DE69128745T2 - Verfahren zum bearbeiten eines beschichteten bleches - Google Patents
Verfahren zum bearbeiten eines beschichteten blechesInfo
- Publication number
- DE69128745T2 DE69128745T2 DE69128745T DE69128745T DE69128745T2 DE 69128745 T2 DE69128745 T2 DE 69128745T2 DE 69128745 T DE69128745 T DE 69128745T DE 69128745 T DE69128745 T DE 69128745T DE 69128745 T2 DE69128745 T2 DE 69128745T2
- Authority
- DE
- Germany
- Prior art keywords
- metal foil
- plated material
- metal
- hole
- strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 68
- 238000012545 processing Methods 0.000 title description 28
- 239000000463 material Substances 0.000 claims description 280
- 239000002184 metal Substances 0.000 claims description 182
- 229910052751 metal Inorganic materials 0.000 claims description 182
- 239000011888 foil Substances 0.000 claims description 141
- 238000012937 correction Methods 0.000 claims description 25
- 238000005520 cutting process Methods 0.000 claims description 25
- 238000011144 upstream manufacturing Methods 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 18
- 230000008569 process Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 11
- 238000005553 drilling Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 5
- 230000002596 correlated effect Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 4
- 230000036961 partial effect Effects 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 235000014676 Phragmites communis Nutrition 0.000 description 11
- 230000032258 transport Effects 0.000 description 11
- 230000000875 corresponding effect Effects 0.000 description 5
- 230000001186 cumulative effect Effects 0.000 description 5
- 238000003490 calendering Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000012840 feeding operation Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49828—Progressively advancing of work assembly station or assembled portion of work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53348—Running-length work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
- Y10T29/53383—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together
- Y10T29/53396—Means to interrelatedly feed plural work parts from plural sources without manual intervention and means to fasten work parts together by friction fit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025272A JP2562505B2 (ja) | 1990-02-06 | 1990-02-06 | 加工用基準穴位置調整方法 |
| JP2025273A JP2562506B2 (ja) | 1990-02-06 | 1990-02-06 | 帯材の加工方法 |
| JP2527190A JPH0818148B2 (ja) | 1990-02-06 | 1990-02-06 | スポット状部分クラッド材の製造方法およびその装置 |
| PCT/JP1991/000141 WO1991012109A1 (fr) | 1990-02-06 | 1991-02-06 | Procede et dispositif pour usiner une tole plaquee |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69128745D1 DE69128745D1 (de) | 1998-02-26 |
| DE69128745T2 true DE69128745T2 (de) | 1998-06-18 |
Family
ID=27284964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69128745T Expired - Fee Related DE69128745T2 (de) | 1990-02-06 | 1991-02-06 | Verfahren zum bearbeiten eines beschichteten bleches |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5295296A (enExample) |
| EP (1) | EP0466931B1 (enExample) |
| KR (1) | KR100219695B1 (enExample) |
| DE (1) | DE69128745T2 (enExample) |
| WO (1) | WO1991012109A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1007866A3 (nl) * | 1993-12-10 | 1995-11-07 | Koninkl Philips Electronics Nv | Werkwijze voor het plaatsen van een onderdeel op een strookvormige drager alsmede inrichting voor het plaatsen van een onderdeel op een strookvormige drager. |
| US6088901A (en) * | 1997-06-10 | 2000-07-18 | Siemens Aktiengesellschaft | Method for producing a carrier element for semiconductor chips |
| RU2135364C1 (ru) * | 1998-05-13 | 1999-08-27 | Ситников Игорь Викторович | Способ изготовления слоистых металлических материалов |
| JP2000343144A (ja) * | 1999-06-04 | 2000-12-12 | Denso Corp | プレス成形品の製造方法 |
| US7398593B2 (en) * | 2000-09-01 | 2008-07-15 | Showa Denko K.K. | Apparatus for producing capacitor element member |
| KR100465848B1 (ko) * | 2003-05-07 | 2005-01-13 | 김병식 | 알루미늄 하니컴 복합 판넬의 연속적 제조 시스템 |
| JP4522366B2 (ja) * | 2003-06-10 | 2010-08-11 | 株式会社 ベアック | 穿孔装置 |
| CN102441602A (zh) * | 2011-09-23 | 2012-05-09 | 铜陵三佳山田科技有限公司 | 一种大规模集成电路冲流道模具定位装置 |
| WO2016199302A1 (ja) * | 2015-06-12 | 2016-12-15 | 株式会社牧野フライス製作所 | 細穴放電加工機 |
| KR101905694B1 (ko) * | 2018-03-15 | 2018-11-30 | 김완선 | 판재가공장치 및 판재가공방법 |
| US11701736B2 (en) | 2021-09-30 | 2023-07-18 | Wiegel Tool Works, Inc. | Systems and methods for making a composite thickness metal part |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3559285A (en) * | 1968-01-08 | 1971-02-02 | Jade Corp | Method of forming leads for attachment to semi-conductor devices |
| US3931922A (en) * | 1972-01-29 | 1976-01-13 | Ferranti, Limited | Apparatus for mounting semiconductor devices |
| US3968563A (en) * | 1975-03-27 | 1976-07-13 | E. I. Du Pont De Nemours And Company | Precision registration system for leads |
| JPS5530859A (en) * | 1978-08-25 | 1980-03-04 | Nitto Electric Ind Co Ltd | Method of making carrier tape for ic |
| US4458413A (en) * | 1981-01-26 | 1984-07-10 | Olin Corporation | Process for forming multi-gauge strip |
| JPS57176128U (enExample) * | 1981-04-30 | 1982-11-08 | ||
| JPS59141389A (ja) * | 1983-02-01 | 1984-08-14 | Hitachi Cable Ltd | 部分クラツド材の製造方法 |
| JPS6087938A (ja) * | 1983-10-19 | 1985-05-17 | Rhythm Watch Co Ltd | 薄板の加工方法 |
| JPS60227456A (ja) * | 1984-04-26 | 1985-11-12 | Nec Corp | 半導体装置用リ−ドフレ−ム |
| JPS6120361A (ja) * | 1984-07-09 | 1986-01-29 | Shinko Electric Ind Co Ltd | 半導体装置用リ−ドフレ−ムの製造方法 |
| JPS61167248U (enExample) * | 1985-04-02 | 1986-10-17 | ||
| JPS60242632A (ja) * | 1985-05-07 | 1985-12-02 | Sanyo Electric Co Ltd | 集積回路の多量製造方法 |
| JPS6371926U (enExample) * | 1986-10-30 | 1988-05-13 | ||
| US4980219A (en) * | 1988-04-06 | 1990-12-25 | Casio Computer Co., Ltd. | Carrier tape for bonding IC devices and method of using the same |
| JPH01317633A (ja) * | 1988-06-17 | 1989-12-22 | Toshiba Corp | プレス装置 |
-
1991
- 1991-02-06 EP EP91903587A patent/EP0466931B1/en not_active Expired - Lifetime
- 1991-02-06 DE DE69128745T patent/DE69128745T2/de not_active Expired - Fee Related
- 1991-02-06 WO PCT/JP1991/000141 patent/WO1991012109A1/ja not_active Ceased
- 1991-02-06 US US07/768,278 patent/US5295296A/en not_active Expired - Fee Related
- 1991-10-05 KR KR1019910701258A patent/KR100219695B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE69128745D1 (de) | 1998-02-26 |
| US5295296A (en) | 1994-03-22 |
| KR100219695B1 (ko) | 1999-09-01 |
| KR920700836A (ko) | 1992-08-10 |
| EP0466931A1 (en) | 1992-01-22 |
| WO1991012109A1 (fr) | 1991-08-22 |
| EP0466931B1 (en) | 1998-01-21 |
| EP0466931A4 (enExample) | 1994-01-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |