DE69032919T2 - Zusammengestellte Schaltungsplatte und Herstellungsverfahren dafür - Google Patents
Zusammengestellte Schaltungsplatte und Herstellungsverfahren dafürInfo
- Publication number
- DE69032919T2 DE69032919T2 DE69032919T DE69032919T DE69032919T2 DE 69032919 T2 DE69032919 T2 DE 69032919T2 DE 69032919 T DE69032919 T DE 69032919T DE 69032919 T DE69032919 T DE 69032919T DE 69032919 T2 DE69032919 T2 DE 69032919T2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- manufacturing process
- process therefor
- compiled circuit
- compiled
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0391—Using different types of conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13611089 | 1989-11-27 | ||
JP8067990A JPH03283484A (ja) | 1990-03-30 | 1990-03-30 | 大電流回路基板 |
JP9813290U JPH0399469U (de) | 1989-11-27 | 1990-09-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69032919D1 DE69032919D1 (de) | 1999-03-11 |
DE69032919T2 true DE69032919T2 (de) | 1999-06-24 |
Family
ID=27303365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69032919T Expired - Fee Related DE69032919T2 (de) | 1989-11-27 | 1990-11-27 | Zusammengestellte Schaltungsplatte und Herstellungsverfahren dafür |
Country Status (4)
Country | Link |
---|---|
US (1) | US5223676A (de) |
EP (1) | EP0430157B1 (de) |
CA (1) | CA2030826C (de) |
DE (1) | DE69032919T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0818170A (ja) * | 1994-06-28 | 1996-01-19 | Honda Motor Co Ltd | 配線基板 |
WO1998020557A1 (en) * | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | Method for reducing via inductance in an electronic assembly and device |
CH690806A5 (de) * | 1997-03-27 | 2001-01-15 | Ppc Electronic Ag | Mehrlagiger Leiterplattenkörper für hohe Spannungen und hohe Ströme sowie Verfahren zur Herstellung eines solchen Leiterplattenkörpers. |
US6051782A (en) * | 1998-01-21 | 2000-04-18 | Yazaki Corporation | Conductor layout for electrical junction box |
US6398759B1 (en) | 1998-06-04 | 2002-06-04 | Alcon Manufacturing, Ltd. | Liquefracture handpiece tip |
US6215681B1 (en) | 1999-11-09 | 2001-04-10 | Agile Systems Inc. | Bus bar heat sink |
FR2804573B1 (fr) * | 2000-02-02 | 2003-01-10 | Sagem | Carte multicouche pour assemblage de circuits de puissance et de donnees numeriques |
US6725096B2 (en) * | 2000-05-05 | 2004-04-20 | Advanced Bionics Corporation | Multiple in-line contact connector |
US6488551B1 (en) | 2000-08-17 | 2002-12-03 | Yazaki North America | Press-fit junction box terminal |
US6797889B1 (en) | 2002-05-30 | 2004-09-28 | Johnson Controls Automotive Electronics | Assembly of power circuits and numerical data printed on a multilayer board |
DE10354118A1 (de) * | 2003-11-19 | 2005-06-02 | Ruwel Ag | Verfahren zur Herstellung von Leiterplatten und Leiterplatte |
JP2005210044A (ja) * | 2003-12-26 | 2005-08-04 | Tdk Corp | インダクタ素子内蔵基板およびパワーアンプモジュール |
US8365397B2 (en) * | 2007-08-02 | 2013-02-05 | Em Research, Inc. | Method for producing a circuit board comprising a lead frame |
JP5436774B2 (ja) * | 2007-12-25 | 2014-03-05 | 古河電気工業株式会社 | 多層プリント基板およびその製造方法 |
US20100014259A1 (en) * | 2008-07-15 | 2010-01-21 | Enermax Technology Corporation | Modular circuit board structure for large current area |
JP5232716B2 (ja) * | 2009-04-27 | 2013-07-10 | 矢崎総業株式会社 | 配線基板のコネクタ接続構造 |
CN102474976B (zh) | 2009-07-27 | 2015-05-20 | 株式会社丰田自动织机 | 布线基板以及布线基板的制造方法 |
KR101409343B1 (ko) * | 2009-09-01 | 2014-06-18 | 가부시키가이샤 도요다 지도숏키 | 회로 기판의 제조 방법 및 회로 기판 |
CN102726126A (zh) * | 2010-02-01 | 2012-10-10 | 古河电气工业株式会社 | 车载电气连接箱用金属芯基板 |
DE102012214982B4 (de) * | 2012-08-23 | 2021-06-02 | Vitesco Technologies GmbH | Leiterplatine |
DE102015202569A1 (de) * | 2015-02-12 | 2016-08-18 | Robert Bosch Gmbh | Schaltungsträger, elektronisches Modul und Verfahren zur Herstellung eines Schaltungsträgers |
FR3104888B1 (fr) * | 2019-12-16 | 2023-01-20 | Safran Electrical & Power | Dispositif d’équilibrage |
CN113271711A (zh) * | 2021-05-17 | 2021-08-17 | 阮立波 | 一种强电流pcb板组件及其制造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE52738C (de) * | %. MS SS»™ Vh ,£«vVlands" Harphurhey, Manchester, England | Neuerung an Formen zur Herstel-VsiBg ^'öfc ?\brk!&«s> | ||
US4446188A (en) * | 1979-12-20 | 1984-05-01 | The Mica Corporation | Multi-layered circuit board |
EP0052738A1 (de) * | 1980-11-25 | 1982-06-02 | Contraves Ag | Leiterplatte |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
US4521262A (en) * | 1983-01-10 | 1985-06-04 | Pellegrino Peter P | Method for mass producing printed circuit boards |
NL8403596A (nl) * | 1984-11-27 | 1986-06-16 | Philips Nv | Montagechassis voor onderdelen. |
US4729061A (en) * | 1985-04-29 | 1988-03-01 | Advanced Micro Devices, Inc. | Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom |
US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
US4845313A (en) * | 1985-07-22 | 1989-07-04 | Tokyo Communication Equipment Co., Ltd. | Metallic core wiring substrate |
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
US4972050A (en) * | 1989-06-30 | 1990-11-20 | Kollmorgen Corporation | Wire scribed circuit boards and methods of their manufacture |
-
1990
- 1990-11-19 US US07/615,337 patent/US5223676A/en not_active Expired - Fee Related
- 1990-11-26 CA CA002030826A patent/CA2030826C/en not_active Expired - Fee Related
- 1990-11-27 DE DE69032919T patent/DE69032919T2/de not_active Expired - Fee Related
- 1990-11-27 EP EP90122636A patent/EP0430157B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0430157A3 (en) | 1991-09-04 |
EP0430157A2 (de) | 1991-06-05 |
EP0430157B1 (de) | 1999-01-27 |
US5223676A (en) | 1993-06-29 |
DE69032919D1 (de) | 1999-03-11 |
CA2030826C (en) | 1994-09-06 |
CA2030826A1 (en) | 1991-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |