AU2001229771A1 - High speed interconnect - Google Patents

High speed interconnect

Info

Publication number
AU2001229771A1
AU2001229771A1 AU2001229771A AU2977101A AU2001229771A1 AU 2001229771 A1 AU2001229771 A1 AU 2001229771A1 AU 2001229771 A AU2001229771 A AU 2001229771A AU 2977101 A AU2977101 A AU 2977101A AU 2001229771 A1 AU2001229771 A1 AU 2001229771A1
Authority
AU
Australia
Prior art keywords
high speed
speed interconnect
interconnect
speed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001229771A
Inventor
Howard Wallace Andrews Jr.
John Joseph Consoli
George Richard Defibaugh
James Lee Fedder
David Wayne Helster
Matthew Richard Mcalonis
Scott Keith Mickievicz
Chad William Morgan
Alexander Michael Sharf
Lynn Robert Sipe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of AU2001229771A1 publication Critical patent/AU2001229771A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0242—Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
AU2001229771A 2000-01-27 2001-01-26 High speed interconnect Abandoned AU2001229771A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09491658 2000-01-27
US09/491,658 US6663442B1 (en) 2000-01-27 2000-01-27 High speed interconnect using printed circuit board with plated bores
PCT/US2001/002529 WO2001056338A1 (en) 2000-01-27 2001-01-26 High speed interconnect

Publications (1)

Publication Number Publication Date
AU2001229771A1 true AU2001229771A1 (en) 2001-08-07

Family

ID=23953106

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001229771A Abandoned AU2001229771A1 (en) 2000-01-27 2001-01-26 High speed interconnect

Country Status (7)

Country Link
US (1) US6663442B1 (en)
JP (1) JP4600910B2 (en)
CN (1) CN1188018C (en)
AU (1) AU2001229771A1 (en)
DE (2) DE10195164B4 (en)
TW (1) TW486930B (en)
WO (1) WO2001056338A1 (en)

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US7651382B2 (en) * 2006-12-01 2010-01-26 Interconnect Portfolio Llc Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
US7192320B2 (en) * 2004-03-26 2007-03-20 Silicon Pipe, Inc. Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
US20070114056A9 (en) * 2004-06-09 2007-05-24 Lloyd Cosman Electrical isolation of PCBs gasketing using controlled depth drilling
US7155821B1 (en) * 2004-06-30 2007-01-02 Emc Corporation Techniques for manufacturing a circuit board having a countersunk via
US6986682B1 (en) 2005-05-11 2006-01-17 Myoungsoo Jeon High speed connector assembly with laterally displaceable head portion
JP4669338B2 (en) * 2005-07-22 2011-04-13 富士通コンポーネント株式会社 Printed wiring board and manufacturing method thereof
US7070420B1 (en) * 2005-08-08 2006-07-04 Wakefield Steven B Electrical interconnect system utilizing nonconductive elastomeric elements and continuous conductive elements
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US7413451B2 (en) * 2006-11-07 2008-08-19 Myoungsoo Jeon Connector having self-adjusting surface-mount attachment structures
JP2009164353A (en) 2008-01-07 2009-07-23 Fujitsu Ltd Wiring board, its manufacturing method, and wiring board assembly
US7540744B1 (en) 2008-01-08 2009-06-02 Fci Americas Technology, Inc. Shared hole orthogonal footprint with backdrilled vias
US7878854B2 (en) * 2008-07-21 2011-02-01 Tyco Electronics Corporation Electrical connector having variable length mounting contacts
US8431831B2 (en) * 2008-10-08 2013-04-30 Oracle America, Inc. Bond strength and interconnection in a via
US8461855B2 (en) * 2009-10-02 2013-06-11 Teradyne, Inc. Device interface board with cavity back for very high frequency applications
CN101719585B (en) * 2009-11-24 2012-10-10 中兴通讯股份有限公司 Network card and assembly method thereof
US7963776B1 (en) * 2010-03-23 2011-06-21 Tyco Electronics Corporation Electrical connector assembly having direct connection terminals
US7988457B1 (en) * 2010-03-23 2011-08-02 Tyco Electronics Corporation Electrical connector assembly having reduced depth terminals
JP2012094664A (en) 2010-10-27 2012-05-17 Fujitsu Ltd Board unit, network device, and manufacturing method of board unit
JP2012195389A (en) 2011-03-15 2012-10-11 Fujitsu Ltd Wiring board, wiring board unit, electronic equipment and wiring board manufacturing method
JP5686009B2 (en) 2011-03-18 2015-03-18 富士通株式会社 Substrate unit and method for manufacturing substrate unit
KR20150092876A (en) * 2014-02-06 2015-08-17 삼성전기주식회사 Electric component module and manufacturing method threrof
US9564697B2 (en) * 2014-11-13 2017-02-07 Lear Corporation Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
US9807869B2 (en) 2014-11-21 2017-10-31 Amphenol Corporation Mating backplane for high speed, high density electrical connector
CN109076700B (en) 2016-03-08 2021-07-30 安费诺公司 Backplane footprints for high speed, high density electrical connectors
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US10320099B2 (en) 2016-06-10 2019-06-11 Te Connectivity Corporation Connector with asymmetric base section
US10128597B2 (en) 2016-06-10 2018-11-13 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
US10263352B2 (en) 2016-06-10 2019-04-16 Te Connectivity Corporation Electrical contact pad for electrically contacting a connector
US9997868B1 (en) 2017-07-24 2018-06-12 Te Connectivity Corporation Electrical connector with improved impedance characteristics
GB2566943B (en) * 2017-09-25 2020-09-02 Ge Aviat Systems Ltd Surface mount connector and method of forming a printed circuit board
US11057995B2 (en) 2018-06-11 2021-07-06 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
WO2020236794A1 (en) 2019-05-20 2020-11-26 Amphenol Corporation High density, high speed electrical connector
WO2021154813A1 (en) 2020-01-27 2021-08-05 Amphenol Corporation Electrical connector with high speed mounting interface
TW202147718A (en) 2020-01-27 2021-12-16 美商安芬諾股份有限公司 Electrical connector with high speed mounting interface
US10998678B1 (en) 2020-03-26 2021-05-04 TE Connectivity Services Gmbh Modular electrical connector with additional grounding
US11025014B1 (en) 2020-03-26 2021-06-01 TE CONNECTNITY SERVICES GmbH Shield component for use with modular electrical connector to reduce crosstalk
US11297712B2 (en) 2020-03-26 2022-04-05 TE Connectivity Services Gmbh Modular printed circuit board wafer connector with reduced crosstalk
US10965062B1 (en) 2020-03-26 2021-03-30 TE Connectivity Services Gmbh Modular electrical connector with conductive coating to reduce crosstalk
US11031734B1 (en) 2020-03-26 2021-06-08 TE Connectivity Services Gmbh Modular electrical connector with reduced crosstalk
US11264749B2 (en) 2020-03-26 2022-03-01 TE Connectivity Services Gmbh Modular connector with printed circuit board wafer to reduce crosstalk
CN112533372B (en) * 2020-11-06 2022-02-01 苏州浪潮智能科技有限公司 Method, medium and system for realizing equal length of high-speed signal lines in PCB
DE102022205277B4 (en) * 2022-05-25 2024-03-21 Lenze Swiss Ag Engine system

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Also Published As

Publication number Publication date
US6663442B1 (en) 2003-12-16
JP4600910B2 (en) 2010-12-22
JP2003521116A (en) 2003-07-08
TW486930B (en) 2002-05-11
DE10195164B4 (en) 2021-10-14
CN1397152A (en) 2003-02-12
WO2001056338A1 (en) 2001-08-02
DE10195164T1 (en) 2003-05-22
CN1188018C (en) 2005-02-02

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