DE69030647D1 - Vorrichtung und Verfahren zur Untersuchung eines Halbleiters - Google Patents
Vorrichtung und Verfahren zur Untersuchung eines HalbleitersInfo
- Publication number
- DE69030647D1 DE69030647D1 DE69030647T DE69030647T DE69030647D1 DE 69030647 D1 DE69030647 D1 DE 69030647D1 DE 69030647 T DE69030647 T DE 69030647T DE 69030647 T DE69030647 T DE 69030647T DE 69030647 D1 DE69030647 D1 DE 69030647D1
- Authority
- DE
- Germany
- Prior art keywords
- examining
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/305—Contactless testing using electron beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1339295A JP2689173B2 (ja) | 1989-12-26 | 1989-12-26 | 荷電ビーム加工装置に用いられる加工材料支持具 |
JP1344027A JPH0750153B2 (ja) | 1989-12-29 | 1989-12-29 | 半導体検査装置及び半導体検査方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69030647D1 true DE69030647D1 (de) | 1997-06-12 |
DE69030647T2 DE69030647T2 (de) | 1997-12-11 |
Family
ID=26576379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69030647T Expired - Fee Related DE69030647T2 (de) | 1989-12-26 | 1990-12-27 | Vorrichtung und Verfahren zur Untersuchung eines Halbleiters |
Country Status (3)
Country | Link |
---|---|
US (2) | US5089774A (de) |
EP (1) | EP0435271B1 (de) |
DE (1) | DE69030647T2 (de) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600734A (en) * | 1991-10-04 | 1997-02-04 | Fujitsu Limited | Electron beam tester |
JP2768069B2 (ja) * | 1991-08-20 | 1998-06-25 | 日本電気株式会社 | 集積回路の故障解析方法 |
US5345170A (en) * | 1992-06-11 | 1994-09-06 | Cascade Microtech, Inc. | Wafer probe station having integrated guarding, Kelvin connection and shielding systems |
US6380751B2 (en) * | 1992-06-11 | 2002-04-30 | Cascade Microtech, Inc. | Wafer probe station having environment control enclosure |
US5528156A (en) * | 1993-07-30 | 1996-06-18 | Advantest Corporation | IC analysis system and electron beam probe system and fault isolation method therefor |
US5528164A (en) * | 1994-08-01 | 1996-06-18 | Nec Electronics, Inc. | Modification to a Y-scan monitor circuit |
JPH08254572A (ja) * | 1995-03-16 | 1996-10-01 | Advantest Corp | Ic故障箇所追跡装置及びその追跡方法 |
US5561377A (en) * | 1995-04-14 | 1996-10-01 | Cascade Microtech, Inc. | System for evaluating probing networks |
US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
US5844416A (en) * | 1995-11-02 | 1998-12-01 | Sandia Corporation | Ion-beam apparatus and method for analyzing and controlling integrated circuits |
US5929645A (en) * | 1996-04-26 | 1999-07-27 | Texas Instruments Incorporated | Integrated circuit tester using ion beam |
US5914613A (en) * | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6002263A (en) * | 1997-06-06 | 1999-12-14 | Cascade Microtech, Inc. | Probe station having inner and outer shielding |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6897440B1 (en) | 1998-11-30 | 2005-05-24 | Fab Solutions, Inc. | Contact hole standard test device |
US6445202B1 (en) * | 1999-06-30 | 2002-09-03 | Cascade Microtech, Inc. | Probe station thermal chuck with shielding for capacitive current |
JP3843671B2 (ja) * | 1999-10-29 | 2006-11-08 | 株式会社日立製作所 | 半導体デバイスパターンの検査装置及びその欠陥検査・不良解析方法 |
JP3749107B2 (ja) * | 1999-11-05 | 2006-02-22 | ファブソリューション株式会社 | 半導体デバイス検査装置 |
JP3874996B2 (ja) * | 2000-05-30 | 2007-01-31 | ファブソリューション株式会社 | デバイス検査方法および装置 |
US6549022B1 (en) * | 2000-06-02 | 2003-04-15 | Sandia Corporation | Apparatus and method for analyzing functional failures in integrated circuits |
US6965226B2 (en) * | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US6914423B2 (en) * | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
DE60144508D1 (de) * | 2000-11-06 | 2011-06-09 | Hitachi Ltd | Verfahren zur Herstellung von Proben |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
JP3847568B2 (ja) * | 2001-03-01 | 2006-11-22 | ファブソリューション株式会社 | 半導体装置製造方法 |
JP4738610B2 (ja) * | 2001-03-02 | 2011-08-03 | 株式会社トプコン | 基板表面の汚染評価方法及び汚染評価装置と半導体装置の製造方法 |
US7079975B1 (en) * | 2001-04-30 | 2006-07-18 | Advanced Micro Devices, Inc. | Scatterometry and acoustic based active control of thin film deposition process |
AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
WO2003020467A1 (en) * | 2001-08-31 | 2003-03-13 | Cascade Microtech, Inc. | Optical testing device |
JP3913555B2 (ja) * | 2002-01-17 | 2007-05-09 | ファブソリューション株式会社 | 膜厚測定方法および膜厚測定装置 |
US6777964B2 (en) * | 2002-01-25 | 2004-08-17 | Cascade Microtech, Inc. | Probe station |
US7352258B2 (en) * | 2002-03-28 | 2008-04-01 | Cascade Microtech, Inc. | Waveguide adapter for probe assembly having a detachable bias tee |
EP1509776A4 (de) * | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | Sonde zum testen einer zu testenden einrichtung |
US6847219B1 (en) * | 2002-11-08 | 2005-01-25 | Cascade Microtech, Inc. | Probe station with low noise characteristics |
US6724205B1 (en) * | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
US7250779B2 (en) * | 2002-11-25 | 2007-07-31 | Cascade Microtech, Inc. | Probe station with low inductance path |
US6861856B2 (en) * | 2002-12-13 | 2005-03-01 | Cascade Microtech, Inc. | Guarded tub enclosure |
US7221172B2 (en) * | 2003-05-06 | 2007-05-22 | Cascade Microtech, Inc. | Switched suspended conductor and connection |
US7492172B2 (en) * | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7057404B2 (en) * | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7250626B2 (en) * | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
GB2425844B (en) | 2003-12-24 | 2007-07-11 | Cascade Microtech Inc | Active wafer probe |
US7187188B2 (en) * | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
US7212017B2 (en) * | 2003-12-25 | 2007-05-01 | Ebara Corporation | Electron beam apparatus with detailed observation function and sample inspecting and observing method using electron beam apparatus |
WO2005121824A2 (en) * | 2004-06-07 | 2005-12-22 | Cascade Microtech, Inc. | Thermal optical chuck |
US7330041B2 (en) * | 2004-06-14 | 2008-02-12 | Cascade Microtech, Inc. | Localizing a temperature of a device for testing |
JP4980903B2 (ja) * | 2004-07-07 | 2012-07-18 | カスケード マイクロテック インコーポレイテッド | 膜懸垂プローブを具えるプローブヘッド |
WO2006031646A2 (en) | 2004-09-13 | 2006-03-23 | Cascade Microtech, Inc. | Double sided probing structures |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US7656172B2 (en) * | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US20060169897A1 (en) * | 2005-01-31 | 2006-08-03 | Cascade Microtech, Inc. | Microscope system for testing semiconductors |
US7449899B2 (en) * | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
EP1932003A2 (de) * | 2005-06-13 | 2008-06-18 | Cascade Microtech, Inc. | Breitbandige aktiv-passiv-differenzsignalsonde |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) * | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7764072B2 (en) * | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7443186B2 (en) * | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7453274B1 (en) * | 2007-10-09 | 2008-11-18 | Kla-Tencor Technologies Corporation | Detection of defects using transient contrast |
US7888957B2 (en) * | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
WO2010059247A2 (en) | 2008-11-21 | 2010-05-27 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) * | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3437929A (en) * | 1965-08-05 | 1969-04-08 | Electroglas Inc | Automatically indexed probe assembly for testing semiconductor wafers and the like |
GB2010577B (en) * | 1977-11-07 | 1982-05-06 | Ion Tech Ltd | Preparation of materials for examination of transmission electron microscopy techniques |
US4154530A (en) * | 1977-12-22 | 1979-05-15 | National Semiconductor Corporation | Laser beam error correcting process |
US4186305A (en) * | 1978-03-01 | 1980-01-29 | Union Kogaku Kabushiki Kaisha | High-temperature microscope |
JPS57170551U (de) * | 1981-04-22 | 1982-10-27 | ||
HU190855B (en) * | 1983-10-12 | 1986-11-28 | Mta Mueszaki Fizikai Kutato Intezete,Hu | Device for working solid samples by ion beam and ion source to the device |
SE452526B (sv) * | 1984-05-09 | 1987-11-30 | Stiftelsen Inst Mikrovags | Forfarande for att inspektera integrerade kretsar eller andra objekt |
JPH0616391B2 (ja) * | 1984-07-13 | 1994-03-02 | 株式会社日立製作所 | イオンビーム照射装置 |
JPS61100942A (ja) * | 1984-10-22 | 1986-05-19 | Canon Inc | 不良チツプ識別方法 |
JPH0719557B2 (ja) * | 1984-10-26 | 1995-03-06 | 株式会社日立製作所 | 特定微小領域の薄膜化装置を備えた透過電子顕微鏡 |
JPS6298724A (ja) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | 電子線描画装置 |
US4730158A (en) * | 1986-06-06 | 1988-03-08 | Santa Barbara Research Center | Electron-beam probing of photodiodes |
JPS63308909A (ja) * | 1987-06-10 | 1988-12-16 | Mitsubishi Electric Corp | 半導体装置の不良観察方法 |
EP0295065A3 (de) * | 1987-06-10 | 1991-07-03 | Hitachi, Ltd. | Integrierte Schaltungshalbleiteranordnung, Verfahren zum Herstellen oder Schneiden derselben und Schneidesystem mit Energiebündel dafür |
JPH0692927B2 (ja) * | 1988-02-26 | 1994-11-16 | シャープ株式会社 | 微小領域断面観察用試料作成法 |
-
1990
- 1990-12-24 US US07/633,307 patent/US5089774A/en not_active Expired - Lifetime
- 1990-12-27 DE DE69030647T patent/DE69030647T2/de not_active Expired - Fee Related
- 1990-12-27 EP EP90125541A patent/EP0435271B1/de not_active Expired - Lifetime
-
1991
- 1991-03-28 US US07/676,438 patent/US5132507A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0435271B1 (de) | 1997-05-07 |
US5089774A (en) | 1992-02-18 |
EP0435271A3 (en) | 1992-10-07 |
EP0435271A2 (de) | 1991-07-03 |
US5132507A (en) | 1992-07-21 |
DE69030647T2 (de) | 1997-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |