DE69119201D1 - Methode und Apparat zur Kontrolle gedruckter Schaltungen - Google Patents

Methode und Apparat zur Kontrolle gedruckter Schaltungen

Info

Publication number
DE69119201D1
DE69119201D1 DE69119201T DE69119201T DE69119201D1 DE 69119201 D1 DE69119201 D1 DE 69119201D1 DE 69119201 T DE69119201 T DE 69119201T DE 69119201 T DE69119201 T DE 69119201T DE 69119201 D1 DE69119201 D1 DE 69119201D1
Authority
DE
Germany
Prior art keywords
printed circuits
checking printed
checking
circuits
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69119201T
Other languages
English (en)
Inventor
Ryuji Kitakado
Hisayuki Tsujinaka
Tetsuo Hoki
Takao Omae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Manufacturing Co Ltd filed Critical Dainippon Screen Manufacturing Co Ltd
Application granted granted Critical
Publication of DE69119201D1 publication Critical patent/DE69119201D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00General purpose image data processing
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/0006Industrial image inspection using a design-rule based approach
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95646Soldering
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's
    • G01N2021/95653Through-holes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30141Printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Electromagnetism (AREA)
  • Geometry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
DE69119201T 1990-11-27 1991-11-19 Methode und Apparat zur Kontrolle gedruckter Schaltungen Expired - Lifetime DE69119201D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32716190 1990-11-27
JP3198471A JP2500961B2 (ja) 1990-11-27 1991-07-12 プリント基板の座残り検査方法

Publications (1)

Publication Number Publication Date
DE69119201D1 true DE69119201D1 (de) 1996-06-05

Family

ID=26510994

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69119201T Expired - Lifetime DE69119201D1 (de) 1990-11-27 1991-11-19 Methode und Apparat zur Kontrolle gedruckter Schaltungen

Country Status (5)

Country Link
US (1) US5408538A (de)
EP (1) EP0488031B1 (de)
JP (1) JP2500961B2 (de)
KR (1) KR960002545B1 (de)
DE (1) DE69119201D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5739846A (en) * 1996-02-05 1998-04-14 Universal Instruments Corporation Method of inspecting component placement accuracy for each first selected circuit board to be assembled of a batch
JPH09222312A (ja) * 1996-02-16 1997-08-26 Mitsui Mining & Smelting Co Ltd パターン検査装置および方法
KR19980039100A (ko) * 1996-11-27 1998-08-17 배순훈 부품의 클린칭 방향을 이용한 미삽 검사장치 및 방법
US6275971B1 (en) * 1997-09-30 2001-08-14 Philips Electronics North America Corporation Methods and apparatus for design rule checking
US6010939A (en) 1998-03-31 2000-01-04 Vlsi Technology, Inc. Methods for making shallow trench capacitive structures
US6020616A (en) * 1998-03-31 2000-02-01 Vlsi Technology, Inc. Automated design of on-chip capacitive structures for suppressing inductive noise
JP2002243656A (ja) 2001-02-14 2002-08-28 Nec Corp 外観検査方法及び外観検査装置
US8588511B2 (en) * 2002-05-22 2013-11-19 Cognex Corporation Method and apparatus for automatic measurement of pad geometry and inspection thereof
JP2004127220A (ja) * 2002-10-01 2004-04-22 Aisin Engineering Kk コード読取装置
TWI275788B (en) * 2004-09-09 2007-03-11 Dainippon Screen Mfg Method and apparatus for detecting a defect of an object by a color image of the object
CN101025398B (zh) * 2006-02-20 2010-06-02 牧德科技股份有限公司 微孔填铜后的凹陷或凸起分析方法
US8191018B1 (en) * 2007-07-17 2012-05-29 Kovio, Inc. Methods and software for printing materials onto a substrate
SG158756A1 (en) * 2008-07-10 2010-02-26 Visionxtreme Pte Ltd Hole inspection method and apparatus
JP6496159B2 (ja) * 2015-02-23 2019-04-03 株式会社Screenホールディングス パターン検査装置およびパターン検査方法
CN106290400A (zh) * 2016-07-29 2017-01-04 广东正业科技股份有限公司 一种应用于板的检孔方法及检孔设备
JP2021188937A (ja) * 2020-05-26 2021-12-13 株式会社デンソー はみ出し検査装置および検出方法
CN114113148A (zh) * 2021-11-18 2022-03-01 珠海方正科技多层电路板有限公司 印刷线路板质检方法、装置和设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4040748A (en) * 1975-06-30 1977-08-09 International Business Machines Corporation Inspection tool
FR2321229A1 (fr) * 1975-08-13 1977-03-11 Cit Alcatel Procede et appareillage pour controle automatique de graphisme
SE412966B (sv) * 1978-01-20 1980-03-24 Danielsson Per Erik Anordning for kontroll av avstand mellan objekt i en tvadimensionell diskretiserad bild
JPS55142254A (en) * 1979-04-25 1980-11-06 Hitachi Ltd Inspecting method for pattern of printed wiring board
EP0054596B1 (de) * 1980-12-18 1985-05-29 International Business Machines Corporation Verfahren für die Inspektion und die automatische Sortierung von Objekten, die Konfigurationen mit dimensionellen Toleranzen aufweisen und platzabhängige Kriterien für die Verwerfung, Anlage und Schaltung dafür
US4555798A (en) * 1983-06-20 1985-11-26 Kla Instruments Corporation Automatic system and method for inspecting hole quality
US5027417A (en) * 1989-03-31 1991-06-25 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
DE3925911A1 (de) * 1989-08-04 1991-02-07 Siemens Ag Opto-elektronisches pruefsystem fuer leiterplatten
US4980570A (en) * 1990-02-23 1990-12-25 Riken Denshi Co., Ltd Device for determining location of apertures
JP2524000B2 (ja) * 1991-02-22 1996-08-14 松下電器産業株式会社 パタ―ン検査装置
US5119434A (en) * 1990-12-31 1992-06-02 Beltronics, Inc. Method of and apparatus for geometric pattern inspection employing intelligent imaged-pattern shrinking, expanding and processing to identify predetermined features and tolerances

Also Published As

Publication number Publication date
KR960002545B1 (ko) 1996-02-22
JPH0520432A (ja) 1993-01-29
EP0488031A2 (de) 1992-06-03
EP0488031A3 (en) 1992-10-07
US5408538A (en) 1995-04-18
EP0488031B1 (de) 1996-05-01
KR920010255A (ko) 1992-06-26
JP2500961B2 (ja) 1996-05-29

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Legal Events

Date Code Title Description
8332 No legal effect for de