DE69204673D1 - Mit feinen linienmustern metallisierte gewebe. - Google Patents

Mit feinen linienmustern metallisierte gewebe.

Info

Publication number
DE69204673D1
DE69204673D1 DE69204673T DE69204673T DE69204673D1 DE 69204673 D1 DE69204673 D1 DE 69204673D1 DE 69204673 T DE69204673 T DE 69204673T DE 69204673 T DE69204673 T DE 69204673T DE 69204673 D1 DE69204673 D1 DE 69204673D1
Authority
DE
Germany
Prior art keywords
metal
catalytic
devices
dimensional imaged
useful
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69204673T
Other languages
English (en)
Other versions
DE69204673T2 (de
Inventor
Albert Wayne Morgan
George Douglas Vaughn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amesbury Group Inc
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Publication of DE69204673D1 publication Critical patent/DE69204673D1/de
Application granted granted Critical
Publication of DE69204673T2 publication Critical patent/DE69204673T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • C23C18/30Activating or accelerating or sensitising with palladium or other noble metal
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28Sensitising or activating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00Fuel cells; Manufacture thereof
    • H01M8/10Fuel cells with solid electrolytes
    • H01M8/1004Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00Inking and printing with a printer's forme
    • B41M1/10Intaglio printing ; Gravure printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/006Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B41M7/009After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00Printing plates or foils; Materials therefor
    • B41N1/16Curved printing plates, especially cylinders
    • B41N1/20Curved printing plates, especially cylinders made of metal or similar inorganic compounds, e.g. plasma coated ceramics, carbides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/30Hydrogen technology
    • Y02E60/50Fuel cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/901Printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/249921Web or sheet containing structurally defined element or component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
DE69204673T 1991-06-07 1992-05-19 Mit feinen linienmustern metallisierte gewebe. Expired - Fee Related DE69204673T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/713,246 US5227223A (en) 1989-12-21 1991-06-07 Fabricating metal articles from printed images
PCT/US1992/004211 WO1992021790A1 (en) 1991-06-07 1992-05-19 Fabricating metal articles from printed images

Publications (2)

Publication Number Publication Date
DE69204673D1 true DE69204673D1 (de) 1995-10-12
DE69204673T2 DE69204673T2 (de) 1996-04-04

Family

ID=24865383

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69204673T Expired - Fee Related DE69204673T2 (de) 1991-06-07 1992-05-19 Mit feinen linienmustern metallisierte gewebe.

Country Status (10)

Country Link
US (2) US5227223A (de)
EP (1) EP0587725B1 (de)
JP (1) JPH06508181A (de)
KR (1) KR960015224B1 (de)
AT (1) ATE127537T1 (de)
AU (1) AU2143392A (de)
CA (1) CA2102405A1 (de)
DE (1) DE69204673T2 (de)
MX (1) MX9202707A (de)
WO (1) WO1992021790A1 (de)

Families Citing this family (61)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9404946D0 (en) * 1994-03-15 1994-04-27 Univ Singapore Process for selective metallization on insulating surfaces
JP3208526B2 (ja) * 1994-08-01 2001-09-17 キヤノン株式会社 導電性膜形成用材料、該材料を用いる導電性膜の形成方法、及び、該形成方法を用いる液晶配向膜の形成方法
GB9415780D0 (en) * 1994-08-04 1994-09-28 Portals Ltd A security thread, a film and a method of manufacture of a security thread
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
US5656081A (en) * 1995-06-07 1997-08-12 Img Group Limited Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid
WO1997014157A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
DE69715819D1 (de) * 1996-01-25 2002-10-31 Danionics As Odense S Elektrode/stromkollektor, laminate für eine elektrochemische vorrichtung
CA2238470A1 (en) * 1996-10-01 1998-04-09 National Label Company Apparatus and method for assembling electrochromic cells
TW340296B (en) * 1997-02-21 1998-09-11 Ricoh Microelectronics Kk Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate
GB9808524D0 (en) * 1998-04-23 1998-06-17 British Gas Plc Fuel cell flow-field structure formed by layer deposition
FR2782885B1 (fr) * 1998-08-25 2000-11-10 Gemplus Card Int Procede de fabrication d'une antenne pour un support d'informations comportant un circuit electronique
US6271793B1 (en) * 1999-11-05 2001-08-07 International Business Machines Corporation Radio frequency (RF) transponder (Tag) with composite antenna
EP1267360A4 (de) * 2000-02-21 2003-04-02 Toyo Ink Mfg Co Leitfähige paste des aktivenergie-strahlaushärtungs-typs, herstellungsverfahren und baustein für ein halbleiterschaltungssubstrat und nicht-kontakt-id und herstellungsverfahren dafür
US6488405B1 (en) * 2000-03-08 2002-12-03 Advanced Micro Devices, Inc. Flip chip defect analysis using liquid crystal
SG98017A1 (en) * 2000-12-19 2003-08-20 Inst Materials Research & Eng Method of forming selective electronics plating on polymer surfaces
IL140912A (en) * 2001-01-16 2004-12-15 Yissum Res Dev Co Forming a conductor circuit on a substrate
US6824857B2 (en) 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
WO2003036685A2 (en) * 2001-07-27 2003-05-01 Astropower, Inc. Method and apparatus for applying conductive ink onto semiconductor substrates
JP2003109609A (ja) 2001-09-27 2003-04-11 Honda Motor Co Ltd 燃料電池用電極の製造方法およびその装置
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
GB2381274A (en) * 2001-10-29 2003-04-30 Qinetiq Ltd High resolution patterning method
NL1019264C2 (nl) * 2001-10-31 2003-05-02 Stork Screens Bv Zeefdrukwerkwijze voor het vervaardigen van een elektrisch geleidende afbeelding op een substraat.
GB2382798A (en) * 2001-12-04 2003-06-11 Qinetiq Ltd Inkjet printer which deposits at least two fluids on a substrate such that the fluids react chemically to form a product thereon
WO2003054991A1 (en) * 2001-12-19 2003-07-03 Polyfuel, Inc. Printing of catalyst on the membrane of fuel cells
US6647883B1 (en) 2002-01-16 2003-11-18 The Procter & Gamble Company Process for contact printing with supply of release agent through a porous printing surface
EP1383364A3 (de) * 2002-05-23 2006-01-04 Nashua Corporation Schaltungselemente mit tintenaufnehmender Beschichtung und einer Leiterbahn und Verfahren zu deren Herstellung
US7566360B2 (en) * 2002-06-13 2009-07-28 Cima Nanotech Israel Ltd. Nano-powder-based coating and ink compositions
US6867983B2 (en) * 2002-08-07 2005-03-15 Avery Dennison Corporation Radio frequency identification device and method
US20060134318A1 (en) * 2003-01-28 2006-06-22 Alan Hudd Method of forming a conductive metal region on a substrate
EP1462746B1 (de) * 2003-03-26 2013-05-08 FUJIFILM Corporation Trocknungsverfahren und Trocknungsvorrichtung für eine Beschichtung
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
US20040200061A1 (en) 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7537799B2 (en) * 2003-07-11 2009-05-26 Hewlett-Packard Development Company, L.P. Methods of forming electrically conductive pathways using palladium aliphatic amine complexes
US20050006339A1 (en) * 2003-07-11 2005-01-13 Peter Mardilovich Electroless deposition methods and systems
EP1687461A2 (de) * 2003-10-29 2006-08-09 Conductive Inkjet Technology Limited Bildung von schichten auf einem substrat
US8435603B2 (en) 2003-12-05 2013-05-07 Conductive Inkjet Technology Limited Formation of solid layers on substrates
EP1689909B1 (de) * 2003-12-05 2017-10-11 CIT Technology Limited Ausbildung von festen schichten auf trägern
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US7255782B2 (en) * 2004-04-30 2007-08-14 Kenneth Crouse Selective catalytic activation of non-conductive substrates
US20080193667A1 (en) * 2004-08-23 2008-08-14 Arkady Garbar Ink Jet Printable Compositions
KR20070085253A (ko) * 2004-09-14 2007-08-27 시마 나노 테크 이스라엘 리미티드 잉크젯 인쇄가능한 조성물
WO2006035556A1 (ja) * 2004-09-27 2006-04-06 Murata Manufacturing Co., Ltd. 無電解めっき方法、およびめっき皮膜が形成された非導電性被めっき物
WO2006111450A1 (en) * 2005-04-20 2006-10-26 Agfa Graphics Nv Process for offset printing of a catalytic species via a hydrophilic phase
KR20080011206A (ko) * 2005-04-20 2008-01-31 아그파-게바에르트 무전해 침착 촉매 패턴의 접촉 인쇄공정
KR101388558B1 (ko) 2005-05-18 2014-04-23 컨덕티브 잉크젯 테크놀로지 리미티드 기판 상의 층 형성
US20070013600A1 (en) * 2005-07-14 2007-01-18 Centurion Wireless Technologies, Inc. Antenna radiators made from metalized plastic, composites, or fabrics
US20070040688A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
US20070040686A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
DE102005062028A1 (de) * 2005-12-22 2007-06-28 Basf Ag Verfahren zur Herstellung von metallisiertem textilem Flächengebilde, metallisiertes textiles Flächengebilde und Verwendung des so hergestellten metallisierten textilen Flächengebildes
CN101400999A (zh) * 2005-12-27 2009-04-01 拜尔保健有限公司 制备用于检测传感器的化学镀自动校准电路的方法
GB0619539D0 (en) 2006-10-04 2006-11-15 Hexcel Composites Ltd Curable resin films
KR20110046439A (ko) * 2008-07-24 2011-05-04 코비오 인코포레이티드 알루미늄 잉크 및 이의 제조 방법, 알루미늄 잉크 증착 방법 및 알루미늄 잉크의 인쇄 및/또는 증착에 의해 형성된 필름
CA2771421C (en) * 2009-09-10 2014-02-18 Nissan Motor Co., Ltd. Method for manufacturing gas diffusion layer for fuel cell, gas diffusion layer for fuel cell, and fuel cell
EP2880680A4 (de) * 2012-07-30 2016-11-16 Eastman Kodak Co Tintenformulierungen für flexodruck hochauflösender leitmuster
EP3360400A4 (de) * 2015-10-08 2019-02-27 Laird Technologies, Inc. Selektiv plattierte materialrollen und zugehörige verfahren
US10321560B2 (en) 2015-11-12 2019-06-11 Multek Technologies Limited Dummy core plus plating resist restrict resin process and structure
US20170238416A1 (en) 2016-02-17 2017-08-17 Multek Technologies Limited Dummy core restrict resin process and structure
US9999134B2 (en) 2016-03-14 2018-06-12 Multek Technologies Limited Self-decap cavity fabrication process and structure
US10064292B2 (en) * 2016-03-21 2018-08-28 Multek Technologies Limited Recessed cavity in printed circuit board protected by LPI
US11224117B1 (en) 2018-07-05 2022-01-11 Flex Ltd. Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger
US10619059B1 (en) * 2019-06-20 2020-04-14 Science Applications International Corporation Catalyst ink for three-dimensional conductive constructs

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB938365A (en) * 1959-01-08 1963-10-02 Photocircuits Corp Method of making printed circuits
US3745045A (en) * 1971-01-06 1973-07-10 R Brenneman Electrical contact surface using an ink containing a plating catalyst
DE2728465C2 (de) * 1977-06-24 1982-04-22 Preh, Elektrofeinmechanische Werke, Jakob Preh, Nachf. Gmbh & Co, 8740 Bad Neustadt Gedruckte Schaltung
US4322457A (en) * 1978-01-25 1982-03-30 Western Electric Co., Inc. Method of selectively depositing a metal on a surface
US4368281A (en) * 1980-09-15 1983-01-11 Amp Incorporated Printed circuits
DE3150985A1 (de) * 1981-12-23 1983-06-30 Bayer Ag, 5090 Leverkusen Verfahren zur aktivierung von substratoberflaechen fuer die stromlose metallisierung
JPS5938370A (ja) * 1982-08-27 1984-03-02 Toyobo Co Ltd 無電解銀めつき導体回路形成法
DE3326508A1 (de) * 1983-07-22 1985-02-07 Bayer Ag, 5090 Leverkusen Verfahren zum aktivieren von substratoberflaechen fuer die direkte partielle metallisierung von traegermaterialien
US4469714A (en) * 1983-09-02 1984-09-04 Okuno Chemical Industry Co., Ltd. Composition for bonding electroconductive metal coating to electrically nonconductive material
JPS60218477A (ja) * 1984-04-11 1985-11-01 インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション 無電解付着のための触媒化処理法
JPS6278179A (ja) * 1985-09-30 1987-04-10 三菱電機株式会社 セラミツク回路基板の無電解メツキ法
JPS63502041A (ja) * 1985-12-30 1988-08-11 ゼネラル・エレクトリック・カンパニイ 改良された増量置換法による導電体の形成法
US4670351A (en) * 1986-02-12 1987-06-02 General Electric Company Flexible printed circuits, prepared by augmentation replacement process
DE3625587A1 (de) * 1986-07-29 1988-02-04 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen
DE3627256A1 (de) * 1986-08-12 1988-02-18 Bayer Ag Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf kunststoffoberflaechen
WO1988002592A1 (en) * 1986-09-30 1988-04-07 Wilde Membran Impulstechnik Gmbh Electrically conductive structure with applied metallization
US4900618A (en) * 1986-11-07 1990-02-13 Monsanto Company Oxidation-resistant metal coatings
US4910072A (en) * 1986-11-07 1990-03-20 Monsanto Company Selective catalytic activation of polymeric films
JPS63270474A (ja) * 1986-12-10 1988-11-08 Minoru Tsuda 触媒性インク

Also Published As

Publication number Publication date
JPH06508181A (ja) 1994-09-14
CA2102405A1 (en) 1992-12-08
EP0587725B1 (de) 1995-09-06
ATE127537T1 (de) 1995-09-15
US5403649A (en) 1995-04-04
WO1992021790A1 (en) 1992-12-10
DE69204673T2 (de) 1996-04-04
AU2143392A (en) 1993-01-08
US5227223A (en) 1993-07-13
EP0587725A1 (de) 1994-03-23
KR960015224B1 (ko) 1996-11-04
MX9202707A (es) 1992-12-01

Similar Documents

Publication Publication Date Title
DE69204673D1 (de) Mit feinen linienmustern metallisierte gewebe.
Weng et al. Printing conducting polymers
ATE27013T1 (de) Metallisiertes gewebe.
CN102017818A (zh) 用于在平坦绝缘基底上形成导电图案的设备、方法、具有该导电图案的平坦绝缘基底和形成在该平坦绝缘基底上的芯片组
GB9016231D0 (en) A layered frequency selective surface assembly and method of modulating the power or frequency characteristics thereof
Fu et al. Conductive textiles
GB1420156A (en) Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit
Nikolova et al. Functional inks for inkjet printed sensors
JPS6484616A (en) Condenser
Gaspari et al. Nanostructured Materials for RFID Sensors
CN208567817U (zh) 触控膜加工用测试装置
DE3818170C1 (de)
KR20220048766A (ko) 고분자층을 포함하는 연성회로기판, 이의 제조 방법 및 이를 포함하는 전자 소자
Guo et al. Research on the conductivity of circuit on fabrics based on inkjet printing and electroless deposition technology
CN110103580B (zh) 一种用于印刷高分辨率微图案的印刷装置及印刷方法
CA2020606A1 (en) Resin molded articles for forming plated layer and use thereof
KR960702258A (ko) 직접적인 도금을 위해 전도성 플라스틱을 사용하는 프린트 배선판을 관통 도금하는 공정(process for throughplating printed circuit boards using conductive plastics for direct plating)
DE2120768A1 (de) Glasfaserverstärkte Konstruktionselemente, Leiterplatten oder dergleichen
Loi Inkjet printing: technique and applications for organic electronic devices
Wiklund et al. A review on recyclable printed electronics: Fabrication methods, inks, substrates, applications and environmental impacts
Azumi et al. Analysis of transient photocurrent in passivated iron electrode in neutral borate solution
Crahay et al. Elofoil, a new process for the production of iron foil
JPS648035A (en) Metal-laminated resin plate
CN111630119A (zh) 用于高电导率精细印刷的铜油墨
Kanda et al. Semiconductive Coordination Polymers: Dithiooxamides Copper Compounds

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AMESBURY GROUP, INC., AMESBURY, MASS., US

8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE HAUCK, GRAALFS, WEHNERT, DOERING, SIEMONS, 80336 MUENCHEN

8339 Ceased/non-payment of the annual fee