country Status (12)

Country Link
US (1) US5249101A (Direct)
EP (1) EP0578307B1 (Direct)
JP (1) JP2501287B2 (Direct)
KR (1) KR960015924B1 (Direct)
CN (1) CN1028937C (Direct)
AT (1) ATE143529T1 (Direct)
CA (1) CA2091910C (Direct)
DE (1) DE69305012T2 (Direct)
ES (1) ES2092216T3 (Direct)
MY (1) MY108750A (Direct)
SG (1) SG44362A1 (Direct)
TW (1) TW230272B (Direct)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
JPH0538479U (ja) * 1991-10-25 1993-05-25 曙ブレーキ工業株式会社 ブレーキ制御機構の電磁弁装置
US5288944A (en) * 1992-02-18 1994-02-22 International Business Machines, Inc. Pinned ceramic chip carrier
US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
KR100280762B1 (ko) * 1992-11-03 2001-03-02 비센트 비.인그라시아 노출 후부를 갖는 열적 강화된 반도체 장치 및 그 제조방법
US5403783A (en) * 1992-12-28 1995-04-04 Hitachi, Ltd. Integrated circuit substrate with cooling accelerator substrate
US5379187A (en) * 1993-03-25 1995-01-03 Vlsi Technology, Inc. Design for encapsulation of thermally enhanced integrated circuits
US5539545A (en) * 1993-05-18 1996-07-23 Semiconductor Energy Laboratory Co., Ltd. Method of making LCD in which resin columns are cured and the liquid crystal is reoriented
JPH0722722A (ja) * 1993-07-05 1995-01-24 Mitsubishi Electric Corp 樹脂成形タイプの電子回路装置
US5410806A (en) * 1993-09-15 1995-05-02 Lsi Logic Corporation Method for fabricating conductive epoxy grid array semiconductors packages
US5506756A (en) * 1994-01-25 1996-04-09 Intel Corporation Tape BGA package die-up/die down
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5776796A (en) * 1994-05-19 1998-07-07 Tessera, Inc. Method of encapsulating a semiconductor package
US5834339A (en) * 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US5706174A (en) * 1994-07-07 1998-01-06 Tessera, Inc. Compliant microelectrionic mounting device
US5688716A (en) * 1994-07-07 1997-11-18 Tessera, Inc. Fan-out semiconductor chip assembly
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
JPH0846098A (ja) * 1994-07-22 1996-02-16 Internatl Business Mach Corp <Ibm> 直接的熱伝導路を形成する装置および方法
US5659952A (en) 1994-09-20 1997-08-26 Tessera, Inc. Method of fabricating compliant interface for semiconductor chip
US6169328B1 (en) 1994-09-20 2001-01-02 Tessera, Inc Semiconductor chip assembly
US6870272B2 (en) * 1994-09-20 2005-03-22 Tessera, Inc. Methods of making microelectronic assemblies including compliant interfaces
US5915170A (en) * 1994-09-20 1999-06-22 Tessera, Inc. Multiple part compliant interface for packaging of a semiconductor chip and method therefor
US5757620A (en) * 1994-12-05 1998-05-26 International Business Machines Corporation Apparatus for cooling of chips using blind holes with customized depth
US5604978A (en) * 1994-12-05 1997-02-25 International Business Machines Corporation Method for cooling of chips using a plurality of materials
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
GB9502178D0 (en) * 1995-02-03 1995-03-22 Plessey Semiconductors Ltd MCM-D Assemblies
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
US6211572B1 (en) * 1995-10-31 2001-04-03 Tessera, Inc. Semiconductor chip package with fan-in leads
US6284563B1 (en) * 1995-10-31 2001-09-04 Tessera, Inc. Method of making compliant microelectronic assemblies
US5744383A (en) * 1995-11-17 1998-04-28 Altera Corporation Integrated circuit package fabrication method
KR19990067623A (ko) 1995-11-28 1999-08-25 가나이 쓰도무 반도체장치와 그 제조방법 및 실장기판
US6007349A (en) * 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
US5977629A (en) * 1996-01-24 1999-11-02 Micron Technology, Inc. Condensed memory matrix
JP3527350B2 (ja) * 1996-02-01 2004-05-17 株式会社ルネサステクノロジ 半導体装置
US5851311A (en) * 1996-03-29 1998-12-22 Sophia Systems Co., Ltd. Polymerizable flux composition for encapsulating the solder in situ
US5700723A (en) * 1996-05-15 1997-12-23 Lsi Logic Corporation Method of packaging an integrated circuit
US5895976A (en) * 1996-06-03 1999-04-20 Motorola Corporation Microelectronic assembly including polymeric reinforcement on an integrated circuit die, and method for forming same
US6686015B2 (en) 1996-12-13 2004-02-03 Tessera, Inc. Transferable resilient element for packaging of a semiconductor chip and method therefor
US5891753A (en) 1997-01-24 1999-04-06 Micron Technology, Inc. Method and apparatus for packaging flip chip bare die on printed circuit boards
US5798563A (en) 1997-01-28 1998-08-25 International Business Machines Corporation Polytetrafluoroethylene thin film chip carrier
US6639155B1 (en) 1997-06-11 2003-10-28 International Business Machines Corporation High performance packaging platform and method of making same
US6403882B1 (en) * 1997-06-30 2002-06-11 International Business Machines Corporation Protective cover plate for flip chip assembly backside
US6495083B2 (en) * 1997-10-29 2002-12-17 Hestia Technologies, Inc. Method of underfilling an integrated circuit chip
US6038136A (en) * 1997-10-29 2000-03-14 Hestia Technologies, Inc. Chip package with molded underfill
US6324069B1 (en) 1997-10-29 2001-11-27 Hestia Technologies, Inc. Chip package with molded underfill
US5969947A (en) 1997-12-17 1999-10-19 International Business Machines Corporation Integral design features for heatsink attach for electronic packages
JP3017485B2 (ja) * 1998-01-23 2000-03-06 アピックヤマダ株式会社 半導体装置の樹脂封止方法及び樹脂封止装置
US6224711B1 (en) 1998-08-25 2001-05-01 International Business Machines Corporation Assembly process for flip chip package having a low stress chip and resulting structure
US6117797A (en) * 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6008074A (en) 1998-10-01 1999-12-28 Micron Technology, Inc. Method of forming a synchronous-link dynamic random access memory edge-mounted device
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
US20020014688A1 (en) * 1999-03-03 2002-02-07 Suresh Ramalingam Controlled collapse chip connection (c4) integrated circuit package which has two dissimilar underfill materials
US6507101B1 (en) * 1999-03-26 2003-01-14 Hewlett-Packard Company Lossy RF shield for integrated circuits
US6077766A (en) * 1999-06-25 2000-06-20 International Business Machines Corporation Variable thickness pads on a substrate surface
DE60025489T2 (de) * 1999-07-08 2006-08-03 Sunstar Giken K.K., Takatsuki Unterfüllmaterial für halbleitergehäuse
US6426545B1 (en) * 2000-02-10 2002-07-30 Epic Technologies, Inc. Integrated circuit structures and methods employing a low modulus high elongation photodielectric
US6570259B2 (en) 2001-03-22 2003-05-27 International Business Machines Corporation Apparatus to reduce thermal fatigue stress on flip chip solder connections
US6974765B2 (en) * 2001-09-27 2005-12-13 Intel Corporation Encapsulation of pin solder for maintaining accuracy in pin position
US20050049334A1 (en) * 2003-09-03 2005-03-03 Slawomir Rubinsztain Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
US20040222518A1 (en) * 2003-02-25 2004-11-11 Tessera, Inc. Ball grid array with bumps
EP1851798B1 (en) * 2005-02-25 2016-08-03 Tessera, Inc. Microelectronic assemblies having compliancy
DE102005029407B4 (de) * 2005-06-24 2008-06-19 Mühlbauer Ag Verfahren und Vorrichtung zum dauerhaften Verbinden integrierter Schaltungen mit einem Substrat
US7749886B2 (en) 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
US8710618B2 (en) * 2007-03-12 2014-04-29 Honeywell International Inc. Fibrous laminate interface for security coatings
TW201025467A (en) * 2008-12-25 2010-07-01 United Test Ct Inc Ball implantation method and ball implantation system applying the method
JP6386746B2 (ja) * 2014-02-26 2018-09-05 株式会社ジェイデバイス 半導体装置
JP7358857B2 (ja) * 2019-09-04 2023-10-11 富士通株式会社 電子ユニット、電子ユニットの製造方法及び電子機器

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3365773D1 (en) * 1982-02-26 1986-10-09 Ciba Geigy Ag Coloured photo-hardenable composition
US4633573A (en) * 1982-10-12 1987-01-06 Aegis, Inc. Microcircuit package and sealing method
JPS6032807A (ja) * 1983-07-30 1985-02-20 Matsushita Electric Works Ltd 光硬化型樹脂組成物
DE3471486D1 (de) * 1983-08-15 1988-06-30 Ciba Geigy Ag Photocurable compositions
DE3442131A1 (de) * 1984-11-17 1986-05-22 Messerschmitt-Bölkow-Blohm GmbH, 8012 Ottobrunn Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
US4806574A (en) * 1985-07-22 1989-02-21 Desoto, Inc. Ultraviolet curable coatings for optical glass fiber based on a polyfunctional core
JP2568421B2 (ja) * 1987-03-24 1997-01-08 株式会社スリーボンド 嫌気硬化性接着シール剤組成物
US5039715A (en) * 1987-04-13 1991-08-13 Dymax Corporation Photocurable acrylate adhesive containing perester/tautomeric acid adhesion promoter
EP0335019B1 (en) * 1988-03-29 1993-05-26 Director General, Agency of Industrial Science and Technology Semiconductor chip bonded to a substrate
US4973611A (en) * 1988-04-04 1990-11-27 Uvexs Incorporated Optical fiber buffer coating with Tg
EP0340492A3 (en) * 1988-05-02 1990-07-04 International Business Machines Corporation Conformal sealing and interplanar encapsulation of electronic device structures
US4915167A (en) * 1988-08-05 1990-04-10 Westinghouse Electric Corp. Thermal coupling to enhance heat transfer
JPH0269945A (ja) * 1988-09-05 1990-03-08 Hitachi Ltd 半導体装置及びその製造方法
US5053357A (en) * 1989-12-27 1991-10-01 Motorola, Inc. Method of aligning and mounting an electronic device on a printed circuit board using a flexible substrate having fixed lead arrays thereon
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5089440A (en) * 1990-03-14 1992-02-18 International Business Machines Corporation Solder interconnection structure and process for making
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
JP2843658B2 (ja) * 1990-08-02 1999-01-06 東レ・ダウコーニング・シリコーン株式会社 フリップチップ型半導体装置
US5128746A (en) * 1990-09-27 1992-07-07 Motorola, Inc. Adhesive and encapsulant material with fluxing properties
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
US5173764A (en) * 1991-04-08 1992-12-22 Motorola, Inc. Semiconductor device having a particular lid means and encapsulant to reduce die stress

Also Published As

Publication number Publication date
JP2501287B2 (ja) 1996-05-29
CN1081787A (zh) 1994-02-09
MY108750A (en) 1996-11-30
EP0578307B1 (en) 1996-09-25
CA2091910A1 (en) 1994-01-07
TW230272B (Direct) 1994-09-11
ATE143529T1 (de) 1996-10-15
ES2092216T3 (es) 1996-11-16
CA2091910C (en) 1996-07-30
DE69305012D1 (de) 1996-10-31
US5249101A (en) 1993-09-28
EP0578307A2 (en) 1994-01-12
KR960015924B1 (ko) 1996-11-23
EP0578307A3 (en) 1994-08-24
CN1028937C (zh) 1995-06-14
KR940002031A (ko) 1994-02-16
JPH0697309A (ja) 1994-04-08
SG44362A1 (en) 1997-12-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee