DE69227920T2 - Verfahren und anordnung zur kontrollierten sprühätzung - Google Patents
Verfahren und anordnung zur kontrollierten sprühätzungInfo
- Publication number
- DE69227920T2 DE69227920T2 DE69227920T DE69227920T DE69227920T2 DE 69227920 T2 DE69227920 T2 DE 69227920T2 DE 69227920 T DE69227920 T DE 69227920T DE 69227920 T DE69227920 T DE 69227920T DE 69227920 T2 DE69227920 T2 DE 69227920T2
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- controlled spraying
- spraying
- controlled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/788,929 US5228949A (en) | 1991-11-07 | 1991-11-07 | Method and apparatus for controlled spray etching |
PCT/US1992/009313 WO1993009563A1 (en) | 1991-11-07 | 1992-10-30 | Method and apparatus for controlled spray etching |
Publications (3)
Publication Number | Publication Date |
---|---|
DE69227920D1 DE69227920D1 (de) | 1999-01-28 |
DE69227920T2 true DE69227920T2 (de) | 1999-05-12 |
DE69227920T3 DE69227920T3 (de) | 2002-10-31 |
Family
ID=25146033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69227920T Expired - Fee Related DE69227920T3 (de) | 1991-11-07 | 1992-10-30 | Verfahren und anordnung zur kontrollierten sprühätzung |
Country Status (7)
Country | Link |
---|---|
US (2) | US5228949A (de) |
EP (1) | EP0611483B2 (de) |
JP (1) | JP3124549B2 (de) |
KR (1) | KR100251034B1 (de) |
CA (1) | CA2123115A1 (de) |
DE (1) | DE69227920T3 (de) |
WO (1) | WO1993009563A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5228949A (en) * | 1991-11-07 | 1993-07-20 | Chemcut Corporation | Method and apparatus for controlled spray etching |
US5387313A (en) * | 1992-11-09 | 1995-02-07 | Bmc Industries, Inc. | Etchant control system |
JPH07231155A (ja) | 1994-02-16 | 1995-08-29 | Fujitsu Ltd | プリント配線板のエッチング装置及びエッチング方法 |
US5536388A (en) * | 1995-06-02 | 1996-07-16 | International Business Machines Corporation | Vertical electroetch tool nozzle and method |
US6187214B1 (en) | 1996-05-13 | 2001-02-13 | Universidad De Seville | Method and device for production of components for microfabrication |
TW579664B (en) * | 2000-01-11 | 2004-03-11 | Matsushita Electric Ind Co Ltd | Apparatus and method for manufacturing printed circuit board |
US6429385B1 (en) * | 2000-08-08 | 2002-08-06 | Micron Technology, Inc. | Non-continuous conductive layer for laminated substrates |
DE10154885A1 (de) * | 2001-11-05 | 2003-05-15 | Schmid Gmbh & Co Geb | Verfahren zur Behandlung von Gegenständen mittels einer Flüssigkeit |
KR100443373B1 (ko) * | 2001-12-28 | 2004-08-09 | 삼성전기주식회사 | 커버를 구비한 인쇄회로기판 분사용 노즐 |
US8402889B2 (en) * | 2004-02-03 | 2013-03-26 | Spellbinders Paper Arts Company, Llc | Apertured media embellishing template and system and method using same |
US7884028B2 (en) * | 2007-04-10 | 2011-02-08 | United Microelectronics Corp. | Method of removing material layer and remnant metal |
US8557328B2 (en) * | 2009-10-02 | 2013-10-15 | Ppg Industries Ohio, Inc. | Non-orthogonal coater geometry for improved coatings on a substrate |
CN102453915B (zh) * | 2010-10-27 | 2014-03-12 | 富葵精密组件(深圳)有限公司 | 蚀刻装置及使用该蚀刻装置蚀刻基板的方法 |
JP4975169B1 (ja) * | 2011-02-10 | 2012-07-11 | 株式会社Nsc | ガラス基板の製造方法及びその装置 |
US8951802B2 (en) * | 2011-09-19 | 2015-02-10 | The Singleton Corporation | Corrosion testing using an automated oscillating solution spray manifold |
JP5383769B2 (ja) * | 2011-10-13 | 2014-01-08 | 株式会社Nsc | 枚葉式化学研磨装置 |
JP5334216B2 (ja) * | 2011-10-28 | 2013-11-06 | 株式会社Nsc | ガラス基板の製造方法 |
JP5317304B2 (ja) * | 2012-01-31 | 2013-10-16 | 株式会社Nsc | 化学研磨装置 |
KR101386677B1 (ko) * | 2012-10-30 | 2014-04-29 | 삼성전기주식회사 | 미세회로 제조방법 |
CN103832965B (zh) | 2012-11-23 | 2017-02-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片刻蚀方法 |
JP6180232B2 (ja) * | 2013-08-22 | 2017-08-16 | 株式会社Jcu | エッチング装置用スプレー配管ユニット |
CN104091775B (zh) * | 2014-07-22 | 2017-02-15 | 深圳市华星光电技术有限公司 | 湿法刻蚀装置及其刻蚀方法 |
DE102017212887A1 (de) * | 2017-07-26 | 2019-01-31 | Gebr. Schmid Gmbh | Verfahren, Vorrichtung und Anlage zur Leiterplattenherstellung |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3756898A (en) * | 1969-07-14 | 1973-09-04 | Buckbee Mears Co | Resistant system suitable for controlling etching without the aid of an etchant |
US3808067A (en) * | 1972-11-24 | 1974-04-30 | Western Electric Co | Method of controlling an etching process |
JPS527340A (en) * | 1975-07-08 | 1977-01-20 | Tokyo Shibaura Electric Co | Etching method |
CH597363A5 (en) * | 1976-02-10 | 1978-03-31 | Engeler Walter Ag | Etching machine, esp. for offset printing plates prodn. |
US4126510A (en) * | 1977-10-06 | 1978-11-21 | Rca Corporation | Etching a succession of articles from a strip of sheet metal |
JPS55125276A (en) * | 1979-03-20 | 1980-09-26 | Matsushita Electric Ind Co Ltd | Controlling unit for etching |
IT1209218B (it) * | 1980-05-09 | 1989-07-16 | Sits Soc It Telecom Siemens | Piastra a circuito stampato adoppia faccia. |
US4397708A (en) * | 1980-09-25 | 1983-08-09 | Koltron Corporation | Etching and etchant removal apparatus |
JPS5976879A (ja) * | 1982-10-26 | 1984-05-02 | Hitachi Chem Co Ltd | エツチングマシン |
JPS5976878A (ja) * | 1982-10-26 | 1984-05-02 | Hitachi Chem Co Ltd | エツチングマシン |
DE3345125A1 (de) * | 1983-12-14 | 1985-06-27 | Hans 7033 Herrenberg Höllmüller | Vorrichtung zur behandlung von gegenstaenden mittels einer fluessigkeit |
DE3345124A1 (de) * | 1983-12-14 | 1985-06-27 | Hans 7033 Herrenberg Höllmüller | Vorrichtung zur behandlung von gegenstaenden mit einer behandlungsfluessigkeit |
DE3345206A1 (de) * | 1983-12-14 | 1985-06-27 | Hans 7033 Herrenberg Höllmüller | Vorrichtung zur behandlung von gegenstaenden mittels einer fluessigkeit |
DE3539874A1 (de) * | 1985-11-11 | 1987-05-14 | Hoellmueller Maschbau H | Anlage zum aetzen von zumindest teilweise aus metall, vorzugsweise kupfer, bestehendem aetzgut |
DE3539886A1 (de) * | 1985-11-11 | 1987-05-14 | Hoellmueller Maschbau H | Verfahren und vorrichtung zum aetzen eines zumindest teilweise aus metall, vorzugsweise kupfer, bestehenden aetzguts |
JPS62202087A (ja) * | 1986-02-28 | 1987-09-05 | Matsushita Electric Ind Co Ltd | エツチング方法 |
JPH01132780A (ja) * | 1987-11-18 | 1989-05-25 | Dainippon Screen Mfg Co Ltd | 基板の表面処理方法及び装置 |
JPH01205084A (ja) * | 1988-02-12 | 1989-08-17 | Toppan Printing Co Ltd | 腐蝕方法及び腐蝕装置 |
DE3820591A1 (de) * | 1988-06-16 | 1989-12-21 | Texas Instruments Deutschland | Vorrichtung zum nassaetzen von duennen filmen |
EP0354266B1 (de) * | 1988-08-12 | 1993-10-20 | International Business Machines Corporation | Verfahren und Vorrichtung zum Ätzen eines zumindest Teilweise aus Metall bestehenden Ätzguts |
JPH0290600A (ja) * | 1988-09-28 | 1990-03-30 | Hitachi Ltd | プリント基板表面処理装置 |
JPH02153081A (ja) * | 1988-12-05 | 1990-06-12 | Fuji Plant Kogyo Kk | エッチング方法および装置 |
US4985111A (en) * | 1990-03-02 | 1991-01-15 | Chemcut Corporation | Process and apparatus for intermittent fluid application |
US5228949A (en) * | 1991-11-07 | 1993-07-20 | Chemcut Corporation | Method and apparatus for controlled spray etching |
-
1991
- 1991-11-07 US US07/788,929 patent/US5228949A/en not_active Expired - Lifetime
-
1992
- 1992-10-30 EP EP92923362A patent/EP0611483B2/de not_active Expired - Lifetime
- 1992-10-30 DE DE69227920T patent/DE69227920T3/de not_active Expired - Fee Related
- 1992-10-30 JP JP05508614A patent/JP3124549B2/ja not_active Expired - Fee Related
- 1992-10-30 CA CA002123115A patent/CA2123115A1/en not_active Abandoned
- 1992-10-30 WO PCT/US1992/009313 patent/WO1993009563A1/en active IP Right Grant
- 1992-10-30 KR KR1019940701453A patent/KR100251034B1/ko not_active IP Right Cessation
-
1993
- 1993-05-12 US US08/060,759 patent/US5290384A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0611483A1 (de) | 1994-08-24 |
EP0611483B1 (de) | 1998-12-16 |
JP3124549B2 (ja) | 2001-01-15 |
EP0611483A4 (de) | 1995-05-03 |
DE69227920T3 (de) | 2002-10-31 |
CA2123115A1 (en) | 1993-05-13 |
WO1993009563A1 (en) | 1993-05-13 |
KR100251034B1 (ko) | 2000-04-15 |
JPH07500877A (ja) | 1995-01-26 |
US5290384A (en) | 1994-03-01 |
US5228949A (en) | 1993-07-20 |
EP0611483B2 (de) | 2002-06-19 |
DE69227920D1 (de) | 1999-01-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8366 | Restricted maintained after opposition proceedings | ||
8339 | Ceased/non-payment of the annual fee |