DE69304130D1 - Verfahren zur Abscheidung eines ohmischen Kontaktes auf einer ZnSe-Schicht - Google Patents

Verfahren zur Abscheidung eines ohmischen Kontaktes auf einer ZnSe-Schicht

Info

Publication number
DE69304130D1
DE69304130D1 DE69304130T DE69304130T DE69304130D1 DE 69304130 D1 DE69304130 D1 DE 69304130D1 DE 69304130 T DE69304130 T DE 69304130T DE 69304130 T DE69304130 T DE 69304130T DE 69304130 D1 DE69304130 D1 DE 69304130D1
Authority
DE
Germany
Prior art keywords
deposition
ohmic contact
znse layer
znse
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69304130T
Other languages
English (en)
Other versions
DE69304130T2 (de
Inventor
Nikhil Taskar
Babar Khan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE69304130D1 publication Critical patent/DE69304130D1/de
Publication of DE69304130T2 publication Critical patent/DE69304130T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
    • H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
    • H01L21/441—Deposition of conductive or insulating materials for electrodes
    • H01L21/445—Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/28—Materials of the light emitting region containing only elements of Group II and Group VI of the Periodic Table

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Led Devices (AREA)
DE69304130T 1992-05-05 1993-05-04 Verfahren zur Abscheidung eines ohmischen Kontaktes auf einer ZnSe-Schicht Expired - Fee Related DE69304130T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/878,657 US5293074A (en) 1992-05-05 1992-05-05 Ohmic contact to p-type ZnSe

Publications (2)

Publication Number Publication Date
DE69304130D1 true DE69304130D1 (de) 1996-09-26
DE69304130T2 DE69304130T2 (de) 1997-02-20

Family

ID=25372523

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69304130T Expired - Fee Related DE69304130T2 (de) 1992-05-05 1993-05-04 Verfahren zur Abscheidung eines ohmischen Kontaktes auf einer ZnSe-Schicht

Country Status (4)

Country Link
US (2) US5293074A (de)
EP (1) EP0569094B1 (de)
JP (1) JP2522892B2 (de)
DE (1) DE69304130T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0552023B1 (de) * 1992-01-14 1997-04-02 Mitsubishi Chemical Corporation Elektroden-Struktur für Halbleiteranordnung
US5557146A (en) * 1993-07-14 1996-09-17 University Of South Florida Ohmic contact using binder paste with semiconductor material dispersed therein
JPH07263372A (ja) * 1994-03-24 1995-10-13 Sharp Corp Ｉｉ−ｖｉ族化合物半導体装置およびその製造方法
US5909632A (en) * 1997-09-25 1999-06-01 Midwest Research Institute Use of separate ZnTe interface layers to form OHMIC contacts to p-CdTe films
US6087725A (en) * 1997-09-29 2000-07-11 Matsushita Electric Industrial Co., Ltd. Low barrier ohmic contact for semiconductor light emitting device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4123295A (en) * 1977-01-14 1978-10-31 California Institute Of Technology Mercury chalcogenide contact for semiconductor devices
JPS5824149A (ja) * 1981-08-06 1983-02-14 Fuji Photo Film Co Ltd 平版印刷用感光材料
JPS63185077A (ja) * 1987-01-27 1988-07-30 Matsushita Electric Ind Co Ltd 青色発光ダイオ−ド
JPH01140663A (ja) * 1987-11-27 1989-06-01 Toshiba Corp 半導体装置の電極
JPH01187884A (ja) * 1988-01-22 1989-07-27 Toshiba Corp 電極形成法
JPH01313932A (ja) * 1988-06-14 1989-12-19 Toshiba Corp 電極形成法
JP2632975B2 (ja) * 1988-10-31 1997-07-23 日本電信電話株式会社 ｐ型ＺｎＳｅに対するオーミック電極形成法
US5150191A (en) * 1989-11-21 1992-09-22 Kabushiki Kaisha Toshiba P-type II-VI compound semiconductor doped
US5045897A (en) * 1990-03-14 1991-09-03 Santa Barbara Research Center Quaternary II-VI materials for photonics
US5274269A (en) * 1991-05-15 1993-12-28 Minnesota Mining And Manufacturing Company Ohmic contact for p-type group II-IV compound semiconductors

Also Published As

Publication number Publication date
JP2522892B2 (ja) 1996-08-07
US5399524A (en) 1995-03-21
DE69304130T2 (de) 1997-02-20
EP0569094A1 (de) 1993-11-10
US5293074A (en) 1994-03-08
JPH07283165A (ja) 1995-10-27
EP0569094B1 (de) 1996-08-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8339 Ceased/non-payment of the annual fee