BE823525A - Traitement de galettes de semi-conducteurs - Google Patents
Traitement de galettes de semi-conducteursInfo
- Publication number
- BE823525A BE823525A BE151653A BE151653A BE823525A BE 823525 A BE823525 A BE 823525A BE 151653 A BE151653 A BE 151653A BE 151653 A BE151653 A BE 151653A BE 823525 A BE823525 A BE 823525A
- Authority
- BE
- Belgium
- Prior art keywords
- cakes
- semiconductor
- treatment
- semiconductor cakes
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42638773A | 1973-12-19 | 1973-12-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE823525A true BE823525A (fr) | 1975-06-18 |
Family
ID=23690593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE151653A BE823525A (fr) | 1973-12-19 | 1974-12-18 | Traitement de galettes de semi-conducteurs |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5093775A (fr) |
BE (1) | BE823525A (fr) |
CA (1) | CA1027465A (fr) |
DE (1) | DE2459892A1 (fr) |
GB (1) | GB1483746A (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2326479A1 (fr) * | 1975-10-03 | 1977-04-29 | Radiotechnique Compelec | Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede |
JPS5721321Y2 (fr) * | 1975-12-26 | 1982-05-08 | ||
JPS5288967U (fr) * | 1975-12-26 | 1977-07-02 | ||
JPS5619933Y2 (fr) * | 1978-01-10 | 1981-05-12 | ||
JPS5617021A (en) * | 1979-07-20 | 1981-02-18 | Fujitsu Ltd | Surface treatment of substrate |
JPS5729140U (fr) * | 1980-07-24 | 1982-02-16 | ||
JPS6327784Y2 (fr) * | 1980-09-19 | 1988-07-27 | ||
US4482425A (en) * | 1983-06-27 | 1984-11-13 | Psi Star, Inc. | Liquid etching reactor and method |
US5278104A (en) * | 1989-07-25 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor wafer carrier having a dust cover |
JPH0770505B2 (ja) * | 1989-07-25 | 1995-07-31 | 株式会社東芝 | 半導体装置支持キャリヤ |
US5054519A (en) * | 1990-12-26 | 1991-10-08 | Imtec Products, Inc. | Recirculating chemical bath with inflow and self balancing outflow |
KR100232998B1 (ko) * | 1996-06-05 | 1999-12-01 | 윤종용 | 식각량 조절수단을 갖는 케미컬 배스 유니트 |
EP2260507B1 (fr) * | 2008-03-31 | 2012-09-26 | MEMC Electronic Materials, Inc. | Procédés pour graver le bord d'une tranche de silicium, tranche de silicium, appareil de gravure |
EP2359390A1 (fr) * | 2008-11-19 | 2011-08-24 | MEMC Electronic Materials, Inc. | Procédé et système de décapage du bord d'une tranche de semi-conducteur |
CN113793819B (zh) * | 2021-09-16 | 2024-06-18 | 长江存储科技有限责任公司 | 化学槽及其温度控制方法 |
CN115241330B (zh) * | 2022-09-19 | 2022-12-27 | 英利能源发展(天津)有限公司 | 一种氢氟酸刻蚀太阳能电池用半导体硅片装置 |
-
1974
- 1974-12-18 DE DE19742459892 patent/DE2459892A1/de not_active Withdrawn
- 1974-12-18 JP JP14552574A patent/JPS5093775A/ja active Pending
- 1974-12-18 GB GB5470774A patent/GB1483746A/en not_active Expired
- 1974-12-18 BE BE151653A patent/BE823525A/fr unknown
- 1974-12-18 CA CA216,323A patent/CA1027465A/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5093775A (fr) | 1975-07-26 |
GB1483746A (en) | 1977-08-24 |
DE2459892A1 (de) | 1975-09-04 |
CA1027465A (fr) | 1978-03-07 |
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