DE69226364T2 - Tantal- oder niobknetlegierung mit silikon, und einer verbindung als dotierungsmaterial - Google Patents

Tantal- oder niobknetlegierung mit silikon, und einer verbindung als dotierungsmaterial

Info

Publication number
DE69226364T2
DE69226364T2 DE69226364T DE69226364T DE69226364T2 DE 69226364 T2 DE69226364 T2 DE 69226364T2 DE 69226364 T DE69226364 T DE 69226364T DE 69226364 T DE69226364 T DE 69226364T DE 69226364 T2 DE69226364 T2 DE 69226364T2
Authority
DE
Germany
Prior art keywords
niobnet
tantalic
silicone
alloy
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69226364T
Other languages
English (en)
Other versions
DE69226364D1 (de
Inventor
Prabhat Kumar
Charles Mosheim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cabot Corp
Original Assignee
Cabot Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Corp filed Critical Cabot Corp
Application granted granted Critical
Publication of DE69226364D1 publication Critical patent/DE69226364D1/de
Publication of DE69226364T2 publication Critical patent/DE69226364T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02—Alloys based on vanadium, niobium, or tantalum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Ceramic Products (AREA)
  • Catalysts (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Liquid Crystal Substances (AREA)
  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
DE69226364T 1991-05-15 1992-05-15 Tantal- oder niobknetlegierung mit silikon, und einer verbindung als dotierungsmaterial Expired - Fee Related DE69226364T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/701,428 US5171379A (en) 1991-05-15 1991-05-15 Tantalum base alloys
PCT/US1992/004131 WO1992020828A1 (en) 1991-05-15 1992-05-15 Wrought tantalum or niobium alloy having silicon and a compound dopant

Publications (2)

Publication Number Publication Date
DE69226364D1 DE69226364D1 (de) 1998-08-27
DE69226364T2 true DE69226364T2 (de) 1998-11-26

Family

ID=24817332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69226364T Expired - Fee Related DE69226364T2 (de) 1991-05-15 1992-05-15 Tantal- oder niobknetlegierung mit silikon, und einer verbindung als dotierungsmaterial

Country Status (12)

Country Link
US (1) US5171379A (de)
EP (1) EP0591330B1 (de)
JP (1) JP2667293B2 (de)
KR (1) KR100236429B1 (de)
AT (1) ATE168726T1 (de)
AU (1) AU2141792A (de)
CZ (1) CZ290947B6 (de)
DE (1) DE69226364T2 (de)
HK (1) HK1012680A1 (de)
RU (1) RU2103408C1 (de)
SG (1) SG52570A1 (de)
WO (1) WO1992020828A1 (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411611A (en) * 1993-08-05 1995-05-02 Cabot Corporation Consumable electrode method for forming micro-alloyed products
US5699401A (en) * 1996-10-15 1997-12-16 General Electric Company Anode assembly for use in x-ray tubes, and related articles of manufacture
US5680282A (en) * 1996-10-24 1997-10-21 International Business Machine Corporation Getter layer lead structure for eliminating resistance increase phonomena and embrittlement and method for making the same
US5918104A (en) * 1997-12-24 1999-06-29 H.C. Starck, Inc. Production of tantalum-tungsten alloys production by powder metallurgy
US6576069B1 (en) * 1998-05-22 2003-06-10 Cabot Corporation Tantalum-silicon alloys and products containing the same and processes of making the same
US6323055B1 (en) * 1998-05-27 2001-11-27 The Alta Group, Inc. Tantalum sputtering target and method of manufacture
US6462934B2 (en) 1998-09-16 2002-10-08 Cabot Corporation Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides
US6391275B1 (en) 1998-09-16 2002-05-21 Cabot Corporation Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides
US6416730B1 (en) 1998-09-16 2002-07-09 Cabot Corporation Methods to partially reduce a niobium metal oxide oxygen reduced niobium oxides
TW479262B (en) * 1999-06-09 2002-03-11 Showa Denko Kk Electrode material for capacitor and capacitor using the same
US6358625B1 (en) * 1999-10-11 2002-03-19 H. C. Starck, Inc. Refractory metals with improved adhesion strength
US20040072009A1 (en) * 1999-12-16 2004-04-15 Segal Vladimir M. Copper sputtering targets and methods of forming copper sputtering targets
US6878250B1 (en) 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
JP3582437B2 (ja) * 1999-12-24 2004-10-27 株式会社村田製作所 薄膜製造方法及びそれに用いる薄膜製造装置
US7517417B2 (en) * 2000-02-02 2009-04-14 Honeywell International Inc. Tantalum PVD component producing methods
US6331233B1 (en) 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US6576099B2 (en) 2000-03-23 2003-06-10 Cabot Corporation Oxygen reduced niobium oxides
US20030227068A1 (en) * 2001-05-31 2003-12-11 Jianxing Li Sputtering target
DE10044450C1 (de) * 2000-09-08 2002-01-17 Epcos Ag Verfahren zur Herstellung einer Elektrode für Kondensatoren und zur Herstellung eines Kondensators
US6833058B1 (en) * 2000-10-24 2004-12-21 Honeywell International Inc. Titanium-based and zirconium-based mixed materials and sputtering targets
CN100477041C (zh) 2000-11-06 2009-04-08 卡伯特公司 改性氧还原电子管金属氧化物
JP2002217070A (ja) 2001-01-22 2002-08-02 Kawatetsu Mining Co Ltd ニオブ粉末及び固体電解コンデンサ用アノード
CA2458204C (en) * 2001-08-22 2009-11-10 Showa Denko K.K. Capacitor
US8562664B2 (en) * 2001-10-25 2013-10-22 Advanced Cardiovascular Systems, Inc. Manufacture of fine-grained material for use in medical devices
US20040123920A1 (en) * 2002-10-08 2004-07-01 Thomas Michael E. Homogenous solid solution alloys for sputter-deposited thin films
US7655214B2 (en) * 2003-02-26 2010-02-02 Cabot Corporation Phase formation of oxygen reduced valve metal oxides and granulation methods
US7445679B2 (en) * 2003-05-16 2008-11-04 Cabot Corporation Controlled oxygen addition for metal material
US7515397B2 (en) * 2003-05-19 2009-04-07 Cabot Corporation Methods of making a niobium metal oxide and oxygen reduced niobium oxides
DE102004011214A1 (de) * 2004-03-04 2005-10-06 W.C. Heraeus Gmbh Hochtemperaturbeständiger Niob-Draht
US8252126B2 (en) 2004-05-06 2012-08-28 Global Advanced Metals, Usa, Inc. Sputter targets and methods of forming same by rotary axial forging
US7666323B2 (en) 2004-06-09 2010-02-23 Veeco Instruments Inc. System and method for increasing the emissivity of a material
US7666243B2 (en) 2004-10-27 2010-02-23 H.C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
DE102005038551B3 (de) * 2005-08-12 2007-04-05 W.C. Heraeus Gmbh Draht und Gestell für einseitig gesockelte Lampen auf Basis von Niob oder Tantal sowie Herstellungsverfahren und Verwendung
US20070044873A1 (en) 2005-08-31 2007-03-01 H. C. Starck Inc. Fine grain niobium sheet via ingot metallurgy
US20070084527A1 (en) * 2005-10-19 2007-04-19 Stephane Ferrasse High-strength mechanical and structural components, and methods of making high-strength components
US20070251818A1 (en) * 2006-05-01 2007-11-01 Wuwen Yi Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets
CN101831583A (zh) * 2010-05-17 2010-09-15 宝鸡市众邦稀有金属材料有限公司 高延展性铌钇或钽钇合金板及制备工艺
US20120291699A1 (en) * 2011-02-11 2012-11-22 Matthew Fonte Crucibles made with the cold form process
US9771637B2 (en) 2014-12-09 2017-09-26 Ati Properties Llc Composite crucibles and methods of making and using the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE26122E (en) * 1966-12-06 Ductile niobium and tantalum alloys
US3268328A (en) * 1964-11-03 1966-08-23 Nat Res Corp Metallurgy
US3497402A (en) * 1966-02-03 1970-02-24 Nat Res Corp Stabilized grain-size tantalum alloy
US4062679A (en) * 1973-03-29 1977-12-13 Fansteel Inc. Embrittlement-resistant tantalum wire
JPS5352521A (en) * 1976-10-25 1978-05-13 Tokushiyu Muki Zairiyou Kenkiy Manufacture of heat resisting tenacious cermet
US4235629A (en) * 1977-10-17 1980-11-25 Fansteel Inc. Method for producing an embrittlement-resistant tantalum wire
US4859257A (en) * 1986-01-29 1989-08-22 Fansteel Inc. Fine grained embrittlement resistant tantalum wire
US4957541A (en) * 1988-11-01 1990-09-18 Nrc, Inc. Capacitor grade tantalum powder

Also Published As

Publication number Publication date
HK1012680A1 (en) 1999-08-06
JPH06507209A (ja) 1994-08-11
CZ242193A3 (en) 1994-06-15
DE69226364D1 (de) 1998-08-27
US5171379A (en) 1992-12-15
AU2141792A (en) 1992-12-30
EP0591330A4 (en) 1994-06-01
CZ290947B6 (cs) 2002-11-13
EP0591330B1 (de) 1998-07-22
KR100236429B1 (ko) 1999-12-15
JP2667293B2 (ja) 1997-10-27
RU2103408C1 (ru) 1998-01-27
SG52570A1 (en) 1998-09-28
WO1992020828A1 (en) 1992-11-26
EP0591330A1 (de) 1994-04-13
ATE168726T1 (de) 1998-08-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee