AU2002217901A1 - Flip chip mounting technique - Google Patents
Flip chip mounting techniqueInfo
- Publication number
- AU2002217901A1 AU2002217901A1 AU2002217901A AU1790102A AU2002217901A1 AU 2002217901 A1 AU2002217901 A1 AU 2002217901A1 AU 2002217901 A AU2002217901 A AU 2002217901A AU 1790102 A AU1790102 A AU 1790102A AU 2002217901 A1 AU2002217901 A1 AU 2002217901A1
- Authority
- AU
- Australia
- Prior art keywords
- flip chip
- chip mounting
- mounting technique
- technique
- flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/724,019 | 2000-11-28 | ||
US09/724,019 US6410415B1 (en) | 1999-03-23 | 2000-11-28 | Flip chip mounting technique |
PCT/US2001/044389 WO2002045152A2 (en) | 2000-11-28 | 2001-11-28 | Flip chip mounting technique |
Publications (1)
Publication Number | Publication Date |
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AU2002217901A1 true AU2002217901A1 (en) | 2002-06-11 |
Family
ID=24908631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002217901A Abandoned AU2002217901A1 (en) | 2000-11-28 | 2001-11-28 | Flip chip mounting technique |
Country Status (4)
Country | Link |
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US (1) | US6410415B1 (en) |
JP (1) | JP2002198394A (en) |
AU (1) | AU2002217901A1 (en) |
WO (1) | WO2002045152A2 (en) |
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JP3625646B2 (en) | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | Flip chip mounting method |
US6189208B1 (en) * | 1998-09-11 | 2001-02-20 | Polymer Flip Chip Corp. | Flip chip mounting technique |
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-
2000
- 2000-11-28 US US09/724,019 patent/US6410415B1/en not_active Expired - Fee Related
-
2001
- 2001-11-19 JP JP2001352599A patent/JP2002198394A/en active Pending
- 2001-11-28 AU AU2002217901A patent/AU2002217901A1/en not_active Abandoned
- 2001-11-28 WO PCT/US2001/044389 patent/WO2002045152A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2002198394A (en) | 2002-07-12 |
US6410415B1 (en) | 2002-06-25 |
WO2002045152A3 (en) | 2003-08-21 |
WO2002045152A2 (en) | 2002-06-06 |
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