DE69112119T2 - Verbundplatte und Herstellungsverfahren von einer keramischen Leiterplatte unter Verwendung ersterer. - Google Patents
Verbundplatte und Herstellungsverfahren von einer keramischen Leiterplatte unter Verwendung ersterer.Info
- Publication number
- DE69112119T2 DE69112119T2 DE1991612119 DE69112119T DE69112119T2 DE 69112119 T2 DE69112119 T2 DE 69112119T2 DE 1991612119 DE1991612119 DE 1991612119 DE 69112119 T DE69112119 T DE 69112119T DE 69112119 T2 DE69112119 T2 DE 69112119T2
- Authority
- DE
- Germany
- Prior art keywords
- former
- manufacturing
- ceramic circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2119430A JP2789782B2 (ja) | 1990-05-09 | 1990-05-09 | セラミック配線基板の製造方法 |
JP32362590A JP3074728B2 (ja) | 1990-11-26 | 1990-11-26 | セラミック配線基板の製造方法 |
JP33244290A JP2754914B2 (ja) | 1990-11-28 | 1990-11-28 | セラミック配線基板の製造方法 |
JP4951591A JP3003241B2 (ja) | 1991-03-14 | 1991-03-14 | グリーンシートとプラスチックフィルムの複合体 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69112119D1 DE69112119D1 (de) | 1995-09-21 |
DE69112119T2 true DE69112119T2 (de) | 1996-02-01 |
Family
ID=27462367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1991612119 Expired - Lifetime DE69112119T2 (de) | 1990-05-09 | 1991-05-08 | Verbundplatte und Herstellungsverfahren von einer keramischen Leiterplatte unter Verwendung ersterer. |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0456243B1 (de) |
DE (1) | DE69112119T2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04296086A (ja) * | 1991-01-18 | 1992-10-20 | Du Pont Japan Ltd | セラミック多層基板用グリーンシートと、その製造方 法、および該グリーンシートを用いたセラミック多層基板の製造方法 |
CA2093407C (en) * | 1992-04-06 | 1997-12-09 | Jun Inasaka | Method for fabricating a ceramic multi-layer substrate |
US5456778A (en) * | 1992-08-21 | 1995-10-10 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
US5948200A (en) * | 1996-07-26 | 1999-09-07 | Taiyo Yuden Co., Ltd. | Method of manufacturing laminated ceramic electronic parts |
DE19742072B4 (de) * | 1997-09-24 | 2005-11-24 | Robert Bosch Gmbh | Verfahren zur Herstellung druckdichter Durchkontaktierungen |
DE102009031983A1 (de) | 2009-07-06 | 2011-01-13 | Lti Drives Gmbh | An eine Vakuumpumpe anschließbare elektrische Verbindungseinheit |
CN104540320B (zh) * | 2014-12-09 | 2018-02-02 | 江门崇达电路技术有限公司 | 一种pcb中树脂塞孔的制作方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3899554A (en) * | 1973-12-14 | 1975-08-12 | Ibm | Process for forming a ceramic substrate |
-
1991
- 1991-05-08 EP EP19910107548 patent/EP0456243B1/de not_active Expired - Lifetime
- 1991-05-08 DE DE1991612119 patent/DE69112119T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0456243A3 (en) | 1992-04-15 |
DE69112119D1 (de) | 1995-09-21 |
EP0456243B1 (de) | 1995-08-16 |
EP0456243A2 (de) | 1991-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: PANASONIC CORP., KADOMA, OSAKA, JP |