JPS5093775A - - Google Patents
Info
- Publication number
- JPS5093775A JPS5093775A JP14552574A JP14552574A JPS5093775A JP S5093775 A JPS5093775 A JP S5093775A JP 14552574 A JP14552574 A JP 14552574A JP 14552574 A JP14552574 A JP 14552574A JP S5093775 A JPS5093775 A JP S5093775A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42638773A | 1973-12-19 | 1973-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5093775A true JPS5093775A (ja) | 1975-07-26 |
Family
ID=23690593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14552574A Pending JPS5093775A (ja) | 1973-12-19 | 1974-12-18 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5093775A (ja) |
BE (1) | BE823525A (ja) |
CA (1) | CA1027465A (ja) |
DE (1) | DE2459892A1 (ja) |
GB (1) | GB1483746A (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5288968U (ja) * | 1975-12-26 | 1977-07-02 | ||
JPS5288967U (ja) * | 1975-12-26 | 1977-07-02 | ||
JPS54105799U (ja) * | 1978-01-10 | 1979-07-25 | ||
JPS5617021A (en) * | 1979-07-20 | 1981-02-18 | Fujitsu Ltd | Surface treatment of substrate |
JPS5729140U (ja) * | 1980-07-24 | 1982-02-16 | ||
JPS5758435U (ja) * | 1980-09-19 | 1982-04-06 | ||
JP2011521442A (ja) * | 2008-03-31 | 2011-07-21 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | シリコンウェハの端部をエッチングするための方法 |
JP2012509599A (ja) * | 2008-11-19 | 2012-04-19 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 半導体ウェーハのエッジを剥離する方法及びシステム |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2326479A1 (fr) * | 1975-10-03 | 1977-04-29 | Radiotechnique Compelec | Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede |
US4482425A (en) * | 1983-06-27 | 1984-11-13 | Psi Star, Inc. | Liquid etching reactor and method |
JPH0770505B2 (ja) * | 1989-07-25 | 1995-07-31 | 株式会社東芝 | 半導体装置支持キャリヤ |
US5278104A (en) * | 1989-07-25 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor wafer carrier having a dust cover |
US5054519A (en) * | 1990-12-26 | 1991-10-08 | Imtec Products, Inc. | Recirculating chemical bath with inflow and self balancing outflow |
KR100232998B1 (ko) * | 1996-06-05 | 1999-12-01 | 윤종용 | 식각량 조절수단을 갖는 케미컬 배스 유니트 |
CN113793819B (zh) * | 2021-09-16 | 2024-06-18 | 长江存储科技有限责任公司 | 化学槽及其温度控制方法 |
CN115241330B (zh) * | 2022-09-19 | 2022-12-27 | 英利能源发展(天津)有限公司 | 一种氢氟酸刻蚀太阳能电池用半导体硅片装置 |
-
1974
- 1974-12-18 BE BE151653A patent/BE823525A/xx unknown
- 1974-12-18 JP JP14552574A patent/JPS5093775A/ja active Pending
- 1974-12-18 CA CA216,323A patent/CA1027465A/en not_active Expired
- 1974-12-18 DE DE19742459892 patent/DE2459892A1/de not_active Withdrawn
- 1974-12-18 GB GB5470774A patent/GB1483746A/en not_active Expired
Non-Patent Citations (1)
Title |
---|
IBM TECHNICAL DESIGN BULLTEIN=1966 * |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5288968U (ja) * | 1975-12-26 | 1977-07-02 | ||
JPS5288967U (ja) * | 1975-12-26 | 1977-07-02 | ||
JPS5721321Y2 (ja) * | 1975-12-26 | 1982-05-08 | ||
JPS54105799U (ja) * | 1978-01-10 | 1979-07-25 | ||
JPS5619933Y2 (ja) * | 1978-01-10 | 1981-05-12 | ||
JPS5617021A (en) * | 1979-07-20 | 1981-02-18 | Fujitsu Ltd | Surface treatment of substrate |
JPS6325498B2 (ja) * | 1979-07-20 | 1988-05-25 | Fujitsu Ltd | |
JPS5729140U (ja) * | 1980-07-24 | 1982-02-16 | ||
JPS5758435U (ja) * | 1980-09-19 | 1982-04-06 | ||
JPS6327784Y2 (ja) * | 1980-09-19 | 1988-07-27 | ||
JP2011521442A (ja) * | 2008-03-31 | 2011-07-21 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | シリコンウェハの端部をエッチングするための方法 |
JP2012509599A (ja) * | 2008-11-19 | 2012-04-19 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | 半導体ウェーハのエッジを剥離する方法及びシステム |
Also Published As
Publication number | Publication date |
---|---|
DE2459892A1 (de) | 1975-09-04 |
BE823525A (fr) | 1975-06-18 |
GB1483746A (en) | 1977-08-24 |
CA1027465A (en) | 1978-03-07 |