DE69114973D1 - Verfahren und Apparat zum Zerschneiden von Einkristallbarren mittels einer Innenlochsäge. - Google Patents

Verfahren und Apparat zum Zerschneiden von Einkristallbarren mittels einer Innenlochsäge.

Info

Publication number
DE69114973D1
DE69114973D1 DE69114973T DE69114973T DE69114973D1 DE 69114973 D1 DE69114973 D1 DE 69114973D1 DE 69114973 T DE69114973 T DE 69114973T DE 69114973 T DE69114973 T DE 69114973T DE 69114973 D1 DE69114973 D1 DE 69114973D1
Authority
DE
Germany
Prior art keywords
single crystal
hole saw
internal hole
crystal ingots
cutting single
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69114973T
Other languages
English (en)
Other versions
DE69114973T2 (de
Inventor
Kohei Toyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69114973D1 publication Critical patent/DE69114973D1/de
Application granted granted Critical
Publication of DE69114973T2 publication Critical patent/DE69114973T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/04—Arrangements preventing overload of tools, e.g. restricting load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/12—Adaptive control, i.e. adjusting itself to have a performance which is optimum according to a preassigned criterion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
DE69114973T 1990-09-14 1991-09-16 Verfahren und Apparat zum Zerschneiden von Einkristallbarren mittels einer Innenlochsäge. Expired - Fee Related DE69114973T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2242440A JPH04122608A (ja) 1990-09-14 1990-09-14 内周刃スライサーによる単結晶インゴットの切断方法及び装置

Publications (2)

Publication Number Publication Date
DE69114973D1 true DE69114973D1 (de) 1996-01-11
DE69114973T2 DE69114973T2 (de) 1996-07-25

Family

ID=17089123

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69114973T Expired - Fee Related DE69114973T2 (de) 1990-09-14 1991-09-16 Verfahren und Apparat zum Zerschneiden von Einkristallbarren mittels einer Innenlochsäge.

Country Status (4)

Country Link
US (1) US5313741A (de)
EP (1) EP0476952B1 (de)
JP (1) JPH04122608A (de)
DE (1) DE69114973T2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05318460A (ja) * 1992-05-25 1993-12-03 Tokyo Seimitsu Co Ltd 半導体ウエハのスライシング方法
JP2823493B2 (ja) * 1993-01-18 1998-11-11 トーヨーエイテック株式会社 スライシング装置のブレード撓み検出方法及び装置並びにブレード撓み制御装置
US5718617A (en) * 1994-09-02 1998-02-17 Bryant Grinder Corporation Grinding force measurement system for computer controlled grinding operations
JP2891187B2 (ja) * 1995-06-22 1999-05-17 信越半導体株式会社 ワイヤーソー装置及び切断方法
JP2943673B2 (ja) * 1995-10-31 1999-08-30 日本電気株式会社 半導体基板の製造装置及び製造方法
DE19546988A1 (de) * 1995-12-15 1997-06-19 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zur Bearbeitung von Halbleitermaterial
US6245184B1 (en) * 1997-11-26 2001-06-12 General Electric Company Method of fabricating scintillators for computed tomograph system
US6033288A (en) 1998-10-29 2000-03-07 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6165051A (en) * 1998-10-29 2000-12-26 Kulicke & Soffa Investments, Inc. Monitoring system for dicing saws
US6913528B2 (en) * 2001-03-19 2005-07-05 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method
JP6132621B2 (ja) * 2013-03-29 2017-05-24 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体単結晶インゴットのスライス方法
CZ304579B6 (cs) * 2013-04-22 2014-07-16 Crytur Spol. S R. O. Dioda emitující bílé světlo s monokrystalickým luminoforem a způsob výroby
US9586277B2 (en) * 2014-09-24 2017-03-07 Ali W ElDessouky Flush grinder bit
EP3981566A4 (de) * 2019-06-06 2023-07-12 Tokuyama Corporation Verfahren zum schneiden von polykristallinem siliciumstab, verfahren zur herstellung eines geschnittenen stabs aus polykristallinem siliciumstab, verfahren zur herstellung von schneidvorrichtung für polykristallinen siliciumstab

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS571388B2 (de) * 1973-07-31 1982-01-11
JPS5151082A (ja) * 1974-10-30 1976-05-06 Hitachi Ltd Setsudanki
JPS5451777A (en) * 1977-10-01 1979-04-23 Shinetsu Handotai Kk Method of slicing semiconductor bar
US4228782A (en) * 1978-09-08 1980-10-21 Rca Corporation System for regulating the applied blade-to-boule force during the slicing of wafers
JPS57133634A (en) * 1981-02-12 1982-08-18 Hitachi Ltd Crystal cutting device
JPS58179609A (ja) * 1982-04-14 1983-10-20 株式会社東芝 薄片切断装置
JPS58192750A (ja) * 1982-05-03 1983-11-10 Toyoda Mach Works Ltd 研削盤
JPS60177861A (ja) * 1984-02-24 1985-09-11 Kyoritsu Seiki Kk ブレ−ド式ラツプ切断機に於ける切削荷重コントロ−ル装置
DE3469498D1 (en) * 1984-06-27 1988-04-07 Meyer & Burger Ag Maschf Cutting machine with measuring device and utilization of this measuring device
JPS62199359A (ja) * 1986-02-21 1987-09-03 Okamoto Kosaku Kikai Seisakusho:Kk 連続ドレツシング制御方法及びその装置
DE3611937A1 (de) * 1986-04-09 1987-10-22 Schulz Harder Juergen Verfahren zum kuehlen von schleifscheiben
JPS6393517A (ja) * 1986-10-06 1988-04-23 Ishikawajima Harima Heavy Ind Co Ltd 鋸切断機の切断負荷制御方法
DE3640645A1 (de) * 1986-11-28 1988-06-09 Wacker Chemitronic Verfahren zum zersaegen von kristallstaeben oder -bloecken vermittels innenlochsaege in duenne scheiben
US5025593A (en) * 1988-01-18 1991-06-25 Mazda Motor Corporation Slicing machine and control method thereof
EP0329087B1 (de) * 1988-02-15 1994-11-17 Tokyo Seimitsu Co.,Ltd. Verfahren und Vorrichtung für die Nachbearbeitung auf Innenlochfeinbearbeitungsmaschinen
JPH02134212A (ja) * 1988-11-14 1990-05-23 Sumitomo Metal Ind Ltd 切断方法
DE3906091A1 (de) * 1989-02-27 1990-08-30 Wacker Chemitronic Verfahren zum zersaegen von stabfoermigen werkstuecken in scheiben mittels innenlochsaege, sowie innenlochsaegen zu seiner durchfuehrung
JPH03121769A (ja) * 1989-10-05 1991-05-23 Nachi Fujikoshi Corp 高精度スライシングマシン

Also Published As

Publication number Publication date
EP0476952B1 (de) 1995-11-29
EP0476952A2 (de) 1992-03-25
EP0476952A3 (en) 1992-06-24
DE69114973T2 (de) 1996-07-25
US5313741A (en) 1994-05-24
JPH04122608A (ja) 1992-04-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee