DE69116015T2 - Einrichtung zum Auftragen fliessfähiger Substanzen - Google Patents

Einrichtung zum Auftragen fliessfähiger Substanzen

Info

Publication number
DE69116015T2
DE69116015T2 DE69116015T DE69116015T DE69116015T2 DE 69116015 T2 DE69116015 T2 DE 69116015T2 DE 69116015 T DE69116015 T DE 69116015T DE 69116015 T DE69116015 T DE 69116015T DE 69116015 T2 DE69116015 T2 DE 69116015T2
Authority
DE
Germany
Prior art keywords
flowable substances
applying flowable
applying
substances
flowable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69116015T
Other languages
English (en)
Other versions
DE69116015D1 (de
Inventor
Steven L Bard
David N Christensen
John J Glenning
James A Nicoletti
Mark W Urdanick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE69116015D1 publication Critical patent/DE69116015D1/de
Application granted granted Critical
Publication of DE69116015T2 publication Critical patent/DE69116015T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Coating Apparatus (AREA)
DE69116015T 1990-07-19 1991-06-26 Einrichtung zum Auftragen fliessfähiger Substanzen Expired - Fee Related DE69116015T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/554,487 US5063951A (en) 1990-07-19 1990-07-19 Fluid treatment device

Publications (2)

Publication Number Publication Date
DE69116015D1 DE69116015D1 (de) 1996-02-15
DE69116015T2 true DE69116015T2 (de) 1996-07-04

Family

ID=24213541

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69116015T Expired - Fee Related DE69116015T2 (de) 1990-07-19 1991-06-26 Einrichtung zum Auftragen fliessfähiger Substanzen

Country Status (4)

Country Link
US (1) US5063951A (de)
EP (1) EP0467118B1 (de)
JP (1) JPH0712461B2 (de)
DE (1) DE69116015T2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5538754A (en) * 1991-03-26 1996-07-23 Shipley Company Inc. Process for applying fluid on discrete substrates
US5294259A (en) * 1992-05-18 1994-03-15 International Business Machines Corporation Fluid treatment device
US5289639A (en) * 1992-07-10 1994-03-01 International Business Machines Corp. Fluid treatment apparatus and method
US5483984A (en) * 1992-07-10 1996-01-16 Donlan, Jr.; Fraser P. Fluid treatment apparatus and method
US5317359A (en) * 1992-10-02 1994-05-31 Eastman Kodak Company Apparatus for processing photosensitive material
US5378307A (en) * 1993-04-28 1995-01-03 International Business Machines Corporation Fluid treatment apparatus
US5435885A (en) * 1994-01-25 1995-07-25 International Business Machines Corporation Apparatus and method for fluid processing of electronic packaging with flow pattern change
US5751307A (en) * 1994-04-12 1998-05-12 Moore Business Forms, Inc. Print cartridge cleaning apparatus and method using water and air
US5512335A (en) * 1994-06-27 1996-04-30 International Business Machines Corporation Fluid treatment device with vibrational energy means
US5746234A (en) 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
US5837067A (en) * 1995-06-07 1998-11-17 International Business Machines Corporation Precision fluid head transport
US5720813A (en) 1995-06-07 1998-02-24 Eamon P. McDonald Thin sheet handling system
US5614264A (en) * 1995-08-11 1997-03-25 Atotech Usa, Inc. Fluid delivery apparatus and method
US5904773A (en) * 1995-08-11 1999-05-18 Atotech Usa, Inc. Fluid delivery apparatus
DE19530989C1 (de) * 1995-08-23 1997-03-13 Atotech Deutschland Gmbh Verfahren zum Filmstrippen
JPH09103732A (ja) * 1995-09-06 1997-04-22 Internatl Business Mach Corp <Ibm> 流体供給装置
US5725668A (en) * 1995-09-06 1998-03-10 International Business Machines Corporation Expandable fluid treatment device for tublar surface treatments
US5824157A (en) * 1995-09-06 1998-10-20 International Business Machines Corporation Fluid jet impregnation
DE69732392T8 (de) * 1996-06-24 2006-04-27 Interuniversitair Microelectronica Centrum Vzw Vorrichtung und Verfahren zur Nassreinigung oder zum Ätzen eines flachen Substrats
CN1104967C (zh) * 1998-05-15 2003-04-09 阿托技术美国公司 液体处理设备和方法
AU746118B2 (en) * 1998-07-10 2002-04-18 Atotech Usa, Inc. Fluid treatment apparatus and method
US6193861B1 (en) 1999-02-23 2001-02-27 International Business Machines Corporation Apparatus and method to enhance hole fill in sub-micron plating
US7307022B2 (en) * 2004-11-19 2007-12-11 Endicott Interconnect Technologies, Inc. Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof
US7383629B2 (en) * 2004-11-19 2008-06-10 Endicott Interconnect Technologies, Inc. Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof
US6964884B1 (en) 2004-11-19 2005-11-15 Endicott Interconnect Technologies, Inc. Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
US7169313B2 (en) * 2005-05-13 2007-01-30 Endicott Interconnect Technologies, Inc. Plating method for circuitized substrates
US8291921B2 (en) * 2008-08-19 2012-10-23 Lam Research Corporation Removing bubbles from a fluid flowing down through a plenum
US20100024722A1 (en) * 2008-07-31 2010-02-04 Harold Ochs Apparatus for Coating Dental Tape
US8470718B2 (en) * 2008-08-13 2013-06-25 Synos Technology, Inc. Vapor deposition reactor for forming thin film
KR101286545B1 (ko) * 2008-09-23 2013-07-17 엘지디스플레이 주식회사 세정 장치
KR101229775B1 (ko) * 2008-12-26 2013-02-06 엘지디스플레이 주식회사 기판 세정장치
US8758512B2 (en) 2009-06-08 2014-06-24 Veeco Ald Inc. Vapor deposition reactor and method for forming thin film
EP2281921A1 (de) * 2009-07-30 2011-02-09 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Vorrichtung und Verfahren zur Atomlagenabscheidung
US20110076421A1 (en) * 2009-09-30 2011-03-31 Synos Technology, Inc. Vapor deposition reactor for forming thin film on curved surface
CN102753347B (zh) 2009-12-22 2015-01-07 3M创新有限公司 用于将流体喷射到基底上的设备和方法
EP2360293A1 (de) 2010-02-11 2011-08-24 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Verfahren und Vorrichtung zur Ablagerung atomarer Schichten auf einem Substrat
EP2362411A1 (de) 2010-02-26 2011-08-31 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Vorrichtung und Verfahren zum reaktiven Ionenätzen
US8840958B2 (en) 2011-02-14 2014-09-23 Veeco Ald Inc. Combined injection module for sequentially injecting source precursor and reactant precursor
US11251019B2 (en) * 2016-12-15 2022-02-15 Toyota Jidosha Kabushiki Kaisha Plasma device
US10422038B2 (en) * 2017-03-14 2019-09-24 Eastman Kodak Company Dual gas bearing substrate positioning system
WO2018173160A1 (ja) * 2017-03-22 2018-09-27 株式会社Ｆｕｊｉ ツール管理装置
JP6863199B2 (ja) 2017-09-25 2021-04-21 トヨタ自動車株式会社 プラズマ処理装置
US20190283063A1 (en) * 2018-03-14 2019-09-19 Adam Zax Method and apparatus for inline coating of substrates
CN110961310B (zh) * 2019-12-05 2021-04-20 青岛迪世亚制钢有限公司 一种钢丝绳涂油保养装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2879779A (en) * 1951-03-12 1959-03-31 Bank Of America Nat Trust & Savings Ass Strip cleaning device
US3044098A (en) * 1959-06-02 1962-07-17 United States Steel Corp Apparatus for cleaning wire rod
US3137882A (en) * 1960-04-07 1964-06-23 Sirius Vibration generating unit and vibration treating system
US3196832A (en) * 1963-02-20 1965-07-27 Rca Corp Fluid applicator apparatus
US3682185A (en) * 1970-03-10 1972-08-08 James J Murray Plated wire manufacturing cell
US3687104A (en) * 1970-11-27 1972-08-29 Amp Inc Strip processing apparatus having air locks between tanks
US3734109A (en) * 1971-03-08 1973-05-22 P Hebner Spray cleaning system
GB1356239A (en) * 1972-03-14 1974-06-12 Kaiser Aluminium Chem Corp Active alumina shapes
FR2355697A1 (fr) * 1976-06-25 1978-01-20 Bertin & Cie Procede pour etancher l'intervalle entre une paroi et une surface en regard, dispositifs de mise en oeuvre du procede et applications
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
GB2031036B (en) * 1978-10-10 1982-11-03 Midland Ross Corp Liquid trestment of metal strip
US4270317A (en) * 1978-10-10 1981-06-02 Midland-Ross Corporation Apparatus used in the treatment of a continuous strip of metal and method of use thereof
FR2453927A1 (fr) * 1979-04-11 1980-11-07 Superba Sa Machine pour le traitement thermique de fils textiles

Also Published As

Publication number Publication date
EP0467118A2 (de) 1992-01-22
EP0467118A3 (en) 1992-03-18
JPH04256461A (ja) 1992-09-11
EP0467118B1 (de) 1996-01-03
US5063951A (en) 1991-11-12
JPH0712461B2 (ja) 1995-02-15
DE69116015D1 (de) 1996-02-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee