AU2002252088A1 - Super-thin high speed flip chip package - Google Patents

Super-thin high speed flip chip package

Info

Publication number
AU2002252088A1
AU2002252088A1 AU2002252088A AU2002252088A AU2002252088A1 AU 2002252088 A1 AU2002252088 A1 AU 2002252088A1 AU 2002252088 A AU2002252088 A AU 2002252088A AU 2002252088 A AU2002252088 A AU 2002252088A AU 2002252088 A1 AU2002252088 A1 AU 2002252088A1
Authority
AU
Australia
Prior art keywords
super
high speed
flip chip
chip package
thin high
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002252088A
Inventor
Rajendra Pendse
Samuel Tam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ChipPac Inc
Original Assignee
ChipPac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ChipPac Inc filed Critical ChipPac Inc
Publication of AU2002252088A1 publication Critical patent/AU2002252088A1/en
Abandoned legal-status Critical Current

Links

AU2002252088A 2001-02-27 2002-02-26 Super-thin high speed flip chip package Abandoned AU2002252088A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60/272,236 2001-02-27
US10/084,787 2002-02-25

Publications (1)

Publication Number Publication Date
AU2002252088A1 true AU2002252088A1 (en) 2002-09-12

Family

ID=

Similar Documents

Publication Publication Date Title
AU2001253142A1 (en) High speed flip chip assembly process
AU2002217901A1 (en) Flip chip mounting technique
AU2001277013A1 (en) Flip chip substrate design
AU2002243722A1 (en) Electronic device package
AU2002365584A1 (en) Package for electro-optical components
AU2002244124A1 (en) Self-coplanarity bumping shape for flip chip
AU2002243735A1 (en) High performance silicon contact for flip chip
TW531052U (en) Flip chip and flip chip packaging substrate
AU2002216217A1 (en) Semiconductor package
SG104279A1 (en) Enhanced chip scale package for flip chips
AU2002362250A1 (en) Optical/electrical interconnects and package for high speed signaling
AU2002358823A1 (en) Complex packaging device
AU2002318132A1 (en) Small-scale optoelectronic package
AU2002365569A1 (en) Connection package for high-speed integrated circuit
AU2002326665A1 (en) Technique to minimize crosstalk in electronic packages
GB0122637D0 (en) Flip top carton
AU2002355550A1 (en) Self-programmable chip
AU2002308834A1 (en) Interlabial pad and package thereof
AU2002362101A1 (en) Flip-chip mounted opto-electronic circuit
AU4974500A (en) Chip scale package
AU2002252088A1 (en) Super-thin high speed flip chip package
AU2002358229A1 (en) Beverage package
AU2002252098A1 (en) Chip scale package with flip chip interconnect
AU2002323472A1 (en) High-frequency chip packages
AU2002320214A1 (en) Optical chip packaging via through hole