DE69211354D1 - Polyimide mit niedrigem waermeausdehnungskoeffizienten und verbesserter dehnung - Google Patents

Polyimide mit niedrigem waermeausdehnungskoeffizienten und verbesserter dehnung

Info

Publication number
DE69211354D1
DE69211354D1 DE69211354T DE69211354T DE69211354D1 DE 69211354 D1 DE69211354 D1 DE 69211354D1 DE 69211354 T DE69211354 T DE 69211354T DE 69211354 T DE69211354 T DE 69211354T DE 69211354 D1 DE69211354 D1 DE 69211354D1
Authority
DE
Germany
Prior art keywords
polyimides
low thermal
improved
expansion
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69211354T
Other languages
English (en)
Other versions
DE69211354T2 (de
Inventor
Brian Auman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69211354D1 publication Critical patent/DE69211354D1/de
Publication of DE69211354T2 publication Critical patent/DE69211354T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
    • C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
    • C07D311/78—Ring systems having three or more relevant rings
    • C07D311/80—Dibenzopyrans; Hydrogenated dibenzopyrans
    • C07D311/82—Xanthenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE69211354T 1991-10-29 1992-10-26 Polyimide mit niedrigem waermeausdehnungskoeffizienten und verbesserter dehnung Expired - Fee Related DE69211354T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/784,353 US5260408A (en) 1991-10-29 1991-10-29 Low thermal expansion coefficient polyimides with improved elongation
PCT/US1992/008957 WO1993009163A1 (en) 1991-10-29 1992-10-26 Low thermal expansion coefficient polyimides with improved elongation

Publications (2)

Publication Number Publication Date
DE69211354D1 true DE69211354D1 (de) 1996-07-11
DE69211354T2 DE69211354T2 (de) 1996-11-28

Family

ID=25132189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69211354T Expired - Fee Related DE69211354T2 (de) 1991-10-29 1992-10-26 Polyimide mit niedrigem waermeausdehnungskoeffizienten und verbesserter dehnung

Country Status (5)

Country Link
US (1) US5260408A (de)
EP (1) EP0610385B1 (de)
JP (1) JP3247697B2 (de)
DE (1) DE69211354T2 (de)
WO (1) WO1993009163A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5449741A (en) * 1990-09-28 1995-09-12 Nippon Telegraph And Telephone Corporation Polyimide optical material
US5233018A (en) * 1990-09-28 1993-08-03 Nippon Telegraph And Telephone Corporation Perfluorinated polyimide, perfluorinated poly(amic acid), starting compounds therefor, and methods for preparing them
US5175367A (en) * 1991-08-27 1992-12-29 E. I. Du Pont De Nemours And Company Fluorine-containing diamines, polyamides, and polyimides
US5334697A (en) * 1993-10-04 1994-08-02 L'air Liquide, S.A. Polyimide gas separation membranes
US5731405A (en) * 1996-03-29 1998-03-24 Alliant Techsystems Inc. Process and materials for inducing pre-tilt in liquid crystals and liquid crystal displays
US6956098B2 (en) * 2002-09-20 2005-10-18 E. I. Du Pont De Nemours And Company High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
JP5673627B2 (ja) * 2012-08-03 2015-02-18 トヨタ自動車株式会社 半導体装置及びその製造方法
WO2014097633A1 (ja) * 2012-12-21 2014-06-26 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
WO2014097594A1 (ja) 2012-12-21 2014-06-26 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体樹脂組成物
TW201943798A (zh) * 2018-04-06 2019-11-16 美商杜邦股份有限公司 供使用於電子裝置之聚合物
TW202035366A (zh) * 2018-08-08 2020-10-01 美商杜邦電子股份有限公司 用於電子裝置中之聚合物
CN110317339B (zh) * 2019-07-31 2022-03-11 武汉柔显科技股份有限公司 聚酰亚胺前体、聚酰亚胺薄膜及包括该薄膜的显示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657700B2 (ja) * 1988-08-08 1997-09-24 日本電信電話株式会社 含フッ素ポリイミド光学材料
JP2744969B2 (ja) * 1988-08-26 1998-04-28 日本電信電話株式会社 含フッ素ポリイミド及びその製造方法
US5071997A (en) * 1989-07-20 1991-12-10 University Of Akron Polyimides comprising substituted benzidines
US5115090A (en) * 1990-03-30 1992-05-19 Sachdev Krishna G Viscosity stable, essentially gel-free polyamic acid compositions
US5051520A (en) * 1990-05-23 1991-09-24 E. I. Du Pont De Nemours And Company 9,9-bis(perfluroralkyl)xanthene, 9-aryl-9-perfluroralkylxanthene
US5097000A (en) * 1990-05-23 1992-03-17 E. I. Du Pont De Nemours And Company 9,9-bis (perfluoroalkyl) xanthene, 9-aryl-9-perfluoroalkylxanthene, monomers and polymers derived therefrom

Also Published As

Publication number Publication date
EP0610385B1 (de) 1996-06-05
DE69211354T2 (de) 1996-11-28
WO1993009163A1 (en) 1993-05-13
EP0610385A1 (de) 1994-08-17
US5260408A (en) 1993-11-09
JP3247697B2 (ja) 2002-01-21
JPH07500625A (ja) 1995-01-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee