ATE178101T1 - Gold-ornament-material,gehaertet durch legieren mit minderen komponenten - Google Patents

Gold-ornament-material,gehaertet durch legieren mit minderen komponenten

Info

Publication number
ATE178101T1
ATE178101T1 AT94917168T AT94917168T ATE178101T1 AT E178101 T1 ATE178101 T1 AT E178101T1 AT 94917168 T AT94917168 T AT 94917168T AT 94917168 T AT94917168 T AT 94917168T AT E178101 T1 ATE178101 T1 AT E178101T1
Authority
AT
Austria
Prior art keywords
hardened
alloying
gold
minor components
gold ornament
Prior art date
Application number
AT94917168T
Other languages
English (en)
Inventor
Naoki Uchiyama
Toshinori Ishii
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Application granted granted Critical
Publication of ATE178101T1 publication Critical patent/ATE178101T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C27/00—Making jewellery or other personal adornments
    • A44C27/001—Materials for manufacturing jewellery
    • A44C27/002—Metallic materials
    • A44C27/003—Metallic alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Adornments (AREA)
AT94917168T 1993-09-06 1994-06-07 Gold-ornament-material,gehaertet durch legieren mit minderen komponenten ATE178101T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5245981A JP2780611B2 (ja) 1993-09-06 1993-09-06 少量成分の合金化で硬質化した金装飾品材

Publications (1)

Publication Number Publication Date
ATE178101T1 true ATE178101T1 (de) 1999-04-15

Family

ID=17141707

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94917168T ATE178101T1 (de) 1993-09-06 1994-06-07 Gold-ornament-material,gehaertet durch legieren mit minderen komponenten

Country Status (6)

Country Link
US (1) US6123786A (de)
EP (2) EP0882805A1 (de)
JP (1) JP2780611B2 (de)
AT (1) ATE178101T1 (de)
DE (1) DE69417404T2 (de)
WO (1) WO1995007367A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07316689A (ja) * 1994-05-19 1995-12-05 Ishifuku Metal Ind Co Ltd 高純度硬質金材料
DE69618944T2 (de) * 1995-04-07 2002-10-31 Kazuo Ogasa Verfahren zur Herstellung einer hochreinen Goldlegierung
JP3328135B2 (ja) * 1996-05-28 2002-09-24 田中電子工業株式会社 バンプ形成用金合金線及びバンプ形成方法
CN1085738C (zh) * 1996-06-12 2002-05-29 小笠和男 高纯度金合金及其制造方法
JP3382918B2 (ja) 2000-05-31 2003-03-04 田中電子工業株式会社 半導体素子接続用金線
JP2001049364A (ja) 2000-07-03 2001-02-20 Kazuo Ogasa 硬質貴金属合金部材とその製造方法
WO2002076669A1 (en) 2001-03-23 2002-10-03 Citizen Watch Co., Ltd. Brazing filler metal
JP4417115B2 (ja) * 2002-03-01 2010-02-17 和男 小笠 硬質金属合金部材とその製造方法
KR100618052B1 (ko) * 2003-04-14 2006-08-30 엠케이전자 주식회사 반도체 소자 본딩용 금 합금세선
US7258689B2 (en) 2003-05-19 2007-08-21 Matteo Tutino Silver alloys for use in medical, surgical and microsurgical instruments and process for producing the alloys
EP1811555A4 (de) * 2004-09-30 2012-06-20 Tanaka Electronics Ind Au-legierungs-bonddraht
US7713390B2 (en) * 2005-05-16 2010-05-11 Applied Materials, Inc. Ground shield for a PVD chamber
RU2528924C1 (ru) * 2013-12-12 2014-09-20 Юлия Алексеевна Щепочкина Ювелирный сплав
US9802233B2 (en) * 2014-05-01 2017-10-31 Praxair S. T. Technology, Inc. Gold evaporative sources with reduced contaminants and methods for making the same
CN106636721A (zh) * 2015-10-30 2017-05-10 深圳市周大福珠宝制造有限公司 黄金合金
EP3656245B1 (de) * 2018-11-26 2022-04-06 Richemont International S.A. Goldlegierung die mindestens 990 gewichtspromille gold enthält, uhr- oder schmuckartikel auf der basis einer goldlegierung die mindestens 990 gewichtspromille gold enthält, und legierungsherstellungsverfahren
JP7369241B1 (ja) * 2022-06-08 2023-10-25 田中電子工業株式会社 製鎖用金合金ワイヤ、その製造方法及び金合金チェーン

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE674933C (de) * 1934-08-17 1939-04-25 Heraeus Gmbh W C Beryllium-Gold-Legierungen
US3272625A (en) * 1965-10-18 1966-09-13 James Cohn Beryllium-gold alloy and article made therefrom
US3667937A (en) * 1970-10-07 1972-06-06 John A Williams Dental filling
JPS5310511B2 (de) * 1972-06-29 1978-04-14
JPS5282183A (en) * 1975-12-29 1977-07-09 Nec Corp Connecting wires for semiconductor devices
JPS5688328A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
JPS5688329A (en) * 1979-12-19 1981-07-17 Tanaka Denshi Kogyo Kk Gold wire for bonding semiconductor element and semiconductor element
US4330329A (en) * 1979-11-28 1982-05-18 Tanaka Denshi Kogyo Kabushiki Kaisha Gold bonding wire for semiconductor elements and the semiconductor element
JPS6026822B2 (ja) * 1981-07-17 1985-06-26 三菱マテリアル株式会社 高張力Ａｕ合金細線
DE3502914A1 (de) * 1985-01-29 1986-07-31 International Gold Corp. Ltd., Johannesburg Verwendung titanhaltiger goldlegierungen
US4775512A (en) * 1985-10-01 1988-10-04 Tanaka Denshi Kogyo Kabushiki Kaisha Gold line for bonding semiconductor element
JPH0819498B2 (ja) * 1986-06-07 1996-02-28 田中電子工業株式会社 半導体素子のボンデイング用金線
JP2613224B2 (ja) * 1987-09-29 1997-05-21 田中貴金属工業株式会社 金極細線用材料
JP2778093B2 (ja) * 1988-09-29 1998-07-23 三菱マテリアル株式会社 金バンプ用金合金細線
JPH02205641A (ja) * 1989-01-31 1990-08-15 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
DE59009704D1 (de) * 1989-02-09 1995-11-02 Hafner C Gmbh & Co Hochgoldhaltige Legierung für Schmuckzwecke.
JPH0719787B2 (ja) * 1989-02-20 1995-03-06 タツタ電線株式会社 ボンディング用金合金細線
GB2262747B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
GB2262746B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
GB2231336B (en) * 1989-04-28 1993-09-22 Tanaka Electronics Ind Gold wire for the bonding of a semiconductor device
JPH0678578B2 (ja) * 1989-06-16 1994-10-05 株式会社日本興業銀行 高純度金合金
JPH03130337A (ja) * 1989-10-16 1991-06-04 Tatsuta Electric Wire & Cable Co Ltd ボンディング用金合金細線
JP2814660B2 (ja) * 1990-03-06 1998-10-27 三菱マテリアル株式会社 半導体装置のボンディング用金合金線
JP3092927B2 (ja) * 1990-04-27 2000-09-25 田中電子工業株式会社 半導体素子のボンディング用金線
JP2826169B2 (ja) * 1990-05-02 1998-11-18 田中電子工業株式会社 バンプ電極用金線
JPH06179931A (ja) * 1992-12-15 1994-06-28 Mitsubishi Materials Corp Ａｕ含有量の高い硬質Ａｕ合金製装飾部材
JPH06264163A (ja) * 1993-03-15 1994-09-20 Tanaka Kikinzoku Kogyo Kk 装飾品用薄板圧印材
JP3395915B2 (ja) * 1993-07-12 2003-04-14 三菱マテリアル株式会社 少量成分の合金化で硬質化した金装飾品材

Also Published As

Publication number Publication date
DE69417404T2 (de) 1999-10-28
EP0685565B1 (de) 1999-03-24
EP0882805A1 (de) 1998-12-09
WO1995007367A1 (en) 1995-03-16
JP2780611B2 (ja) 1998-07-30
JPH0770671A (ja) 1995-03-14
EP0685565A4 (de) 1996-01-24
DE69417404D1 (de) 1999-04-29
EP0685565A1 (de) 1995-12-06
US6123786A (en) 2000-09-26

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties