DE69012454D1 - Verfahren mit abgekürztem Zyklus zur Herstellung von gedruckten Leiterplatten und Zusammensetzung für die Anwendung. - Google Patents
Verfahren mit abgekürztem Zyklus zur Herstellung von gedruckten Leiterplatten und Zusammensetzung für die Anwendung.Info
- Publication number
- DE69012454D1 DE69012454D1 DE69012454T DE69012454T DE69012454D1 DE 69012454 D1 DE69012454 D1 DE 69012454D1 DE 69012454 T DE69012454 T DE 69012454T DE 69012454 T DE69012454 T DE 69012454T DE 69012454 D1 DE69012454 D1 DE 69012454D1
- Authority
- DE
- Germany
- Prior art keywords
- composition
- printed circuit
- circuit boards
- manufacturing printed
- cycle method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23D—EDIBLE OILS OR FATS, e.g. MARGARINES, SHORTENINGS, COOKING OILS
- A23D7/00—Edible oil or fat compositions containing an aqueous phase, e.g. margarines
- A23D7/01—Other fatty acid esters, e.g. phosphatides
- A23D7/013—Spread compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8967520A IT1232863B (it) | 1989-06-27 | 1989-06-27 | Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69012454D1 true DE69012454D1 (de) | 1994-10-20 |
DE69012454T2 DE69012454T2 (de) | 1995-04-13 |
Family
ID=11303124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69012454T Expired - Fee Related DE69012454T2 (de) | 1989-06-27 | 1990-06-19 | Verfahren mit abgekürztem Zyklus zur Herstellung von gedruckten Leiterplatten und Zusammensetzung für die Anwendung. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5104687A (de) |
EP (1) | EP0405652B1 (de) |
JP (1) | JP2812539B2 (de) |
KR (1) | KR100213810B1 (de) |
CA (1) | CA2019836C (de) |
DE (1) | DE69012454T2 (de) |
IT (1) | IT1232863B (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5328561A (en) * | 1992-07-10 | 1994-07-12 | Macdermid Incorporated | Microetchant for copper surfaces and processes for using same |
DE19740431C1 (de) * | 1997-09-11 | 1998-11-12 | Atotech Deutschland Gmbh | Verfahren zum Metallisieren eines elektrisch nichtleitende Oberflächenbereiche aufweisenden Substrats |
US5985040A (en) * | 1998-09-21 | 1999-11-16 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
US6454868B1 (en) | 2000-04-17 | 2002-09-24 | Electrochemicals Inc. | Permanganate desmear process for printed wiring boards |
JP5330474B2 (ja) * | 2011-09-22 | 2013-10-30 | 上村工業株式会社 | デスミア液及びデスミア処理方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3698940A (en) * | 1970-01-26 | 1972-10-17 | Macdermid Inc | Method of making additive printed circuit boards and product thereof |
US3720525A (en) * | 1971-08-16 | 1973-03-13 | Rca Corp | Electroless copper plating solutions with accelerated plating rates |
JPS54162174A (en) * | 1978-06-14 | 1979-12-22 | Sumitomo Bakelite Co | Method of producing flexible printed circuit board |
DE3110415C2 (de) * | 1981-03-18 | 1983-08-18 | Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern | Verfahren zum Herstellen von Leiterplatten |
US4425380A (en) * | 1982-11-19 | 1984-01-10 | Kollmorgen Technologies Corporation | Hole cleaning process for printed circuit boards using permanganate and caustic treating solutions |
US4515829A (en) * | 1983-10-14 | 1985-05-07 | Shipley Company Inc. | Through-hole plating |
US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
US4948630A (en) * | 1984-06-07 | 1990-08-14 | Enthone, Inc. | Three step process for treating plastics with alkaline permanganate solutions |
GB8613960D0 (en) * | 1986-06-09 | 1986-07-16 | Omi International Gb Ltd | Treating laminates |
US4751106A (en) * | 1986-09-25 | 1988-06-14 | Shipley Company Inc. | Metal plating process |
US4761303A (en) * | 1986-11-10 | 1988-08-02 | Macdermid, Incorporated | Process for preparing multilayer printed circuit boards |
US4839084A (en) * | 1987-01-27 | 1989-06-13 | Colgate-Palmolive Company | Built liquid laundry detergent composition containing an alkaline earth metal or zinc salt of higher fatty acid liquefying agent and method of use |
US4874477A (en) * | 1989-04-21 | 1989-10-17 | Olin Hunt Specialty Products Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
-
1989
- 1989-06-27 IT IT8967520A patent/IT1232863B/it active
-
1990
- 1990-06-19 EP EP90201596A patent/EP0405652B1/de not_active Expired - Lifetime
- 1990-06-19 DE DE69012454T patent/DE69012454T2/de not_active Expired - Fee Related
- 1990-06-20 KR KR1019900009030A patent/KR100213810B1/ko not_active IP Right Cessation
- 1990-06-21 US US07/541,500 patent/US5104687A/en not_active Expired - Fee Related
- 1990-06-26 JP JP2169678A patent/JP2812539B2/ja not_active Expired - Fee Related
- 1990-06-26 CA CA002019836A patent/CA2019836C/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100213810B1 (ko) | 1999-08-02 |
CA2019836C (fr) | 2000-05-16 |
JP2812539B2 (ja) | 1998-10-22 |
DE69012454T2 (de) | 1995-04-13 |
JPH03214689A (ja) | 1991-09-19 |
EP0405652A2 (de) | 1991-01-02 |
CA2019836A1 (fr) | 1990-12-27 |
KR910002318A (ko) | 1991-01-31 |
EP0405652A3 (en) | 1991-08-21 |
IT1232863B (it) | 1992-03-05 |
US5104687A (en) | 1992-04-14 |
EP0405652B1 (de) | 1994-09-14 |
IT8967520A0 (it) | 1989-06-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |