DE69032813T2 - Verwendung eines Trägers für Halbleiteranordnung - Google Patents

Verwendung eines Trägers für Halbleiteranordnung

Info

Publication number
DE69032813T2
DE69032813T2 DE69032813T DE69032813T DE69032813T2 DE 69032813 T2 DE69032813 T2 DE 69032813T2 DE 69032813 T DE69032813 T DE 69032813T DE 69032813 T DE69032813 T DE 69032813T DE 69032813 T2 DE69032813 T2 DE 69032813T2
Authority
DE
Germany
Prior art keywords
semiconductor device
device carrier
carrier
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032813T
Other languages
English (en)
Other versions
DE69032813D1 (de
Inventor
Masako Kodera
Tohru Watanabe
Katsuya Okumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69032813D1 publication Critical patent/DE69032813D1/de
Application granted granted Critical
Publication of DE69032813T2 publication Critical patent/DE69032813T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
    • H01L29/34—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being on the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69032813T 1989-07-25 1990-07-25 Verwendung eines Trägers für Halbleiteranordnung Expired - Fee Related DE69032813T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1192272A JPH0770505B2 (ja) 1989-07-25 1989-07-25 半導体装置支持キャリヤ

Publications (2)

Publication Number Publication Date
DE69032813D1 DE69032813D1 (de) 1999-01-21
DE69032813T2 true DE69032813T2 (de) 1999-05-27

Family

ID=16288516

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032813T Expired - Fee Related DE69032813T2 (de) 1989-07-25 1990-07-25 Verwendung eines Trägers für Halbleiteranordnung

Country Status (4)

Country Link
EP (1) EP0410421B1 (de)
JP (1) JPH0770505B2 (de)
KR (1) KR930010825B1 (de)
DE (1) DE69032813T2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2871387B2 (ja) * 1992-07-27 1999-03-17 ヤマハ株式会社 音像定位装置
JP3578783B2 (ja) * 1993-09-24 2004-10-20 ヤマハ株式会社 電子楽器の音像定位装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5093775A (de) * 1973-12-19 1975-07-26
JPS62291044A (ja) * 1986-06-10 1987-12-17 Nec Corp 半導体ウエハ用キヤリア
US4696395A (en) * 1986-11-14 1987-09-29 Northrop Corporation Substrate container

Also Published As

Publication number Publication date
EP0410421A3 (en) 1991-11-13
JPH0355835A (ja) 1991-03-11
EP0410421A2 (de) 1991-01-30
KR910003830A (ko) 1991-02-28
KR930010825B1 (ko) 1993-11-12
EP0410421B1 (de) 1998-12-09
JPH0770505B2 (ja) 1995-07-31
DE69032813D1 (de) 1999-01-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee