JPS57133634A - Crystal cutting device - Google Patents

Crystal cutting device

Info

Publication number
JPS57133634A
JPS57133634A JP1810881A JP1810881A JPS57133634A JP S57133634 A JPS57133634 A JP S57133634A JP 1810881 A JP1810881 A JP 1810881A JP 1810881 A JP1810881 A JP 1810881A JP S57133634 A JPS57133634 A JP S57133634A
Authority
JP
Japan
Prior art keywords
blade
cutting
ingot
coolant
cutting edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1810881A
Other languages
Japanese (ja)
Inventor
Masaru Tsukahara
Takashi Shimura
Seita Tokura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1810881A priority Critical patent/JPS57133634A/en
Publication of JPS57133634A publication Critical patent/JPS57133634A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D47/00—Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts
    • B23D47/005—Vibration-damping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B23D59/002—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade for the position of the saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/22—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work
    • B23Q17/2233—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring existing or desired position of tool or work for adjusting the tool relative to the workpiece
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To obtain the wafers having no warpage by a method wherein the displacement in the upward and the downward directions of the blade, located in the vicinity of the cutting section which constitutes the cutting device, is detected by a detector and based on the information obtained, the quantity of coolant to be blasted on the upper and the lower surfaces of the blade and the speed of cutting are controlled. CONSTITUTION:The side face of a crystal ingot 2 is supported by the supporting plate 1 such as carbon and the like, the circular blade 7 with a diamond cutting edge 6 is arranged in a stretched state, and the end face of the ingot 2 is inserted in the inner circumference of the blade 7. Subsequently, the ingot 2 is pushed against the cutting edge 6 while the ingot 2 or the blade 7 is shifted, and the wafers are cut out successively. In this constitution, a non-contact displacement meter 15 is positioned at a point close to the stainless steel plate 5 and in the vicinity of the cutting section, the upward or downward displacement on the stainless steel plate 5 is detected and based on the information obtained, the quantity of the coolant 11 coming from a coolant jetting nozzle 9 is controlled, and at the same time, the cutting speed of the cutting edge 6 is regulated.
JP1810881A 1981-02-12 1981-02-12 Crystal cutting device Pending JPS57133634A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1810881A JPS57133634A (en) 1981-02-12 1981-02-12 Crystal cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1810881A JPS57133634A (en) 1981-02-12 1981-02-12 Crystal cutting device

Publications (1)

Publication Number Publication Date
JPS57133634A true JPS57133634A (en) 1982-08-18

Family

ID=11962416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1810881A Pending JPS57133634A (en) 1981-02-12 1981-02-12 Crystal cutting device

Country Status (1)

Country Link
JP (1) JPS57133634A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134212A (en) * 1988-11-14 1990-05-23 Sumitomo Metal Ind Ltd Cutting method
JPH0349906A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
US5313741A (en) * 1990-09-14 1994-05-24 Shin-Etsu Handotai Co., Ltd. Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein
JPH06295890A (en) * 1992-03-31 1994-10-21 Kyushu Electron Metal Co Ltd Machining method for semiconductor wafer
US6006736A (en) * 1995-07-12 1999-12-28 Memc Electronic Materials, Inc. Method and apparatus for washing silicon ingot with water to remove particulate matter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762009B2 (en) * 1975-03-10 1982-12-27 Fujitsu Ltd

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5762009B2 (en) * 1975-03-10 1982-12-27 Fujitsu Ltd

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02134212A (en) * 1988-11-14 1990-05-23 Sumitomo Metal Ind Ltd Cutting method
JPH0349906A (en) * 1989-07-17 1991-03-04 Toyo Eitetsuku Kk Slicing device
US5313741A (en) * 1990-09-14 1994-05-24 Shin-Etsu Handotai Co., Ltd. Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein
JPH06295890A (en) * 1992-03-31 1994-10-21 Kyushu Electron Metal Co Ltd Machining method for semiconductor wafer
US6006736A (en) * 1995-07-12 1999-12-28 Memc Electronic Materials, Inc. Method and apparatus for washing silicon ingot with water to remove particulate matter

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