CN113793819A - Chemical tank and temperature control method thereof - Google Patents

Chemical tank and temperature control method thereof Download PDF

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Publication number
CN113793819A
CN113793819A CN202111085052.XA CN202111085052A CN113793819A CN 113793819 A CN113793819 A CN 113793819A CN 202111085052 A CN202111085052 A CN 202111085052A CN 113793819 A CN113793819 A CN 113793819A
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China
Prior art keywords
unit
chemical
tank
chemical tank
temperature value
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Pending
Application number
CN202111085052.XA
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Chinese (zh)
Inventor
杨永刚
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Yangtze Memory Technologies Co Ltd
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Yangtze Memory Technologies Co Ltd
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Priority to CN202111085052.XA priority Critical patent/CN113793819A/en
Publication of CN113793819A publication Critical patent/CN113793819A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Abstract

A chemical tank and a temperature control method thereof are disclosed, the chemical tank comprises a tank body and a circulating pipeline outside the tank body; the circulating pipeline is connected with a heating unit and a refrigerating unit which is connected with the heating unit in parallel, and the heating unit and the refrigerating unit are connected into the circulating pipeline in a switching mode. According to the invention, by additionally arranging the refrigeration unit, the heating or refrigeration of the chemicals in the tank body can be realized by switching the heating unit and the refrigeration unit, the temperature of the chemicals in the tank body can be adjusted in a wider range, and further, the working and the test of the chemical characteristics of the chemicals at different temperatures, especially at low temperature can be realized.

Description

Chemical tank and temperature control method thereof
Technical Field
The invention relates to the technical field of semiconductors, in particular to a chemical tank and a temperature control method thereof.
Background
With the increasing popularity and updating of electronic products, the manufacturing process of semiconductors has also been rapidly developed. In the manufacturing process of semiconductors, a WET process (WET) plays a great role throughout the whole process.
The chemical bath is a basic device of the wet process, and it runs through the whole wet process, especially the cleaning process and the etching process.
In order to increase WPH (wafer per hour, chip yield of a machine table), a chemical tank in the prior art is only provided with a heating or normal temperature system. However, as the low temperature characteristics of the chemicals in the chemical tank are developed, the chemical tank of the related art is gradually unable to meet the low temperature demand of the chemicals.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a chemical tank and a temperature control method thereof to achieve adjustment of the temperature of chemicals in the tank body in a wider range.
The invention provides a chemical tank, which comprises a tank body and a circulating pipeline outside the tank body;
the circulating pipeline is connected with a heating unit and a refrigerating unit which is connected with the heating unit in parallel, and the heating unit and the refrigerating unit are connected into the circulating pipeline in a switching mode.
Preferably, the chemical tank further includes a pipe switching unit.
Preferably, the chemical tank further comprises a control unit, and the pipeline switching unit is connected with the control unit.
Preferably, the pipeline switching unit is a three-way valve.
Preferably, the three-way valve includes:
the first port is an inlet and is connected with the tank body;
a second port, which is an outlet, connected to the heating unit; and
a third port, which is an outlet, connected to the refrigeration unit.
Preferably, the line switching unit includes a first valve and a second valve connected in parallel.
Preferably, the first valve is connected with the heating unit and controls the heating unit to be opened and closed; the second valve is connected with the refrigeration unit and controls the opening and closing of the refrigeration unit.
Preferably, the chemical tank further comprises a temperature monitoring unit, and the temperature monitoring unit is positioned inside the tank body.
Preferably, the circulation pipeline is further connected with a water pump, and the water pump is connected to the upstream of the heating unit and the refrigerating unit which are connected in parallel.
Preferably, a filter is further connected to the circulation line, and the filter is connected downstream of the heating unit and the refrigeration unit connected in parallel.
Preferably, the chemical tank further comprises: and the storage unit is connected with the control unit and used for storing each group of chemicals and the preset temperature value corresponding to the film to be corroded.
Preferably, the chemical tank further comprises: a selection unit; the selection unit is connected with the control unit and is used for selecting the types of chemicals and the thin film to be corroded.
A chemical bath temperature control method, the method comprising:
comparing the preset temperature and the real-time temperature in the tank body;
and switching the heating unit and the refrigerating unit according to the comparison result.
Preferably, when the real-time temperature value is higher than the preset temperature value, switching to a refrigeration unit; and when the real-time temperature value is lower than the preset temperature value, switching to a heating unit.
Preferably, the preset temperature value is determined according to the selection characteristic of the chemical to-be-corroded film.
Preferably, the method of determining the preset temperature value comprises:
determining chemicals in the chemical tank and the type of a film to be corroded;
and selecting a corresponding preset temperature value according to the types of the chemicals and the thin film to be corroded.
Preferably, the preset temperature value is one or more temperature values.
According to the chemical tank and the temperature control method thereof provided by the invention, by additionally arranging the refrigerating unit, the heating or refrigerating of the chemicals in the tank body can be realized by switching the heating unit and the refrigerating unit, the temperature of the chemicals in the tank body can be adjusted in a wider range, and further, the working and the test of the chemical characteristics of the chemicals at different temperatures, especially at low temperature can be realized.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
FIG. 1 shows a schematic diagram of a prior art chemical cell;
FIG. 2 is a graph showing the selectivity of a chemical to semiconductor thin film versus temperature;
FIG. 3 shows a schematic view of a chemical tank of a first embodiment of the present invention;
FIG. 4 shows a schematic view of a chemical bath according to a second embodiment of the invention;
FIG. 5 shows an enlarged view at A in FIG. 4;
FIG. 6 shows a schematic view of a chemical tank of a third embodiment of the present invention;
FIG. 7 shows a schematic view of a chemical tank according to a fourth embodiment of the present invention;
FIG. 8 shows a schematic view of a chemical tank of a fifth embodiment of the present invention;
FIG. 9 shows a flow chart of a chemical bath temperature control method of an embodiment of the invention.
Detailed Description
The invention will be described in more detail below with reference to the accompanying drawings. Like elements in the various figures are denoted by like reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. In addition, certain well known components may not be shown.
The present invention may be embodied in various forms, some examples of which are described below.
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples.
FIG. 1 shows a schematic diagram of a prior art chemical cell; as shown in fig. 1, the chemical tank 100 includes a tank body 110 and a circulation line 120 outside the tank body 110, and the circulation line 120 is communicated with the tank body 110.
The water pump 121, the heating unit 122 and the filter 123 are sequentially connected to the circulation pipeline 120, chemicals in the tank body 110 are injected into the heating unit 122 through the water pump 121 to be heated, the heated chemicals are filtered by the filter 123 and then return to the tank body 110, and the chemicals in the tank body 110 are heated through the circulation pipeline 120.
Many chemicals have specificity at low temperatures, and fig. 2 shows a graph of the selectivity ratio of a chemical to a semiconductor thin film versus temperature; as shown in fig. 2, the selectivity of the chemical to the semiconductor thin film is inversely related to the temperature, i.e., the lower the temperature, the greater the selectivity of the chemical to the semiconductor thin film. However, in the related art, the chemical in the tank body 110 is only maintained at a normal temperature or heated, and the temperature of the chemical is not adjusted to be equal to or lower than the room temperature, and as shown in fig. 2, the shaded area in fig. 2 is a temperature region that cannot be adjusted by the related art chemical tank.
FIG. 3 shows a schematic view of a chemical tank of a first embodiment of the present invention; as shown in fig. 3, the chemical tank 200 includes a tank body 210 and a circulation pipeline 220 outside the tank body 210, wherein a heating unit 222 and a refrigeration unit 224 connected in parallel with the heating unit 222 are connected to the circulation pipeline 220, and the heating unit 222 and the refrigeration unit 224 are connected to the inside of the circulation pipeline 220 in a switching manner.
In this embodiment, the refrigeration unit 224 may adopt a compression refrigeration device, a centrifugal refrigeration device, a semiconductor refrigeration device, and the like, and the specific type of the cooling unit 222 is not limited in this embodiment.
The circulation pipeline 220 is further connected with a water pump 221 and a filter 223, wherein the water pump 221 is connected to the upstream of the heating unit 222 and the cooling unit 224 which are connected in parallel, and the water pump 221 is used for conveying the chemicals in the tank 210 to the heating unit 222 and the cooling unit 224; the filter 223 is connected downstream of the heating unit 222 and the cooling unit 224 connected in parallel, and is used for filtering chemicals in the heating unit 222 and the cooling unit 224.
The circulation pipeline 220 of this embodiment is further connected with a drain pipeline 226, and the drain pipeline 226 is connected between the heating unit 222 and the refrigerating unit 224 which are connected in parallel and the filter 223, and is used for draining the liquid in the tank body 210 and the circulation pipeline 220; a control valve 227 is connected to the drain line 226 for opening and closing the drain line 226.
In this embodiment, the heating unit 222 and the cooling unit 224 may be switched to heat or cool the chemical in the tank 210, and the temperature of the chemical in the tank 210 may be adjusted in a low temperature range.
FIG. 4 shows a schematic view of a chemical bath according to a second embodiment of the invention; FIG. 5 shows an enlarged view at A in FIG. 4; as shown in fig. 4 and 5, the circulation line 220 further includes a line switching unit 225, and the line switching unit 225 switches between the heating unit 222 and the cooling unit 224.
In this embodiment, the pipeline switching unit 225 is a three-way valve, the three-way valve includes three ports, namely, a first port 2251, a second port 2252 and a third port 2253, wherein the first port 2251 is an inlet, the second port 2252 and the third port 2253 are outlets, the first port 2251 is connected to the tank 210 through the water pump 121, and the second port 2252 and the third port 2253 are connected to the heating unit 222 and the cooling unit 224, respectively.
In this embodiment, the three-way valve selects the heating unit 222 or the cooling unit 224 by selecting an outlet; specifically, the three-way valve selects the second port 2252, the heating unit 222 is connected to the circulation line 220, and the three-way valve selects the third port 2253, and then the refrigerant unit 224 is switched.
FIG. 6 shows a schematic view of a chemical tank of a third embodiment of the present invention; as shown in fig. 6, the present embodiment is different from the second embodiment in that the pipeline switching unit 225 includes a first valve 2251 ' and a second valve 2252 ' connected in parallel, wherein the first valve 2251 ' is connected to the heating unit 222 to control the heating unit 222 to open and close; the second valve 2252' is connected to the refrigeration unit 224 and controls the opening and closing of the refrigeration unit 224.
FIG. 7 shows a schematic view of a chemical tank according to a fourth embodiment of the present invention; as shown in fig. 7, the chemical tank 200 further includes a control unit 230, and the pipeline switching unit 225 is electrically connected to the control unit 230.
The control unit 230 of this embodiment is electrically connected to the three-way valve, for example, to select an outlet of the three-way valve, and further to switch between the heating unit 222 and the cooling unit 224. The control unit 230 of the present embodiment is connected to the first valve 2251 'and the second valve 2252', and controls the first valve 2251 'and the second valve 2252' to open and close.
The control unit 230 realizes the switching of the heating unit 222 and the cooling unit 224 through the pipeline switching unit 225.
In this embodiment, the chemical tank 200 further includes a temperature monitoring unit 240, and the temperature monitoring unit 240 is located inside the tank body 210 and is used for monitoring the real-time temperature of the chemicals in the tank body 210.
The temperature monitoring unit 240 is connected to the control unit 230, and the control unit 230 receives a real-time temperature value of the temperature monitoring unit 240 and switches the connection between the heating unit 222 and the cooling unit 224 according to a comparison value between the real-time temperature value and a preset temperature value. Specifically, when the real-time temperature value is higher than the preset temperature value, the operation is switched to the cooling unit 224, and when the real-time temperature value is lower than the preset temperature value, the operation is switched to the heating unit 222.
In this embodiment, the control unit 230 is, for example, a PLC controller or any other control electronic device, and the present embodiment does not limit the type and model of the control unit. The temperature monitoring unit 240 of the present embodiment is, for example, a temperature sensor, and the like, and the embodiment of the present invention does not limit the type of the temperature monitoring unit.
FIG. 8 shows a schematic view of a chemical tank of a fifth embodiment of the present invention; as shown in fig. 8, in this embodiment, the chemical tank further includes a storage unit 250 and a selection unit 260, the storage unit 250 and the selection unit 260 are both connected to the control unit 230, the storage unit 250 is used for storing a preset temperature value corresponding to each group of chemicals and a film to be etched, and the selection unit 260 is used for selecting the types of the chemicals and the film to be etched.
The selection ratio of the chemical to the film to be corroded changes at different temperatures, and the preset temperature is determined according to the selection characteristic of the chemical in the tank body 210 to the film to be corroded.
For example, in a specific embodiment, the selection ratio of the chemical to the film to be etched is the highest at a first temperature, and the first temperature is the preset temperature value, so as to realize that the chemical etches the film to be etched at the preset temperature; the preset temperature value may also be a plurality of temperature values, for example, in a specific embodiment, the preset temperature value is a plurality of discrete temperatures, and the plurality of discrete temperatures form a temperature-time curve at the same or different time intervals, so as to implement a test of chemical characteristics of the chemical at different temperatures.
When the chemical in this embodiment corrodes the film to be corroded at the preset temperature, the selection unit 260 selects the chemical in the tank 210 and the type of the film to be corroded, and the control unit 230 selects the preset temperature value corresponding to the chemical and the film to be corroded; meanwhile, the temperature monitoring unit 240 measures a real-time temperature value of the chemical and transmits the real-time temperature value to the control unit 230, the control unit 230 compares the real-time temperature value with a preset temperature value, and switches to the refrigeration unit 224 when the real-time temperature value is higher than the preset temperature value, and switches to the heating unit 222 when the real-time temperature value is lower than the preset temperature value.
In this embodiment, when testing chemical characteristics of a chemical at different temperatures, the selection unit 260 selects the types of the chemical and the to-be-etched film in the tank 210, and the control unit 230 selects a temperature-time curve corresponding to the chemical and the to-be-etched film; meanwhile, the temperature monitoring unit 240 measures a real-time temperature value of the chemical and transmits the real-time temperature value to the control unit 230, and the control unit 230 compares the real-time temperature value with each discrete temperature in the temperature-time curve in sequence to switch to the refrigeration unit 224 or the heating unit 222, so that each discrete temperature is reached in sequence according to a time interval of the temperature-time curve, and then a chemical characteristic test of the chemical at different temperatures is realized.
Fig. 9 shows a flowchart of a chemical bath temperature control method of an embodiment of the present invention, which includes, as shown in fig. 9:
s10: and comparing the preset temperature and the real-time temperature in the tank body.
In this embodiment, the chemical in the tank body has different selective characteristics of the film to be etched under different conditions, and the preset temperature value is determined according to the selective characteristics of the chemical to be etched. Specifically, firstly, determining the chemical in the chemical tank and the type of the film to be corroded; and selecting a corresponding preset temperature value according to the types of the chemicals and the thin film to be corroded.
Wherein the preset temperature value is one or more temperature values. When the preset temperature value is a temperature value, it is the optimal etching temperature of the chemical and the film to be etched, for example, the temperature at which the selection ratio of the chemical to the film to be etched is the highest. It should be noted that, when the preset temperature value may also be the corrosion temperature under other conditions, the preset temperature may be specifically set according to the requirement. When the preset temperature value is a plurality of temperature values, the plurality of temperature values are sequentially set at the same or different time intervals.
S20: and switching the heating unit and the refrigerating unit according to the comparison result.
Specifically, when the real-time temperature value is higher than the preset temperature value, switching to a refrigeration unit; and when the real-time temperature value is lower than the preset temperature value, switching to a heating unit.
According to the chemical tank and the temperature control method thereof provided by the invention, by additionally arranging the refrigerating unit, the heating or refrigerating of the chemicals in the tank body can be realized by switching the heating unit and the refrigerating unit, the temperature of the chemicals in the tank body can be adjusted in a wider range, and further, the working and the test of the chemical characteristics of the chemicals at different temperatures, especially at low temperature can be realized.
While embodiments in accordance with the invention have been described above, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims (17)

1. A chemical tank is characterized by comprising a tank body and a circulating pipeline outside the tank body;
the circulating pipeline is connected with a heating unit and a refrigerating unit which is connected with the heating unit in parallel, and the heating unit and the refrigerating unit are connected into the circulating pipeline in a switching mode.
2. The chemical tank of claim 1, further comprising a line switching unit.
3. The detection method according to claim 2, wherein the chemical tank further comprises a control unit, and the pipeline switching unit is connected to the control unit.
4. The chemical tank as claimed in claim 2, wherein the line switching unit is a three-way valve.
5. A chemical tank according to claim 3, wherein the three-way valve comprises:
the first port is an inlet and is connected with the tank body;
a second port, which is an outlet, connected to the heating unit; and
a third port, which is an outlet, connected to the refrigeration unit.
6. The chemical tank of claim 2, wherein the line switching unit comprises a first valve and a second valve in parallel.
7. The chemical tank of claim 6, wherein the first valve is connected to the heating unit to control the heating unit to open and close; the second valve is connected with the refrigeration unit and controls the opening and closing of the refrigeration unit.
8. The chemical tank of claim 1, further comprising a temperature monitoring unit located inside the tank body.
9. The chemical tank of claim 1, wherein a water pump is further connected to the circulation line, and the water pump is connected upstream of the heating unit and the cooling unit connected in parallel.
10. The chemical tank of claim 1, wherein a filter is further connected to the circulation line, the filter being connected downstream of the heating unit and the cooling unit in parallel.
11. The chemical tank of claim 1, further comprising: and the storage unit is connected with the control unit and used for storing each group of chemicals and the preset temperature value corresponding to the film to be corroded.
12. The chemical tank of claim 1, further comprising: a selection unit; the selection unit is connected with the control unit and is used for selecting the types of chemicals and the thin film to be corroded.
13. A chemical bath temperature control method, comprising:
comparing the preset temperature and the real-time temperature in the tank body;
and switching the heating unit and the refrigerating unit according to the comparison result.
14. The chemical bath temperature control method according to claim 13, wherein when the real-time temperature value is higher than the preset temperature value, switching to a refrigeration unit; and when the real-time temperature value is lower than the preset temperature value, switching to a heating unit.
15. The chemical bath temperature control method according to claim 13, wherein the preset temperature value is determined according to a selective characteristic of a chemical to a thin film to be etched.
16. The chemical bath temperature control method according to claim 13 or 15, wherein the method of determining the preset temperature value comprises:
determining chemicals in the chemical tank and the type of a film to be corroded;
and selecting a corresponding preset temperature value according to the types of the chemicals and the thin film to be corroded.
17. The chemical tank temperature control method according to claim 13, wherein the preset temperature value is one or more temperature values.
CN202111085052.XA 2021-09-16 2021-09-16 Chemical tank and temperature control method thereof Pending CN113793819A (en)

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