CA1027465A - Processing of semiconductor wafers - Google Patents

Processing of semiconductor wafers

Info

Publication number
CA1027465A
CA1027465A CA216,323A CA216323A CA1027465A CA 1027465 A CA1027465 A CA 1027465A CA 216323 A CA216323 A CA 216323A CA 1027465 A CA1027465 A CA 1027465A
Authority
CA
Canada
Prior art keywords
processing
semiconductor wafers
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA216,323A
Other languages
French (fr)
Other versions
CA216323S (en
Inventor
Robert J. Walsh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Monsanto Co
Original Assignee
Monsanto Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Monsanto Co filed Critical Monsanto Co
Application granted granted Critical
Publication of CA1027465A publication Critical patent/CA1027465A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
CA216,323A 1973-12-19 1974-12-18 Processing of semiconductor wafers Expired CA1027465A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42638773A 1973-12-19 1973-12-19

Publications (1)

Publication Number Publication Date
CA1027465A true CA1027465A (en) 1978-03-07

Family

ID=23690593

Family Applications (1)

Application Number Title Priority Date Filing Date
CA216,323A Expired CA1027465A (en) 1973-12-19 1974-12-18 Processing of semiconductor wafers

Country Status (5)

Country Link
JP (1) JPS5093775A (en)
BE (1) BE823525A (en)
CA (1) CA1027465A (en)
DE (1) DE2459892A1 (en)
GB (1) GB1483746A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2326479A1 (en) * 1975-10-03 1977-04-29 Radiotechnique Compelec PROCESS FOR PICKLING SEMICONDUCTOR PLATES, ESPECIALLY FOR SOLAR CELLS AND APPARATUS FOR IMPLEMENTING THE PROCESS
JPS5721321Y2 (en) * 1975-12-26 1982-05-08
JPS5288967U (en) * 1975-12-26 1977-07-02
JPS5619933Y2 (en) * 1978-01-10 1981-05-12
JPS5617021A (en) * 1979-07-20 1981-02-18 Fujitsu Ltd Surface treatment of substrate
JPS5729140U (en) * 1980-07-24 1982-02-16
JPS6327784Y2 (en) * 1980-09-19 1988-07-27
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US5278104A (en) * 1989-07-25 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor wafer carrier having a dust cover
JPH0770505B2 (en) * 1989-07-25 1995-07-31 株式会社東芝 Semiconductor device support carrier
US5054519A (en) * 1990-12-26 1991-10-08 Imtec Products, Inc. Recirculating chemical bath with inflow and self balancing outflow
KR100232998B1 (en) * 1996-06-05 1999-12-01 윤종용 Chemical bath unit with controlling means for etch rate
JP5478604B2 (en) * 2008-03-31 2014-04-23 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド Method for etching an edge of a silicon wafer
KR20110099108A (en) * 2008-11-19 2011-09-06 엠이엠씨 일렉트로닉 머티리얼즈, 인크. Method and system for stripping the edge of a semiconductor wafer
CN113793819A (en) * 2021-09-16 2021-12-14 长江存储科技有限责任公司 Chemical tank and temperature control method thereof
CN115241330B (en) * 2022-09-19 2022-12-27 英利能源发展(天津)有限公司 Semiconductor silicon wafer device for etching solar cell by hydrofluoric acid

Also Published As

Publication number Publication date
BE823525A (en) 1975-06-18
GB1483746A (en) 1977-08-24
JPS5093775A (en) 1975-07-26
DE2459892A1 (en) 1975-09-04

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