NO900978D0 - Applikator for aa paafoere toerrfilm-loddemaske paa et kort. - Google Patents
Applikator for aa paafoere toerrfilm-loddemaske paa et kort.Info
- Publication number
- NO900978D0 NO900978D0 NO900978A NO900978A NO900978D0 NO 900978 D0 NO900978 D0 NO 900978D0 NO 900978 A NO900978 A NO 900978A NO 900978 A NO900978 A NO 900978A NO 900978 D0 NO900978 D0 NO 900978D0
- Authority
- NO
- Norway
- Prior art keywords
- board
- tacking
- rolls
- film
- leading
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1045—Intermittent pressing, e.g. by oscillating or reciprocating motion of the pressing means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1712—Indefinite or running length work
- Y10T156/1737—Discontinuous, spaced area, and/or patterned pressing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Sampling And Sample Adjustment (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/318,023 US4946524A (en) | 1989-03-02 | 1989-03-02 | Applicator and method for applying dry film solder mask on a board |
Publications (2)
Publication Number | Publication Date |
---|---|
NO900978D0 true NO900978D0 (no) | 1990-03-01 |
NO900978L NO900978L (no) | 1990-09-03 |
Family
ID=23236299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO90900978A NO900978L (no) | 1989-03-02 | 1990-03-01 | Applikasjon for aa paafoere toerrfilm-loddemaske paa et kort. |
Country Status (10)
Country | Link |
---|---|
US (1) | US4946524A (no) |
EP (1) | EP0388039B1 (no) |
JP (1) | JPH02283096A (no) |
KR (1) | KR970004027B1 (no) |
AT (1) | ATE156751T1 (no) |
AU (1) | AU626633B2 (no) |
CA (1) | CA1301953C (no) |
DE (1) | DE69031234T2 (no) |
NO (1) | NO900978L (no) |
SG (1) | SG50503A1 (no) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2034601A1 (en) * | 1990-02-12 | 1991-08-13 | James Briguglio | Solder mask vacuum laminator conversion |
JP2637261B2 (ja) * | 1990-05-22 | 1997-08-06 | ソマール株式会社 | ラミネータ |
IT1250461B (it) * | 1991-08-09 | 1995-04-07 | Morton Int Inc | Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati. |
US5499756A (en) * | 1995-02-03 | 1996-03-19 | Motorola, Inc. | Method of applying a tacking agent to a printed circuit board |
US6002322A (en) * | 1998-05-05 | 1999-12-14 | Littelfuse, Inc. | Chip protector surface-mounted fuse device |
EP1009206A3 (en) * | 1998-12-02 | 2003-01-15 | Ajinomoto Co., Inc. | Method of vacuum-laminating adhesive film |
IT1313118B1 (it) | 1999-08-25 | 2002-06-17 | Morton Int Inc | Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello |
IT1313117B1 (it) * | 1999-08-25 | 2002-06-17 | Morton Int Inc | Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di |
CA2467043C (en) * | 2001-11-16 | 2006-03-14 | North Carolina State University | Biomedical electrochemical sensor array and method of fabrication |
KR20100025597A (ko) * | 2005-05-23 | 2010-03-09 | 이비덴 가부시키가이샤 | 프린트 배선판 |
US20100040986A1 (en) * | 2006-09-22 | 2010-02-18 | Masatoshi Yamaguchi | Process for manufacturing light guide |
CN107672307B (zh) * | 2017-11-14 | 2019-06-21 | 温州富捷科技股份有限公司 | 全自动覆膜机 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3658629A (en) * | 1970-02-27 | 1972-04-25 | Ibm | Photopolymer resist sheet laminator |
JPS5794749A (en) * | 1980-12-04 | 1982-06-12 | Hitachi Chem Co Ltd | Laminating apparatus for photosensitive film |
US4387000A (en) * | 1981-02-17 | 1983-06-07 | E. I. Du Pont De Nemours And Company | Laminating roll actuating crank mechanism |
IT1210033B (it) * | 1982-02-10 | 1989-09-06 | Bc Chem Srl | Macchina per applicare una porzione di film fotosensibile su almeno unafaccia di una lastra piana avente una estensione superficiale maggiore di detta porzione |
US4495014A (en) * | 1983-02-18 | 1985-01-22 | E. I. Du Pont De Nemours And Company | Laminating and trimming process |
DE3334009C2 (de) * | 1983-09-21 | 1985-11-14 | Gebr. Schmid GmbH & Co, 7290 Freudenstadt | Vorrichtung zum Laminieren eines Folienstückes auf einen plattenförmigen Gegenstand |
JPS6071229A (ja) * | 1983-09-29 | 1985-04-23 | Somar Corp | オ−トラミネ−タ |
DE3420428A1 (de) * | 1984-06-01 | 1985-12-05 | ELTI Apparatebau und Elektronik GmbH, 6106 Erzhausen | Verfahren zum laminieren eines films und vorrichtung zur durchfuehrung des verfahrens |
US4714504A (en) * | 1986-10-10 | 1987-12-22 | Ibm Corporation | Process of laminating a photosensitive layer of a substrate |
DK8689A (da) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | Fremgangsmaade og apparat til placering af polymere materialer paa trykte kredsloebskort |
US4992354A (en) * | 1988-02-26 | 1991-02-12 | Morton International, Inc. | Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like |
IT1224722B (it) * | 1988-08-26 | 1990-10-18 | Morton Thiokol Inc Societa Del | Laminatore automatico ad elevata velocita' di laminazione per laproduzione di pannelli per circuiti stampati |
-
1989
- 1989-03-02 US US07/318,023 patent/US4946524A/en not_active Expired - Lifetime
- 1989-09-15 CA CA000611578A patent/CA1301953C/en not_active Expired - Fee Related
-
1990
- 1990-02-09 AU AU49330/90A patent/AU626633B2/en not_active Ceased
- 1990-02-26 EP EP90302010A patent/EP0388039B1/en not_active Expired - Lifetime
- 1990-02-26 AT AT90302010T patent/ATE156751T1/de not_active IP Right Cessation
- 1990-02-26 SG SG1996002898A patent/SG50503A1/en unknown
- 1990-02-26 DE DE69031234T patent/DE69031234T2/de not_active Expired - Fee Related
- 1990-02-28 KR KR1019900002870A patent/KR970004027B1/ko not_active IP Right Cessation
- 1990-03-01 JP JP2047368A patent/JPH02283096A/ja active Granted
- 1990-03-01 NO NO90900978A patent/NO900978L/no unknown
Also Published As
Publication number | Publication date |
---|---|
EP0388039A2 (en) | 1990-09-19 |
ATE156751T1 (de) | 1997-08-15 |
KR970004027B1 (ko) | 1997-03-24 |
CA1301953C (en) | 1992-05-26 |
AU4933090A (en) | 1990-09-06 |
US4946524A (en) | 1990-08-07 |
SG50503A1 (en) | 1998-07-20 |
DE69031234T2 (de) | 1997-12-18 |
DE69031234D1 (de) | 1997-09-18 |
JPH02283096A (ja) | 1990-11-20 |
JPH0512879B2 (no) | 1993-02-19 |
NO900978L (no) | 1990-09-03 |
KR900015589A (ko) | 1990-10-27 |
AU626633B2 (en) | 1992-08-06 |
EP0388039A3 (en) | 1991-11-06 |
EP0388039B1 (en) | 1997-08-13 |
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