DE69103807D1 - Verfahren zum Anlöten metallisierter Komponenten an keramische Substrate. - Google Patents

Verfahren zum Anlöten metallisierter Komponenten an keramische Substrate.

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Publication number
DE69103807D1
DE69103807D1 DE69103807T DE69103807T DE69103807D1 DE 69103807 D1 DE69103807 D1 DE 69103807D1 DE 69103807 T DE69103807 T DE 69103807T DE 69103807 T DE69103807 T DE 69103807T DE 69103807 D1 DE69103807 D1 DE 69103807D1
Authority
DE
Germany
Prior art keywords
ceramic substrates
metallized components
soldering
soldering metallized
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69103807T
Other languages
English (en)
Other versions
DE69103807T2 (de
Inventor
Roupen Leon Keusseyan
William John Nebe
James Jerry Osborne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Application granted granted Critical
Publication of DE69103807D1 publication Critical patent/DE69103807D1/de
Publication of DE69103807T2 publication Critical patent/DE69103807T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
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    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structural Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
DE69103807T 1990-04-12 1991-04-09 Verfahren zum Anlöten metallisierter Komponenten an keramische Substrate. Expired - Fee Related DE69103807T2 (de)

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US07/508,871 US5033666A (en) 1990-04-12 1990-04-12 Process for brazing metallized components to ceramic substrates

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US (1) US5033666A (de)
EP (1) EP0453858B1 (de)
JP (1) JP2602372B2 (de)
KR (1) KR940006434B1 (de)
CA (1) CA2039205A1 (de)
DE (1) DE69103807T2 (de)

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US5402032A (en) * 1992-10-29 1995-03-28 Litton Systems, Inc. Traveling wave tube with plate for bonding thermally-mismatched elements
JP2674523B2 (ja) * 1993-12-16 1997-11-12 日本電気株式会社 セラミック配線基板とその製造方法
US5700724A (en) * 1994-08-02 1997-12-23 Philips Electronic North America Corporation Hermetically sealed package for a high power hybrid circuit
US5637261A (en) * 1994-11-07 1997-06-10 The Curators Of The University Of Missouri Aluminum nitride-compatible thick-film binder glass and thick-film paste composition
US5763888A (en) * 1995-01-30 1998-06-09 Ametek Aerospace Products, Inc. High temperature gas stream optical flame sensor and method for fabricating same
US5678168A (en) * 1995-11-13 1997-10-14 National Starch And Chemical Investment Holding Corporation Two-layer solderable gold for thick film circuits
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
US5896869A (en) * 1997-01-13 1999-04-27 International Business Machines Corporation Semiconductor package having etched-back silver-copper braze
DE19842276A1 (de) * 1998-09-16 2000-03-30 Bosch Gmbh Robert Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung
US6699571B1 (en) * 2002-03-27 2004-03-02 Morgan Advanced Ceramics, Inc. Devices and methods for mounting components of electronic circuitry
KR100873772B1 (ko) * 2002-11-19 2008-12-15 도와 홀딩스 가부시끼가이샤 금속/세라믹 접합 제품
US7989086B2 (en) * 2003-11-05 2011-08-02 Hamilton Sundstrand Corporation High temperature seal for joining ceramic components such as cells in a ceramic oxygen generator
US20060009036A1 (en) * 2004-07-12 2006-01-12 Bacher Rudolph J High thermal cycle conductor system
US7145076B2 (en) * 2005-02-08 2006-12-05 Greatbatch, Inc. Method for minimizing stress in feedthrough capacitor filter assemblies
US20060275607A1 (en) * 2005-06-06 2006-12-07 Semih Demir Composite assemblies including powdered metal components
US7328832B2 (en) * 2005-09-28 2008-02-12 General Electric Company Gold/nickel/copper brazing alloys for brazing WC-Co to titanium alloys
US7293688B2 (en) * 2005-11-14 2007-11-13 General Electric Company Gold/nickel/copper/aluminum/silver brazing alloys for brazing WC-Co to titanium alloys
US7987712B2 (en) * 2008-12-10 2011-08-02 Rosemount Aerospace Inc. High temperature seal assembly for optical sensor
US9643021B2 (en) 2013-01-08 2017-05-09 Advanced Bionics Ag Electrical feedthrough assembly
EP2569051B1 (de) * 2010-05-12 2014-10-08 Advanced Bionics AG Elektrische durchführungsanordnung
JP6480806B2 (ja) 2014-05-23 2019-03-13 ゼネラル・エレクトリック・カンパニイ セラミックと金属を接合するための方法およびその封止構造
BG112154A (bg) * 2015-11-19 2017-05-31 СОФИЙСКИ УНИВЕРСИТЕТ "Св. Кл. Охридски" Метод за получаване на течни, полутечни и твърди органични частици с контролирана форма и/или размер
US11222878B2 (en) 2019-04-30 2022-01-11 Ab Mikroelektronik Gesellschaft Mit Beschraenkter Haftung Electronic power module
EP4112586A1 (de) * 2021-06-29 2023-01-04 Heraeus Deutschland GmbH & Co. KG Verfahren zur herstellung eines metall-keramik-substrats mittels einem durchlaufofen

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US3006069A (en) * 1957-05-23 1961-10-31 Rca Corp Method of sealing a metal member to a ceramic member
US3207838A (en) * 1961-06-30 1965-09-21 Western Electric Co Substrates having solderable gold films formed thereon, and methods of making the same
US3281931A (en) * 1963-10-10 1966-11-01 Bendix Corp High temperature ceramic-metal seal
US3590468A (en) * 1969-02-19 1971-07-06 Sperry Rand Corp Glassy phase method for making pure alumina-to-metal hermetic seals
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US4613560A (en) * 1984-12-28 1986-09-23 E. I. Du Pont De Nemours And Company Photosensitive ceramic coating composition
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JPH03103385A (ja) * 1989-09-18 1991-04-30 Nippon Steel Corp セラミックスのメタライズ方法、ならびにセラミックスと金属の接合方法

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US5033666A (en) 1991-07-23
JPH04238875A (ja) 1992-08-26
JP2602372B2 (ja) 1997-04-23
EP0453858B1 (de) 1994-09-07
EP0453858A1 (de) 1991-10-30
KR910019109A (ko) 1991-11-30
DE69103807T2 (de) 1995-03-23
CA2039205A1 (en) 1991-10-13
KR940006434B1 (ko) 1994-07-20

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