CN209992873U - Semiconductor temperature control device test platform - Google Patents
Semiconductor temperature control device test platform Download PDFInfo
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- CN209992873U CN209992873U CN201920710633.XU CN201920710633U CN209992873U CN 209992873 U CN209992873 U CN 209992873U CN 201920710633 U CN201920710633 U CN 201920710633U CN 209992873 U CN209992873 U CN 209992873U
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Abstract
The utility model discloses a test platform of a semiconductor temperature control device, which relates to the field of temperature control and comprises a refrigeration system and a circulating system, the refrigerating system comprises a compressor, an unloading valve, a condenser, an electronic expansion valve and an evaporator, wherein the compressor is connected with the unloading valve, the condenser is connected with the evaporator through the unloading valve and the electronic expansion valve respectively, the testing platform meets the combination and position change of different devices through a reserved interface, realizes the comparison of different schemes, the early stage test of product design provides design basis, and different kinds of interfaces are reserved on the platform to realize the change of different circulation system schemes, simultaneously, the utility model provides a heater is built-in, the heater is external and contain the circulation system scheme of bypass, the utility model discloses a combination and the position change of different devices can satisfy various customer demands, and application scope is wide.
Description
Technical Field
The utility model relates to a temperature control field, concretely relates to semiconductor temperature control device test platform.
Background
The semiconductor temperature control device is used as auxiliary equipment for producing semiconductors, and is required to keep constant temperature output in the process of manufacturing wafers, and meanwhile, the semiconductor temperature control device also has the requirement on a temperature control curve for temperature increase and decrease.
Because the final temperature control effect of the equipment in actual design and production is inconsistent with expectation, the equipment needs to pass the test of the test platform, and the test platform preferably has higher universality, so that the equipment can be matched with the equipment composition and the pipeline direction at will according to actual needs at the previous stage as far as possible to test whether the requirements of customers are met.
Disclosure of Invention
An object of the utility model is to provide a semiconductor temperature control device test platform, this test platform is through reserving the interface, satisfies the combination and the position change of different devices, realizes the comparison of different schemes, tests in product design earlier stage and provides the design foundation, through reserving different types of interface on the platform, realizes the change of different circulation system schemes, provides the circulation system scheme that the heater is built-in simultaneously, the heater is external and contain the bypass, the utility model discloses a combination and the position change of different devices can satisfy various customer demands, and application scope is wide.
A semiconductor temperature control device test platform comprises a refrigeration system and a circulating system, wherein the refrigeration system comprises a compressor, an unloading valve, a condenser, an electronic expansion valve and an evaporator; the refrigeration system is used to control temperature.
The circulating system comprises a heater, a water tank, a water pump, an inlet temperature sensor, an outlet temperature sensor and a return temperature sensor, the water tank, the water pump and the evaporator are sequentially connected through pipelines to form a closed loop, the inlet temperature sensor, the outlet temperature sensor and the return temperature sensor are all connected to a loop pipeline, and a first interface, a second interface, a third interface, a fourth interface, a fifth interface and a sixth interface are further arranged on the closed loop pipeline in the circulating system; the circulation system is used for liquid circulation.
The heater is arranged in the water tank, the water tank is located between the interface four and the interface five, the water pump is located between the interface five and the interface six, the inlet temperature sensor is located in front of the interface four, the outlet temperature sensor is located behind the interface six, and the return temperature sensor is located behind the interface three. The heater is a built-in scheme, in the circulating system of the test platform, the positions of a first interface, a second interface, a third interface, a fourth interface, a fifth interface, a sixth interface, an inlet temperature sensor, an outlet temperature sensor and a return temperature sensor are fixed and unchanged, and the positions of the heater, the water tank and the water pump can be changed according to test requirements.
Preferably, the first interface, the second interface, the third interface, the fourth interface, the fifth interface and the sixth interface include, but are not limited to, a hand valve, a quick-plug valve and a three-way valve. The combination of one or more of a hand valve, a quick plug, a tee joint and the like can be realized, and the arbitrary combination and pipeline collocation of different devices can be met.
Preferably, the heater can also be arranged outside the water tank, the heater is connected between the interface four and the interface five, the water tank is connected between the interface two and the interface three, and the water pump is connected between the interface one and the interface two. The heater heats the water and then conveys the water into the water tank through a pipeline, wherein no matter how the positions of the heater and the water tank are changed, the inlet temperature sensor is required to be ensured to be positioned in front of the heater, and the outlet temperature sensor is positioned behind the heater.
Preferably, the water tank and the interface six can be connected through a pipeline and a hand valve, and a bypass is added. A pipeline and a hand valve are added to the water tank at the interface six, and a bypass is added.
The utility model has the advantages that: this test platform is through reserving the interface, satisfies the combination and the position change of different devices, realizes the comparison of different schemes, and the test provides the design foundation in product design earlier stage, through reserving different types of interfaces on the platform, realizes the change of different circulation system schemes, provides the circulation system scheme that the heater is built-in simultaneously, the heater is external and contain the bypass, the utility model discloses a combination and the position change of different devices can satisfy various customer demands, and application scope is wide.
Drawings
FIG. 1 is a schematic diagram of a refrigeration system and a circulation system with a built-in solution of a heater according to the present invention;
FIG. 2 is a schematic diagram of a refrigeration system and a circulation system according to an external arrangement of a heater in the present invention;
FIG. 3 is a schematic diagram of a refrigeration system and circulation system incorporating a bypass scheme in accordance with the present invention;
the system comprises a compressor 1, a compressor 2, an unloading valve 3, a condenser 4, an electronic expansion valve 5, an evaporator 6, a heater 7, a water tank 8, a water pump 9, an inlet temperature sensor 10, an outlet temperature sensor 11, a return temperature sensor 12, a first interface 13, a second interface 14, a third interface 15, a fourth interface 16, a fifth interface 17 and a sixth interface.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the functions of the invention easy to understand, the invention is further explained by combining the specific embodiments.
As shown in fig. 1 to 3, a semiconductor temperature control device test platform comprises a refrigeration system and a circulation system, wherein the refrigeration system comprises a compressor 1, an unloading valve 2, a condenser 3, an electronic expansion valve 4 and an evaporator 5, the compressor 1 is connected with the unloading valve 2, and the condenser 3 is connected with the evaporator 5 through the unloading valve 2 and the electronic expansion valve 4 respectively; the refrigeration system is used to control temperature.
The circulating system comprises a heater 6, a water tank 7, a water pump 8, an inlet temperature sensor 9, an outlet temperature sensor 10 and a return temperature sensor 11, the water tank 7, the water pump 8 and the evaporator 5 are sequentially connected through pipelines to form a closed loop, the inlet temperature sensor 9, the outlet temperature sensor 10 and the return temperature sensor 11 are all connected to a loop pipeline, and a first connector 12, a second connector 13, a third connector 14, a fourth connector 15, a fifth connector 16 and a sixth connector 17 are further arranged on the closed loop pipeline in the circulating system; the circulation system is used for liquid circulation.
The heater 6 is arranged in the water tank 7, the water tank 7 is positioned between a port four 15 and a port five 16, the water pump 8 is positioned between the port five 16 and a port six 17, the inlet temperature sensor 9 is positioned in front of the port four 15, the outlet temperature sensor 10 is positioned behind the port six 17, and the return temperature sensor 11 is positioned behind the port three 14. The test platform meets the combination and position change of different devices through the reserved interface, realizes the comparison of different schemes, and provides design basis for early test of product design.
The first port 12, the second port 13, the third port 14, the fourth port 15, the fifth port 16 and the sixth port 17 include, but are not limited to, a hand valve, a quick-insertion valve and a three-way valve. The interface is formed by one or a combination of a plurality of hand valves, quick plugs, tee joints and the like, and meets the requirements of arbitrary combination and pipeline collocation of different devices.
The heater 6 can also be arranged outside the water tank 7, the heater 6 is connected between the interface four 15 and the interface five 16, the water tank 7 is connected between the interface two 13 and the interface three 14, and the water pump 8 is connected between the interface one 12 and the interface two 13. The characteristics of the circulation system of the external scheme of the heater 6 are different from the characteristics of the circulation system of the internal scheme of the heater 6, and the method is suitable for different conditions.
The water tank 7 and the connector six 17 can be connected through a pipeline and a hand valve, and a bypass is added. And a bypass is added to provide more choices and meet more customer requirements.
The specific implementation mode and principle are as follows:
in the circulation system of the heater 6 built-in scheme, a heater 6 is arranged in a water tank 7, the water tank 7 is arranged between a connector four 15 and a connector five 16, a water pump 8 is arranged between a connector five 16 and a connector six 17, temperature control liquid flows out of an evaporator 5, flows into the water tank for storage, flows out through the water pump 8, circulates through a pipeline and then flows back to the evaporator 5 to form a circulation loop, the heater 6 is arranged in the water tank 7 and is used for heating the temperature control liquid in the water tank 7, and at the moment, an inlet temperature sensor 9 and an outlet temperature sensor 10 are respectively arranged at the positions of an inlet and an outlet of the water tank 7 (in the heater 6 built-in scheme, an external load is arranged behind the water tank 7, the temperature control liquid flows out of the evaporator 5, passes through the water tank 7 and then passes through the load;
in the circulating system of the external scheme of the heater 6, the heater 6 is arranged outside the water tank 7, the heater 6 is connected between the interface four 15 and the interface five 16, the water tank 7 is connected between the interface two 13 and the interface three 14, the water pump 8 is connected between the interface one 12 and the interface two 13, the temperature control liquid flows out of the evaporator 5, is heated to a required temperature through the heater 6, passes through a load, then flows back to the water tank 7, and finally flows back to the evaporator 5 to form a circulating loop, and at the moment, the inlet temperature sensor 9 and the outlet temperature sensor 10 are respectively positioned at the inlet and the outlet of the heater 6, as shown in fig. 2;
in the scheme of the built-in heater 6, a bypass can be externally connected to the water tank 7, as shown in fig. 3, a pipeline and a hand valve are added to the water tank 7 at a connector six 17, the bypass is controlled to be on or off by the hand valve, the temperature control liquid can directly flow back to the water tank 7 through the bypass after flowing out of the water tank 7 when flowing through the bypass, and the outlet temperature sensor 10 is positioned behind the connector six 17, so that the temperature control liquid can flow back to the water tank 7 to control the temperature again when the temperature sensor 10 detects that the temperature of the temperature control liquid does not reach the standard;
different types of interfaces are reserved, so that the change of different circulating system schemes is realized, the change can be carried out according to the test requirements, and more requirements are met.
Based on the above, the utility model discloses test platform satisfies the combination and the position change of different devices through reserving the interface, realizes the comparison of different schemes, and the test provides the design foundation in product design earlier stage, through reserving different types of interface on the platform, realizes the change of different circulation system schemes, provides the circulation system scheme that the heater is built-in, the heater is external and contain the bypass simultaneously, the utility model discloses a combination and the position change of different devices can satisfy various customer demands, and application scope is wide.
It will be appreciated by those skilled in the art that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The embodiments disclosed above are therefore to be considered in all respects as illustrative and not restrictive. All changes which come within the scope of the invention or which are equivalent to the scope of the invention are embraced by the invention.
Claims (4)
1. The semiconductor temperature control device test platform is characterized by comprising a refrigeration system and a circulating system, wherein the refrigeration system comprises a compressor (1), an unloading valve (2), a condenser (3), an electronic expansion valve (4) and an evaporator (5), the compressor (1) is connected with the unloading valve (2), and the condenser (3) is connected with the evaporator (5) through the unloading valve (2) and the electronic expansion valve (4) respectively;
the circulating system comprises a heater (6), a water tank (7), a water pump (8), an inlet temperature sensor (9), an outlet temperature sensor (10) and a return temperature sensor (11), the water tank (7), the water pump (8) and the evaporator (5) are sequentially connected through pipelines to form a closed loop, the inlet temperature sensor (9), the outlet temperature sensor (10) and the return temperature sensor (11) are all connected to a loop pipeline, and a closed loop pipeline in the circulating system is further provided with a first interface (12), a second interface (13), a third interface (14), a fourth interface (15), a fifth interface (16) and a sixth interface (17);
the water heater is characterized in that the heater (6) is arranged in the water tank (7), the water tank (7) is located between a connector four (15) and a connector five (16), the water pump (8) is located between the connector five (16) and a connector six (17), the inlet temperature sensor (9) is located in front of the connector four (15), the outlet temperature sensor (10) is located behind the connector six (17), and the return temperature sensor (11) is located behind the connector three (14).
2. The semiconductor temperature control device test platform of claim 1, wherein: the first connector (12), the second connector (13), the third connector (14), the fourth connector (15), the fifth connector (16) and the sixth connector (17) include, but are not limited to, a hand valve, a quick-insertion valve and a three-way valve.
3. The semiconductor temperature control device test platform of claim 1, wherein: the heater (6) can also be arranged outside the water tank (7), the heater (6) is connected between a connector four (15) and a connector five (16), the water tank (7) is connected between a connector two (13) and a connector three (14), and the water pump (8) is connected between a connector one (12) and a connector two (13).
4. The semiconductor temperature control device test platform of claim 1, wherein: the water tank (7) and the interface six (17) can be connected through a pipeline and a hand valve, and a bypass is added.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201920710633.XU CN209992873U (en) | 2019-05-17 | 2019-05-17 | Semiconductor temperature control device test platform |
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| CN201920710633.XU CN209992873U (en) | 2019-05-17 | 2019-05-17 | Semiconductor temperature control device test platform |
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| CN209992873U true CN209992873U (en) | 2020-01-24 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397257A (en) * | 2020-03-25 | 2020-07-10 | 北京京仪自动化装备技术有限公司 | Temperature control device and method |
| CN112181025A (en) * | 2020-10-29 | 2021-01-05 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112346493A (en) * | 2020-10-29 | 2021-02-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112414001A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system for semiconductor and control method thereof |
| CN112684828A (en) * | 2021-03-12 | 2021-04-20 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112902484A (en) * | 2021-02-09 | 2021-06-04 | 北京京仪自动化装备技术有限公司 | Temperature regulation and control system and temperature regulation and control method |
| CN112947629A (en) * | 2021-03-09 | 2021-06-11 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control equipment and temperature control method |
-
2019
- 2019-05-17 CN CN201920710633.XU patent/CN209992873U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111397257A (en) * | 2020-03-25 | 2020-07-10 | 北京京仪自动化装备技术有限公司 | Temperature control device and method |
| CN112181025A (en) * | 2020-10-29 | 2021-01-05 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112346493A (en) * | 2020-10-29 | 2021-02-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112181025B (en) * | 2020-10-29 | 2021-10-26 | 北京京仪自动化装备技术股份有限公司 | Temperature control equipment and method |
| CN112346493B (en) * | 2020-10-29 | 2021-11-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112414001A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system for semiconductor and control method thereof |
| CN112902484A (en) * | 2021-02-09 | 2021-06-04 | 北京京仪自动化装备技术有限公司 | Temperature regulation and control system and temperature regulation and control method |
| CN112947629A (en) * | 2021-03-09 | 2021-06-11 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control equipment and temperature control method |
| CN112947629B (en) * | 2021-03-09 | 2022-03-22 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control equipment and temperature control method |
| CN112684828A (en) * | 2021-03-12 | 2021-04-20 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112684828B (en) * | 2021-03-12 | 2021-07-20 | 北京京仪自动化装备技术股份有限公司 | Temperature control system and temperature control method for semiconductor production |
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