FR3104888B1 - Dispositif d’équilibrage - Google Patents

Dispositif d’équilibrage Download PDF

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Publication number
FR3104888B1
FR3104888B1 FR1914542A FR1914542A FR3104888B1 FR 3104888 B1 FR3104888 B1 FR 3104888B1 FR 1914542 A FR1914542 A FR 1914542A FR 1914542 A FR1914542 A FR 1914542A FR 3104888 B1 FR3104888 B1 FR 3104888B1
Authority
FR
France
Prior art keywords
layers
stack
electrically conductive
balancing device
primary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1914542A
Other languages
English (en)
Other versions
FR3104888A1 (fr
Inventor
Philippe Lapalus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electrical and Power SAS
Original Assignee
Safran Electrical and Power SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electrical and Power SAS filed Critical Safran Electrical and Power SAS
Priority to FR1914542A priority Critical patent/FR3104888B1/fr
Publication of FR3104888A1 publication Critical patent/FR3104888A1/fr
Application granted granted Critical
Publication of FR3104888B1 publication Critical patent/FR3104888B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0256—Electrical insulation details, e.g. around high voltage areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L’invention concerne un circuit imprimé (30) comprenant un dispositif (34) de distribution électrique comprenant un empilement d’une pluralité de couches électriquement conductrices disposées en alternance avec des couches isolantes (40), l’empilement étant tel que les couches électriquement conductrices comprennent une première (36) et une seconde (38) couches primaires épaisses d’épaisseur supérieure au millimètre destinées à être reliées à des bornes d’une alimentation électrique et au moins une première (42) et au moins une seconde (44) couches secondaires, une pluralité de condensateurs (46) montés en surface externe de l’empilement et reliés électriquement aux première (36) et seconde (38) couches primaires. Figure à publier avec l’abrégé : figure 4
FR1914542A 2019-12-16 2019-12-16 Dispositif d’équilibrage Active FR3104888B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1914542A FR3104888B1 (fr) 2019-12-16 2019-12-16 Dispositif d’équilibrage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1914542A FR3104888B1 (fr) 2019-12-16 2019-12-16 Dispositif d’équilibrage
FR1914542 2019-12-16

Publications (2)

Publication Number Publication Date
FR3104888A1 FR3104888A1 (fr) 2021-06-18
FR3104888B1 true FR3104888B1 (fr) 2023-01-20

Family

ID=70613926

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1914542A Active FR3104888B1 (fr) 2019-12-16 2019-12-16 Dispositif d’équilibrage

Country Status (1)

Country Link
FR (1) FR3104888B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5223676A (en) * 1989-11-27 1993-06-29 The Furukawa Electric Co., Ltd. Composite circuit board having means to suppress heat diffusion and manufacturing method of the same
GB0723213D0 (en) * 2007-11-27 2008-01-09 Yazaki Europe Ltd Junction box
JP5437397B2 (ja) * 2010-01-27 2014-03-12 株式会社日立製作所 配電実装部品及びそれを用いたインバータ装置
GB2549768B (en) * 2016-04-28 2019-12-04 Ge Aviat Systems Ltd Systems and apparatuses for power electronics with high current carrying conductors

Also Published As

Publication number Publication date
FR3104888A1 (fr) 2021-06-18

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