DE69213134D1 - Apparatus und Verfahren zur Auswertung einer feinen Struktur - Google Patents
Apparatus und Verfahren zur Auswertung einer feinen StrukturInfo
- Publication number
- DE69213134D1 DE69213134D1 DE69213134T DE69213134T DE69213134D1 DE 69213134 D1 DE69213134 D1 DE 69213134D1 DE 69213134 T DE69213134 T DE 69213134T DE 69213134 T DE69213134 T DE 69213134T DE 69213134 D1 DE69213134 D1 DE 69213134D1
- Authority
- DE
- Germany
- Prior art keywords
- evaluating
- fine structure
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/028—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring lateral position of a boundary of the object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95676—Masks, reticles, shadow masks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95623—Inspecting patterns on the surface of objects using a spatial filtering method
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19586491 | 1991-07-09 | ||
JP27028191 | 1991-09-20 | ||
JP14856992A JP3323537B2 (ja) | 1991-07-09 | 1992-05-15 | 微細構造評価装置及び微細構造評価法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69213134D1 true DE69213134D1 (de) | 1996-10-02 |
DE69213134T2 DE69213134T2 (de) | 1997-01-30 |
Family
ID=27319579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69213134T Expired - Lifetime DE69213134T2 (de) | 1991-07-09 | 1992-06-30 | Apparatus und Verfahren zur Auswertung einer feinen Struktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US5270794A (de) |
EP (1) | EP0526982B1 (de) |
JP (1) | JP3323537B2 (de) |
DE (1) | DE69213134T2 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5610897A (en) * | 1992-08-31 | 1997-03-11 | Canon Kabushiki Kaisha | Optical information reproducing apparatus |
JPH0743313A (ja) * | 1993-07-29 | 1995-02-14 | Canon Inc | 異物検査装置及びそれを用いた半導体デバイスの 製造方法 |
JP3211538B2 (ja) * | 1994-01-13 | 2001-09-25 | キヤノン株式会社 | 検査装置及びそれを用いた半導体デバイスの製造方法 |
US6271916B1 (en) | 1994-03-24 | 2001-08-07 | Kla-Tencor Corporation | Process and assembly for non-destructive surface inspections |
JP3183046B2 (ja) * | 1994-06-06 | 2001-07-03 | キヤノン株式会社 | 異物検査装置及びそれを用いた半導体デバイスの製造方法 |
JPH0815169A (ja) * | 1994-06-28 | 1996-01-19 | Canon Inc | 異物検査装置及びそれを用いた半導体デバイスの製造 方法 |
US5633747A (en) * | 1994-12-21 | 1997-05-27 | Tencor Instruments | Variable spot-size scanning apparatus |
WO1997026529A1 (en) * | 1996-01-19 | 1997-07-24 | Phase Metrics | Surface inspection apparatus and method |
US6806477B1 (en) | 1997-05-23 | 2004-10-19 | Canon Kabushiki Kaisha | Position detection device, apparatus using the same, exposure apparatus, and device manufacturing method using the same |
EP0880078A3 (de) * | 1997-05-23 | 2001-02-14 | Canon Kabushiki Kaisha | Vorrichtung zur Detektion einer Position, Apparat unter Verwendung derselben, Belichtungsapparat, und Verfahren zur Herstellung einer Vorrichtung unter Verwendung desselben |
US7123357B2 (en) * | 1997-09-22 | 2006-10-17 | Candela Instruments | Method of detecting and classifying scratches and particles on thin film disks or wafers |
US6930765B2 (en) * | 2001-03-26 | 2005-08-16 | Kla-Tencor Technologies | Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer |
US7688435B2 (en) * | 1997-09-22 | 2010-03-30 | Kla-Tencor Corporation | Detecting and classifying surface features or defects by controlling the angle of the illumination plane of incidence with respect to the feature or defect |
US6909500B2 (en) * | 2001-03-26 | 2005-06-21 | Candela Instruments | Method of detecting and classifying scratches, particles and pits on thin film disks or wafers |
US6757056B1 (en) | 2001-03-26 | 2004-06-29 | Candela Instruments | Combined high speed optical profilometer and ellipsometer |
US7714995B2 (en) | 1997-09-22 | 2010-05-11 | Kla-Tencor Corporation | Material independent profiler |
US6897957B2 (en) | 2001-03-26 | 2005-05-24 | Candela Instruments | Material independent optical profilometer |
US6031615A (en) | 1997-09-22 | 2000-02-29 | Candela Instruments | System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness |
US6665078B1 (en) * | 1997-09-22 | 2003-12-16 | Candela Instruments | System and method for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern in thin film magnetic disks and silicon wafers |
US7630086B2 (en) * | 1997-09-22 | 2009-12-08 | Kla-Tencor Corporation | Surface finish roughness measurement |
US6483580B1 (en) | 1998-03-06 | 2002-11-19 | Kla-Tencor Technologies Corporation | Spectroscopic scatterometer system |
US6137570A (en) * | 1998-06-30 | 2000-10-24 | Kla-Tencor Corporation | System and method for analyzing topological features on a surface |
JP3311319B2 (ja) | 1998-10-02 | 2002-08-05 | キヤノン株式会社 | 光学ユニット、光学ユニットを用いた光学機器 |
US7061601B2 (en) * | 1999-07-02 | 2006-06-13 | Kla-Tencor Technologies Corporation | System and method for double sided optical inspection of thin film disks or wafers |
JP2001116529A (ja) * | 1999-10-15 | 2001-04-27 | Canon Inc | 異物検査装置及びそれを用いたデバイスの製造方法 |
JP4573419B2 (ja) * | 2000-10-10 | 2010-11-04 | 株式会社キーエンス | 非接触型外形測定装置 |
US6987568B2 (en) * | 2000-11-15 | 2006-01-17 | Rutgers, The State University Of New Jersey | Apparatus and method for measuring spatially varying bidirectional reflectance distribution function |
US6538730B2 (en) * | 2001-04-06 | 2003-03-25 | Kla-Tencor Technologies Corporation | Defect detection system |
US6882437B2 (en) * | 2002-04-19 | 2005-04-19 | Kla-Tencor Technologies | Method of detecting the thickness of thin film disks or wafers |
US7116413B2 (en) * | 2002-09-13 | 2006-10-03 | Kla-Tencor Corporation | Inspection system for integrated applications |
US7699236B2 (en) * | 2004-04-28 | 2010-04-20 | Rutgers The State University | Method and apparatus for making and detecting a document verification indicator using optical pattern encryption |
US7397621B2 (en) * | 2004-06-14 | 2008-07-08 | Kla-Tencor Technologies Corporation | Servo pattern characterization on magnetic disks |
US7075741B1 (en) | 2004-06-14 | 2006-07-11 | Kla Tencor Technologues Corporation | System and method for automatically determining magnetic eccentricity of a disk |
US7396022B1 (en) | 2004-09-28 | 2008-07-08 | Kla-Tencor Technologies Corp. | System and method for optimizing wafer flatness at high rotational speeds |
US7201799B1 (en) | 2004-11-24 | 2007-04-10 | Kla-Tencor Technologies Corporation | System and method for classifying, detecting, and counting micropipes |
US7684032B1 (en) | 2005-01-06 | 2010-03-23 | Kla-Tencor Corporation | Multi-wavelength system and method for detecting epitaxial layer defects |
US7515253B2 (en) * | 2005-01-12 | 2009-04-07 | Kla-Tencor Technologies Corporation | System for measuring a sample with a layer containing a periodic diffracting structure |
JP4609089B2 (ja) * | 2005-01-31 | 2011-01-12 | 凸版印刷株式会社 | 周期性パターンムラ検査装置および周期性パターン撮像方法 |
US7161669B2 (en) * | 2005-05-06 | 2007-01-09 | Kla- Tencor Technologies Corporation | Wafer edge inspection |
US7161667B2 (en) * | 2005-05-06 | 2007-01-09 | Kla-Tencor Technologies Corporation | Wafer edge inspection |
US7548308B2 (en) * | 2005-05-11 | 2009-06-16 | Kla-Tencor Corporation | Illumination energy management in surface inspection |
US20060256345A1 (en) * | 2005-05-12 | 2006-11-16 | Kla-Tencor Technologies Corp. | Interferometry measurement in disturbed environments |
US7505143B2 (en) * | 2005-05-17 | 2009-03-17 | Kla-Tencor Corporation | Dynamic reference plane compensation |
US7286229B1 (en) | 2005-09-06 | 2007-10-23 | Kla-Tencor Technologies Corporation | Detecting multi-domain states in perpendicular magnetic media |
US7295300B1 (en) | 2005-09-28 | 2007-11-13 | Kla-Tencor Technologies Corporation | Detecting surface pits |
US7397553B1 (en) | 2005-10-24 | 2008-07-08 | Kla-Tencor Technologies Corporation | Surface scanning |
JP5042494B2 (ja) * | 2005-12-22 | 2012-10-03 | インテル コーポレイション | 散乱光の角度分布を使ったマスクブランクの欠陥の検出および特性評価 |
JP2007192660A (ja) * | 2006-01-19 | 2007-08-02 | Fujifilm Corp | フイルムの表面欠陥検出方法及び検出機 |
US20100002326A1 (en) * | 2006-05-11 | 2010-01-07 | Ade Technologies, Inc. | Method and system for perpendicular magnetic media metrology |
US7554654B2 (en) * | 2007-01-26 | 2009-06-30 | Kla-Tencor Corporation | Surface characteristic analysis |
US7656519B2 (en) * | 2007-08-30 | 2010-02-02 | Kla-Tencor Corporation | Wafer edge inspection |
JP2009058360A (ja) * | 2007-08-31 | 2009-03-19 | Konica Minolta Sensing Inc | 表面状態測定装置 |
JP5593209B2 (ja) * | 2010-11-30 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | 検査装置 |
JP5686394B1 (ja) * | 2014-04-11 | 2015-03-18 | レーザーテック株式会社 | ペリクル検査装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS514784B1 (de) * | 1971-05-17 | 1976-02-14 | ||
DE3037622A1 (de) * | 1980-10-04 | 1982-04-22 | Theodor Prof. Dr.-Ing. 1000 Berlin Gast | Optoelektronisches messverfahren und einrichtungen zum bestimmen der oberflaechenguete streuend reflektierender oberflaechen |
FR2508160A1 (fr) * | 1981-06-23 | 1982-12-24 | Cilas | Dispositif pour determiner la position d'un objet |
JPS5963503A (ja) * | 1982-10-02 | 1984-04-11 | Canon Inc | マ−ク位置検出方法 |
DE3304780A1 (de) * | 1983-02-11 | 1984-08-30 | Rodenstock Optik G | Vorrichtung zur ermittlung einer oberflaechenstruktur, insbesondere der rauheit |
IT1198660B (it) * | 1983-08-02 | 1988-12-21 | Ottica Ist Naz | Profilometro ottico multifocale per dispersione |
US4632557A (en) * | 1985-01-23 | 1986-12-30 | Harris Corporation | Alignment target image enhancement for microlithography process |
JPS62118206A (ja) * | 1985-11-19 | 1987-05-29 | Nec Corp | パタ−ン寸法測定機 |
US4827141A (en) * | 1987-10-26 | 1989-05-02 | Hughes Aircraft Company | Subresolution element spatial measurement technique |
-
1992
- 1992-05-15 JP JP14856992A patent/JP3323537B2/ja not_active Expired - Fee Related
- 1992-06-29 US US07/905,409 patent/US5270794A/en not_active Expired - Lifetime
- 1992-06-30 DE DE69213134T patent/DE69213134T2/de not_active Expired - Lifetime
- 1992-06-30 EP EP92306053A patent/EP0526982B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5270794A (en) | 1993-12-14 |
DE69213134T2 (de) | 1997-01-30 |
JPH05209722A (ja) | 1993-08-20 |
EP0526982A1 (de) | 1993-02-10 |
EP0526982B1 (de) | 1996-08-28 |
JP3323537B2 (ja) | 2002-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |