AU2001253142A1 - High speed flip chip assembly process - Google Patents

High speed flip chip assembly process

Info

Publication number
AU2001253142A1
AU2001253142A1 AU2001253142A AU5314201A AU2001253142A1 AU 2001253142 A1 AU2001253142 A1 AU 2001253142A1 AU 2001253142 A AU2001253142 A AU 2001253142A AU 5314201 A AU5314201 A AU 5314201A AU 2001253142 A1 AU2001253142 A1 AU 2001253142A1
Authority
AU
Australia
Prior art keywords
high speed
assembly process
flip chip
chip assembly
speed flip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253142A
Inventor
Miao-Yong Cao
James S. Hammond
Shaun Huot
Gary R. Larson
Bruce P. Mahan
Christopher J. Piacitelli
David M. Price
John G. Wistey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Parlex Corp
Original Assignee
Parlex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parlex Corp filed Critical Parlex Corp
Publication of AU2001253142A1 publication Critical patent/AU2001253142A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4685—Manufacturing of cross-over conductors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
AU2001253142A 2000-04-04 2001-04-04 High speed flip chip assembly process Abandoned AU2001253142A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US19453100P 2000-04-04 2000-04-04
US60194531 2000-04-04
PCT/US2001/010959 WO2001078908A1 (en) 2000-04-04 2001-04-04 High speed flip chip assembly process

Publications (1)

Publication Number Publication Date
AU2001253142A1 true AU2001253142A1 (en) 2001-10-30

Family

ID=22717956

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253142A Abandoned AU2001253142A1 (en) 2000-04-04 2001-04-04 High speed flip chip assembly process

Country Status (4)

Country Link
US (2) US20020020491A1 (en)
EP (1) EP1272285A1 (en)
AU (1) AU2001253142A1 (en)
WO (1) WO2001078908A1 (en)

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WO2003063140A1 (en) * 2002-01-26 2003-07-31 Sae Magnetics (H. K.) Ltd. Method and apparatus for the prevention of electrostatic discharge (esd) by a hard drive magnetic head involving the utilization of anisotropic conductive paste (acp) in the securement to a head-gimbal assembly (hga)
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
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US7166491B2 (en) * 2003-06-11 2007-01-23 Fry's Metals, Inc. Thermoplastic fluxing underfill composition and method
US20040250417A1 (en) * 2003-06-12 2004-12-16 Arneson Michael R. Method, system, and apparatus for transfer of dies using a die plate
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US20050282355A1 (en) * 2004-06-18 2005-12-22 Edwards David N High density bonding of electrical devices
US7247683B2 (en) * 2004-08-05 2007-07-24 Fry's Metals, Inc. Low voiding no flow fluxing underfill for electronic devices
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
WO2006076614A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation A process for manufacturing application specific printable circuits (aspc's) and other custom electronic devices
WO2006076609A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US7575621B2 (en) * 2005-01-14 2009-08-18 Cabot Corporation Separation of metal nanoparticles
US8334464B2 (en) * 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
WO2006076603A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Printable electrical conductors
US7955351B2 (en) * 2005-02-18 2011-06-07 Tyco Healthcare Group Lp Rapid exchange catheters and embolic protection devices
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
US8067253B2 (en) 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
US20080122119A1 (en) * 2006-08-31 2008-05-29 Avery Dennison Corporation Method and apparatus for creating rfid devices using masking techniques
FR2933968B1 (en) * 2008-07-18 2010-09-10 Thales Sa ELECTRONIC DEVICE COMPRISING ELECTRONIC COMPONENTS AND AT LEAST ONE NANOTUBE INTERFACE AND METHOD OF MANUFACTURE
AT511655B1 (en) * 2011-10-20 2013-02-15 Prelonic Technologies Gmbh METHOD FOR BONDING CIRCUIT ELEMENTS AND ADHESIVES
FR3006085A1 (en) * 2013-05-27 2014-11-28 Ask Sa RADIOFREQUENCY DEVICE WITH AN OPTIMIZED ANTENNA
US20160254244A1 (en) * 2013-05-31 2016-09-01 Sunray Scientific, Llc Systems and Methods Utilizing Anisotropic Conductive Adhesives
CN104377439B (en) * 2013-08-15 2019-08-27 德昌电机(深圳)有限公司 Antenna circuit and manufacturing method
GB2539684B (en) 2015-06-24 2018-04-04 Dst Innovations Ltd Method of surface-mounting components
EP3448489A4 (en) * 2016-04-27 2019-12-25 QXMedical, LLC Devices for assisting with advancement of catheters and related systems and methods
CN111373847A (en) * 2017-11-29 2020-07-03 大日本印刷株式会社 Wiring substrate and method for manufacturing wiring substrate
CN114639504A (en) * 2022-05-18 2022-06-17 广州优刻谷科技有限公司 Graphene-silver composite RFID tag and preparation method and application thereof

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Also Published As

Publication number Publication date
EP1272285A1 (en) 2003-01-08
US20040026033A1 (en) 2004-02-12
US20020020491A1 (en) 2002-02-21
WO2001078908A1 (en) 2001-10-25

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