DE69127952D1 - III-V Verbindungs-Halbleiter-Vorrichtung, Drucker- und Anzeigevorrichtung unter Verwendung derselben, und Verfahren zur Herstellung dieser Vorrichtung - Google Patents

III-V Verbindungs-Halbleiter-Vorrichtung, Drucker- und Anzeigevorrichtung unter Verwendung derselben, und Verfahren zur Herstellung dieser Vorrichtung

Info

Publication number
DE69127952D1
DE69127952D1 DE69127952T DE69127952T DE69127952D1 DE 69127952 D1 DE69127952 D1 DE 69127952D1 DE 69127952 T DE69127952 T DE 69127952T DE 69127952 T DE69127952 T DE 69127952T DE 69127952 D1 DE69127952 D1 DE 69127952D1
Authority
DE
Germany
Prior art keywords
iii
compound semiconductor
printer
manufacturing
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69127952T
Other languages
English (en)
Other versions
DE69127952T2 (de
Inventor
Hiroyuki Tokunaga
Hideshi Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2316256A external-priority patent/JPH04186780A/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69127952D1 publication Critical patent/DE69127952D1/de
Application granted granted Critical
Publication of DE69127952T2 publication Critical patent/DE69127952T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/18—Epitaxial-layer growth characterised by the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02543—Phosphides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02538—Group 13/15 materials
    • H01L21/02546—Arsenides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE69127952T 1990-11-07 1991-11-06 III-V Verbindungs-Halbleiter-Vorrichtung, Drucker- und Anzeigevorrichtung unter Verwendung derselben, und Verfahren zur Herstellung dieser Vorrichtung Expired - Fee Related DE69127952T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30339490 1990-11-07
JP2316256A JPH04186780A (ja) 1990-11-20 1990-11-20 半導体素子およびその製造方法

Publications (2)

Publication Number Publication Date
DE69127952D1 true DE69127952D1 (de) 1997-11-20
DE69127952T2 DE69127952T2 (de) 1998-03-05

Family

ID=26563503

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69127952T Expired - Fee Related DE69127952T2 (de) 1990-11-07 1991-11-06 III-V Verbindungs-Halbleiter-Vorrichtung, Drucker- und Anzeigevorrichtung unter Verwendung derselben, und Verfahren zur Herstellung dieser Vorrichtung

Country Status (4)

Country Link
US (1) US5659184A (de)
EP (1) EP0484922B1 (de)
AT (1) ATE159302T1 (de)
DE (1) DE69127952T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE150213T1 (de) * 1991-05-23 1997-03-15 Canon Kk Lichtemittierende vorrichtung, optischer druckkopf mit solcher vorrichtung, und optischer drucker mit solchem druckkopf
US5907768A (en) * 1996-08-16 1999-05-25 Kobe Steel Usa Inc. Methods for fabricating microelectronic structures including semiconductor islands
US5955776A (en) * 1996-12-04 1999-09-21 Ball Semiconductor, Inc. Spherical shaped semiconductor integrated circuit
EP0996173B1 (de) * 1998-10-23 2015-12-30 Xerox Corporation Halbleiterstrukturen mit polykristallinen GaN-Schichten und Herstellungsverfahren
US6498643B1 (en) 2000-11-13 2002-12-24 Ball Semiconductor, Inc. Spherical surface inspection system
JP4310076B2 (ja) * 2001-05-31 2009-08-05 キヤノン株式会社 結晶性薄膜の製造方法
DE10335081A1 (de) * 2003-07-31 2005-03-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoeleketronischer Halbleiterchip
DE10335080A1 (de) * 2003-07-31 2005-03-03 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Vielzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
JP4502382B2 (ja) * 2004-11-02 2010-07-14 キヤノン株式会社 有機トランジスタ
JP2006245238A (ja) * 2005-03-02 2006-09-14 Canon Inc スルーホールの形成方法および電子回路の製造方法
US9012253B2 (en) * 2009-12-16 2015-04-21 Micron Technology, Inc. Gallium nitride wafer substrate for solid state lighting devices, and associated systems and methods
EP2801786B1 (de) * 2013-05-08 2019-01-02 Sick AG Optoelektronischer Sensor und Verfahren zur Erkennung von Objektkanten
WO2018236356A1 (en) * 2017-06-20 2018-12-27 Intel Corporation FERROELECTRIC FIELD EFFECT TRANSISTORS (FEFET) HAVING COMPOUND SEMICONDUCTOR CHANNELS
US11640995B2 (en) 2017-06-20 2023-05-02 Intel Corporation Ferroelectric field effect transistors (FeFETs) having band-engineered interface layer
CN110767668B (zh) * 2019-12-30 2020-03-27 杭州美迪凯光电科技股份有限公司 含纳米级表面的clcc封装体盖板、封装体和摄像模组
CN110992853B (zh) * 2019-11-19 2021-03-12 西安交通大学 一种发光水晶字的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048384A (ja) * 1983-08-26 1985-03-16 Ricoh Co Ltd Ｌｅｄアレイヘツド
US4657603A (en) * 1984-10-10 1987-04-14 Siemens Aktiengesellschaft Method for the manufacture of gallium arsenide thin film solar cells
DE3723222A1 (de) * 1986-07-16 1988-02-11 Mitsubishi Cable Ind Ltd Material fuer ein lichtemittierendes element und verfahren zur zuechtung von dessen kristallen
CA1332039C (en) * 1987-03-26 1994-09-20 Takao Yonehara Ii - vi group compound crystal article and process for producing the same
EP0284437A3 (de) * 1987-03-26 1989-03-15 Canon Kabushiki Kaisha Kristalliner Gegenstand aus III-V-Gruppe-Verbindung und Verfahren zu seiner Herstellung
US5304820A (en) * 1987-03-27 1994-04-19 Canon Kabushiki Kaisha Process for producing compound semiconductor and semiconductor device using compound semiconductor obtained by same
CA1321121C (en) * 1987-03-27 1993-08-10 Hiroyuki Tokunaga Process for producing compound semiconductor and semiconductor device using compound semiconductor obtained by same
JPS6451677A (en) * 1987-08-24 1989-02-27 Canon Kk Electroluminescence element
JPH02125765A (ja) * 1988-11-04 1990-05-14 Mitsubishi Electric Corp Ｌｅｄアレイ・ヘッド
JPH02201975A (ja) * 1989-01-31 1990-08-10 Canon Inc 発光装置
JP2858434B2 (ja) * 1989-03-31 1999-02-17 キヤノン株式会社 結晶の形成方法および結晶物品
JP3207918B2 (ja) * 1991-04-22 2001-09-10 キヤノン株式会社 Ｉｉｉ−ｖ族化合物の多結晶半導体材料を用いた発光素子およびその製造方法

Also Published As

Publication number Publication date
US5659184A (en) 1997-08-19
ATE159302T1 (de) 1997-11-15
EP0484922A1 (de) 1992-05-13
DE69127952T2 (de) 1998-03-05
EP0484922B1 (de) 1997-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee