DE69833087D1 - Verfahren zur Herstellung von Dickfilmschaltungen - Google Patents
Verfahren zur Herstellung von DickfilmschaltungenInfo
- Publication number
- DE69833087D1 DE69833087D1 DE69833087T DE69833087T DE69833087D1 DE 69833087 D1 DE69833087 D1 DE 69833087D1 DE 69833087 T DE69833087 T DE 69833087T DE 69833087 T DE69833087 T DE 69833087T DE 69833087 D1 DE69833087 D1 DE 69833087D1
- Authority
- DE
- Germany
- Prior art keywords
- film circuits
- producing thick
- thick
- producing
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/23907—Pile or nap type surface or component
- Y10T428/23986—With coating, impregnation, or bond
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US94693197A | 1997-10-08 | 1997-10-08 | |
US946931 | 1997-10-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69833087D1 true DE69833087D1 (de) | 2006-03-30 |
DE69833087T2 DE69833087T2 (de) | 2006-07-20 |
Family
ID=25485205
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE1998633087 Expired - Lifetime DE69833087T2 (de) | 1997-10-08 | 1998-09-14 | Verfahren zur Herstellung von Dickfilmschaltungen |
Country Status (3)
Country | Link |
---|---|
US (1) | US6143355A (de) |
EP (1) | EP0909117B1 (de) |
DE (1) | DE69833087T2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6348742B1 (en) * | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
IT1311277B1 (it) * | 1999-12-23 | 2002-03-12 | St Microelectronics Srl | Dispositivo elettronico con collegamenti a doppio filo, metodo difabbricazione di tale dispositivo elettronico e metodo di verifica |
AU2001253142A1 (en) * | 2000-04-04 | 2001-10-30 | Parlex Corporation | High speed flip chip assembly process |
US6476332B1 (en) * | 2001-09-12 | 2002-11-05 | Visteon Global Technologies, Inc. | Conductor systems for thick film electronic circuits |
DE60109937T2 (de) | 2001-10-22 | 2006-02-23 | Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto | Positionieren mit leitfähigen Marken |
TWI573496B (zh) * | 2009-08-05 | 2017-03-01 | 薄膜電子Asa公司 | 印刷電子之印刷相容設計及佈局方式 |
DE102018214520A1 (de) * | 2018-08-28 | 2020-03-05 | Siemens Aktiengesellschaft | Qualitätsmanagement für den Lotpastendruck auf Leiterbahnen |
CN109496061A (zh) * | 2018-12-10 | 2019-03-19 | 浪潮(北京)电子信息产业有限公司 | 一种电路板的损坏判别方法和系统 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2835353C2 (de) * | 1978-08-11 | 1982-05-13 | Luther & Maelzer Gmbh, 3050 Wunstorf | Verfahren zur Feststellung des Versatzes zwischen Kontaktlöchern und Leiterbahnen bei einer Leiterplatte sowie eine Leiterplatte zur Verwendung in diesem Verfahren |
JPS58135692A (ja) * | 1982-02-06 | 1983-08-12 | 松下電器産業株式会社 | 印刷の位置決め方法 |
FR2560437B1 (fr) * | 1984-02-28 | 1987-05-29 | Citroen Sa | Procede de report a plat d'elements de puissance sur un reseau conducteur par brasage de leurs connexions |
US4914829A (en) * | 1988-12-16 | 1990-04-10 | Ag Communication Systems Corporation | Image alignment indicators |
US5028867A (en) * | 1989-08-31 | 1991-07-02 | Nippon Seiki Co., Ltd. | Printed-wiring board |
JPH03131087A (ja) * | 1989-10-17 | 1991-06-04 | Hitachi Aic Inc | プリント配線板の印刷ズレ検出方法 |
JP2752486B2 (ja) * | 1989-12-29 | 1998-05-18 | キヤノン株式会社 | インクジェット記録ヘッドおよびその検査方法ならびにインクジェット記録装置 |
JPH0521923A (ja) * | 1990-12-04 | 1993-01-29 | Nec Corp | 印刷配線板 |
JPH0580104A (ja) * | 1991-09-20 | 1993-04-02 | Cmk Corp | モータ用プリント配線板の製造方法 |
JPH05267813A (ja) * | 1992-03-24 | 1993-10-15 | Ngk Insulators Ltd | 厚膜回路基板、その製造方法および厚膜回路基板製造用基板 |
-
1998
- 1998-09-14 DE DE1998633087 patent/DE69833087T2/de not_active Expired - Lifetime
- 1998-09-14 EP EP19980203059 patent/EP0909117B1/de not_active Expired - Lifetime
-
1999
- 1999-02-16 US US09/251,248 patent/US6143355A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6143355A (en) | 2000-11-07 |
DE69833087T2 (de) | 2006-07-20 |
EP0909117A3 (de) | 2000-09-06 |
EP0909117A2 (de) | 1999-04-14 |
EP0909117B1 (de) | 2006-01-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |