DE69031234D1 - Auftragvorrichtung zum Auftragen einer Trockenfilm-Lotmaske auf eine Platte - Google Patents

Auftragvorrichtung zum Auftragen einer Trockenfilm-Lotmaske auf eine Platte

Info

Publication number
DE69031234D1
DE69031234D1 DE69031234T DE69031234T DE69031234D1 DE 69031234 D1 DE69031234 D1 DE 69031234D1 DE 69031234 T DE69031234 T DE 69031234T DE 69031234 T DE69031234 T DE 69031234T DE 69031234 D1 DE69031234 D1 DE 69031234D1
Authority
DE
Germany
Prior art keywords
board
tacking
rolls
film
leading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69031234T
Other languages
English (en)
Other versions
DE69031234T2 (de
Inventor
Robert C Stumpf
Jose L Correa
Charles L Farnum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Morton International LLC
Original Assignee
Morton International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton International LLC filed Critical Morton International LLC
Publication of DE69031234D1 publication Critical patent/DE69031234D1/de
Application granted granted Critical
Publication of DE69031234T2 publication Critical patent/DE69031234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1045Intermittent pressing, e.g. by oscillating or reciprocating motion of the pressing means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425Printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/068Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702For plural parts or plural areas of single part
    • Y10T156/1712Indefinite or running length work
    • Y10T156/1737Discontinuous, spaced area, and/or patterned pressing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Sampling And Sample Adjustment (AREA)
DE69031234T 1989-03-02 1990-02-26 Auftragvorrichtung zum Auftragen einer Trockenfilm-Lotmaske auf eine Platte Expired - Fee Related DE69031234T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/318,023 US4946524A (en) 1989-03-02 1989-03-02 Applicator and method for applying dry film solder mask on a board

Publications (2)

Publication Number Publication Date
DE69031234D1 true DE69031234D1 (de) 1997-09-18
DE69031234T2 DE69031234T2 (de) 1997-12-18

Family

ID=23236299

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69031234T Expired - Fee Related DE69031234T2 (de) 1989-03-02 1990-02-26 Auftragvorrichtung zum Auftragen einer Trockenfilm-Lotmaske auf eine Platte

Country Status (10)

Country Link
US (1) US4946524A (de)
EP (1) EP0388039B1 (de)
JP (1) JPH02283096A (de)
KR (1) KR970004027B1 (de)
AT (1) ATE156751T1 (de)
AU (1) AU626633B2 (de)
CA (1) CA1301953C (de)
DE (1) DE69031234T2 (de)
NO (1) NO900978L (de)
SG (1) SG50503A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2034601A1 (en) * 1990-02-12 1991-08-13 James Briguglio Solder mask vacuum laminator conversion
JP2637261B2 (ja) * 1990-05-22 1997-08-06 ソマール株式会社 ラミネータ
IT1250461B (it) * 1991-08-09 1995-04-07 Morton Int Inc Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
US5499756A (en) * 1995-02-03 1996-03-19 Motorola, Inc. Method of applying a tacking agent to a printed circuit board
US6002322A (en) * 1998-05-05 1999-12-14 Littelfuse, Inc. Chip protector surface-mounted fuse device
EP1009206A3 (de) * 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Verfahren zur Vakuumlaminierung eines Klebefilms
IT1313117B1 (it) * 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di
IT1313118B1 (it) 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello
AU2002356956A1 (en) * 2001-11-16 2003-06-10 North Carolina State University Biomedical electrochemical sensor array and method of fabrication
CN101180727B (zh) * 2005-05-23 2010-06-16 揖斐电株式会社 印刷线路板及其制造方法
US20100040986A1 (en) * 2006-09-22 2010-02-18 Masatoshi Yamaguchi Process for manufacturing light guide
CN107672307B (zh) * 2017-11-14 2019-06-21 温州富捷科技股份有限公司 全自动覆膜机

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3658629A (en) * 1970-02-27 1972-04-25 Ibm Photopolymer resist sheet laminator
JPS5794749A (en) * 1980-12-04 1982-06-12 Hitachi Chem Co Ltd Laminating apparatus for photosensitive film
US4387000A (en) * 1981-02-17 1983-06-07 E. I. Du Pont De Nemours And Company Laminating roll actuating crank mechanism
IT1210033B (it) * 1982-02-10 1989-09-06 Bc Chem Srl Macchina per applicare una porzione di film fotosensibile su almeno unafaccia di una lastra piana avente una estensione superficiale maggiore di detta porzione
US4495014A (en) * 1983-02-18 1985-01-22 E. I. Du Pont De Nemours And Company Laminating and trimming process
DE3334009C2 (de) * 1983-09-21 1985-11-14 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Laminieren eines Folienstückes auf einen plattenförmigen Gegenstand
JPS6071229A (ja) * 1983-09-29 1985-04-23 Somar Corp オ−トラミネ−タ
DE3420428A1 (de) * 1984-06-01 1985-12-05 ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen Verfahren zum laminieren eines films und vorrichtung zur durchfuehrung des verfahrens
US4714504A (en) * 1986-10-10 1987-12-22 Ibm Corporation Process of laminating a photosensitive layer of a substrate
DK8689A (da) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort
US4992354A (en) * 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
IT1224722B (it) * 1988-08-26 1990-10-18 Morton Thiokol Inc Societa Del Laminatore automatico ad elevata velocita' di laminazione per laproduzione di pannelli per circuiti stampati

Also Published As

Publication number Publication date
CA1301953C (en) 1992-05-26
US4946524A (en) 1990-08-07
EP0388039A3 (de) 1991-11-06
KR970004027B1 (ko) 1997-03-24
AU626633B2 (en) 1992-08-06
EP0388039B1 (de) 1997-08-13
AU4933090A (en) 1990-09-06
NO900978L (no) 1990-09-03
DE69031234T2 (de) 1997-12-18
ATE156751T1 (de) 1997-08-15
JPH02283096A (ja) 1990-11-20
SG50503A1 (en) 1998-07-20
EP0388039A2 (de) 1990-09-19
KR900015589A (ko) 1990-10-27
JPH0512879B2 (de) 1993-02-19
NO900978D0 (no) 1990-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee