DE69204673T2 - Mit feinen linienmustern metallisierte gewebe. - Google Patents
Mit feinen linienmustern metallisierte gewebe.Info
- Publication number
- DE69204673T2 DE69204673T2 DE69204673T DE69204673T DE69204673T2 DE 69204673 T2 DE69204673 T2 DE 69204673T2 DE 69204673 T DE69204673 T DE 69204673T DE 69204673 T DE69204673 T DE 69204673T DE 69204673 T2 DE69204673 T2 DE 69204673T2
- Authority
- DE
- Germany
- Prior art keywords
- metal
- catalytic
- devices
- dimensional imaged
- useful
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/10—Fuel cells with solid electrolytes
- H01M8/1004—Fuel cells with solid electrolytes characterised by membrane-electrode assemblies [MEA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/16—Curved printing plates, especially cylinders
- B41N1/20—Curved printing plates, especially cylinders made of metal or similar inorganic compounds, e.g. plasma coated ceramics, carbides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/249921—Web or sheet containing structurally defined element or component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/713,246 US5227223A (en) | 1989-12-21 | 1991-06-07 | Fabricating metal articles from printed images |
PCT/US1992/004211 WO1992021790A1 (en) | 1991-06-07 | 1992-05-19 | Fabricating metal articles from printed images |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69204673D1 DE69204673D1 (de) | 1995-10-12 |
DE69204673T2 true DE69204673T2 (de) | 1996-04-04 |
Family
ID=24865383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69204673T Expired - Fee Related DE69204673T2 (de) | 1991-06-07 | 1992-05-19 | Mit feinen linienmustern metallisierte gewebe. |
Country Status (10)
Country | Link |
---|---|
US (2) | US5227223A (de) |
EP (1) | EP0587725B1 (de) |
JP (1) | JPH06508181A (de) |
KR (1) | KR960015224B1 (de) |
AT (1) | ATE127537T1 (de) |
AU (1) | AU2143392A (de) |
CA (1) | CA2102405A1 (de) |
DE (1) | DE69204673T2 (de) |
MX (1) | MX9202707A (de) |
WO (1) | WO1992021790A1 (de) |
Families Citing this family (61)
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GB9404946D0 (en) * | 1994-03-15 | 1994-04-27 | Univ Singapore | Process for selective metallization on insulating surfaces |
JP3208526B2 (ja) * | 1994-08-01 | 2001-09-17 | キヤノン株式会社 | 導電性膜形成用材料、該材料を用いる導電性膜の形成方法、及び、該形成方法を用いる液晶配向膜の形成方法 |
GB9415780D0 (en) * | 1994-08-04 | 1994-09-28 | Portals Ltd | A security thread, a film and a method of manufacture of a security thread |
US5656081A (en) * | 1995-06-07 | 1997-08-12 | Img Group Limited | Press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid |
US5758575A (en) * | 1995-06-07 | 1998-06-02 | Bemis Company Inc. | Apparatus for printing an electrical circuit component with print cells in liquid communication |
EP0857348A4 (de) * | 1995-10-07 | 2000-07-05 | Bemis Co Inc | Mit einer auf einem substrat gedruckten leitfähigen flüssigkeit hergestelltes bauteil für elektrische schaltungen |
EP0876683B1 (de) | 1996-01-25 | 2002-09-25 | Danionics A/S | Elektrode/stromkollektor, laminate für eine elektrochemische vorrichtung |
AU4669897A (en) * | 1996-10-01 | 1998-04-24 | National Label Company | Apparatus and method for assembling electrochromic cells |
TW340296B (en) * | 1997-02-21 | 1998-09-11 | Ricoh Microelectronics Kk | Method and apparatus of concave plate printing, method and apparatus for formation of wiring diagram, the contact electrode and the printed wiring nickel substrate |
GB9808524D0 (en) * | 1998-04-23 | 1998-06-17 | British Gas Plc | Fuel cell flow-field structure formed by layer deposition |
FR2782885B1 (fr) * | 1998-08-25 | 2000-11-10 | Gemplus Card Int | Procede de fabrication d'une antenne pour un support d'informations comportant un circuit electronique |
US6271793B1 (en) * | 1999-11-05 | 2001-08-07 | International Business Machines Corporation | Radio frequency (RF) transponder (Tag) with composite antenna |
EP1267360A4 (de) * | 2000-02-21 | 2003-04-02 | Toyo Ink Mfg Co | Leitfähige paste des aktivenergie-strahlaushärtungs-typs, herstellungsverfahren und baustein für ein halbleiterschaltungssubstrat und nicht-kontakt-id und herstellungsverfahren dafür |
US6488405B1 (en) * | 2000-03-08 | 2002-12-03 | Advanced Micro Devices, Inc. | Flip chip defect analysis using liquid crystal |
SG98017A1 (en) * | 2000-12-19 | 2003-08-20 | Inst Materials Research & Eng | Method of forming selective electronics plating on polymer surfaces |
IL140912A (en) * | 2001-01-16 | 2004-12-15 | Yissum Res Dev Co | Forming a conductor circuit on a substrate |
WO2002080637A1 (en) | 2001-04-02 | 2002-10-10 | Nashua Corporation | Circuit elements having an embedded conductive trace and methods of manufacture |
WO2003036685A2 (en) * | 2001-07-27 | 2003-05-01 | Astropower, Inc. | Method and apparatus for applying conductive ink onto semiconductor substrates |
JP2003109609A (ja) * | 2001-09-27 | 2003-04-11 | Honda Motor Co Ltd | 燃料電池用電極の製造方法およびその装置 |
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GB2381274A (en) * | 2001-10-29 | 2003-04-30 | Qinetiq Ltd | High resolution patterning method |
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TWI256168B (en) * | 2001-12-19 | 2006-06-01 | Polyfuel Inc | Printing of catalyst on the membrane of fuel cells |
US6647883B1 (en) | 2002-01-16 | 2003-11-18 | The Procter & Gamble Company | Process for contact printing with supply of release agent through a porous printing surface |
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US7566360B2 (en) * | 2002-06-13 | 2009-07-28 | Cima Nanotech Israel Ltd. | Nano-powder-based coating and ink compositions |
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EP1590500A2 (de) * | 2003-01-28 | 2005-11-02 | Conductive Inkjet Technology Limited | Verfahren zum formen einer leitfähigen metallischen region auf einem substrat |
EP2610568A1 (de) * | 2003-03-26 | 2013-07-03 | Fujifilm Corporation | Trockenverfahren für eine Beschichtung |
US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
US20040200061A1 (en) | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
US20050006339A1 (en) * | 2003-07-11 | 2005-01-13 | Peter Mardilovich | Electroless deposition methods and systems |
US7537799B2 (en) * | 2003-07-11 | 2009-05-26 | Hewlett-Packard Development Company, L.P. | Methods of forming electrically conductive pathways using palladium aliphatic amine complexes |
EP1687461A2 (de) * | 2003-10-29 | 2006-08-09 | Conductive Inkjet Technology Limited | Bildung von schichten auf einem substrat |
US8435603B2 (en) | 2003-12-05 | 2013-05-07 | Conductive Inkjet Technology Limited | Formation of solid layers on substrates |
KR101178334B1 (ko) * | 2003-12-05 | 2012-08-29 | 컨덕티브 잉크젯 테크놀로지 리미티드 | 기판 상의 고체층 형성 방법 |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US20050241951A1 (en) * | 2004-04-30 | 2005-11-03 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US20080193667A1 (en) * | 2004-08-23 | 2008-08-14 | Arkady Garbar | Ink Jet Printable Compositions |
EP1805770A4 (de) * | 2004-09-14 | 2008-08-27 | Cima Nano Tech Israel Ltd | Inkjet-bedruckbare zusammensetzungen |
KR100760254B1 (ko) * | 2004-09-27 | 2007-09-19 | 가부시키가이샤 무라타 세이사쿠쇼 | 무전해 도금방법, 및 도금피막이 형성된 비도전성 피도금물 |
JP2008538335A (ja) * | 2005-04-20 | 2008-10-23 | アグフア−ゲヴエルト | 無電解沈着触媒のパターンの接触印刷方法 |
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US20070040688A1 (en) * | 2005-08-16 | 2007-02-22 | X-Cyte, Inc., A California Corporation | RFID inlays and methods of their manufacture |
US20070040686A1 (en) * | 2005-08-16 | 2007-02-22 | X-Cyte, Inc., A California Corporation | RFID inlays and methods of their manufacture |
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RU2008130871A (ru) * | 2005-12-27 | 2010-02-10 | Байер Хелткэр Ллк (Us) | Способ создания автокалибровочных контуров для тестовых датчиков с нанесением покрытия методом химического восстановления |
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US20100022078A1 (en) * | 2008-07-24 | 2010-01-28 | Joerg Rockenberger | Aluminum Inks and Methods of Making the Same, Methods for Depositing Aluminum Inks, and Films Formed by Printing and/or Depositing an Aluminum Ink |
CN102484257B (zh) * | 2009-09-10 | 2015-01-07 | 日产自动车株式会社 | 燃料电池用气体扩散层的制造方法、燃料电池用气体扩散层和燃料电池 |
JP6161699B2 (ja) * | 2012-07-30 | 2017-07-12 | イーストマン コダック カンパニー | 高精細導電性パターンのフレキソ印刷向けのインク組成 |
WO2017062173A1 (en) * | 2015-10-08 | 2017-04-13 | Laird Technologies, (Shenzhen) Ltd. | Selectively plated rolls of materials and related methods |
US10321560B2 (en) | 2015-11-12 | 2019-06-11 | Multek Technologies Limited | Dummy core plus plating resist restrict resin process and structure |
US20170238416A1 (en) | 2016-02-17 | 2017-08-17 | Multek Technologies Limited | Dummy core restrict resin process and structure |
US9999134B2 (en) | 2016-03-14 | 2018-06-12 | Multek Technologies Limited | Self-decap cavity fabrication process and structure |
US10064292B2 (en) * | 2016-03-21 | 2018-08-28 | Multek Technologies Limited | Recessed cavity in printed circuit board protected by LPI |
US11224117B1 (en) | 2018-07-05 | 2022-01-11 | Flex Ltd. | Heat transfer in the printed circuit board of an SMPS by an integrated heat exchanger |
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US4910072A (en) * | 1986-11-07 | 1990-03-20 | Monsanto Company | Selective catalytic activation of polymeric films |
US4900618A (en) * | 1986-11-07 | 1990-02-13 | Monsanto Company | Oxidation-resistant metal coatings |
JPS63270474A (ja) * | 1986-12-10 | 1988-11-08 | Minoru Tsuda | 触媒性インク |
-
1991
- 1991-06-07 US US07/713,246 patent/US5227223A/en not_active Expired - Lifetime
-
1992
- 1992-05-19 KR KR1019930703654A patent/KR960015224B1/ko not_active IP Right Cessation
- 1992-05-19 DE DE69204673T patent/DE69204673T2/de not_active Expired - Fee Related
- 1992-05-19 JP JP5500452A patent/JPH06508181A/ja active Pending
- 1992-05-19 EP EP92912636A patent/EP0587725B1/de not_active Expired - Lifetime
- 1992-05-19 CA CA002102405A patent/CA2102405A1/en not_active Abandoned
- 1992-05-19 AU AU21433/92A patent/AU2143392A/en not_active Abandoned
- 1992-05-19 WO PCT/US1992/004211 patent/WO1992021790A1/en active IP Right Grant
- 1992-05-19 AT AT92912636T patent/ATE127537T1/de not_active IP Right Cessation
- 1992-06-05 MX MX9202707A patent/MX9202707A/es unknown
-
1993
- 1993-07-13 US US08/091,145 patent/US5403649A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69204673D1 (de) | 1995-10-12 |
AU2143392A (en) | 1993-01-08 |
WO1992021790A1 (en) | 1992-12-10 |
EP0587725A1 (de) | 1994-03-23 |
EP0587725B1 (de) | 1995-09-06 |
US5403649A (en) | 1995-04-04 |
KR960015224B1 (ko) | 1996-11-04 |
MX9202707A (es) | 1992-12-01 |
CA2102405A1 (en) | 1992-12-08 |
JPH06508181A (ja) | 1994-09-14 |
US5227223A (en) | 1993-07-13 |
ATE127537T1 (de) | 1995-09-15 |
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