DE68910378D1 - Anlage zur Erzeugung dünner Schichten. - Google Patents
Anlage zur Erzeugung dünner Schichten.Info
- Publication number
- DE68910378D1 DE68910378D1 DE89401277T DE68910378T DE68910378D1 DE 68910378 D1 DE68910378 D1 DE 68910378D1 DE 89401277 T DE89401277 T DE 89401277T DE 68910378 T DE68910378 T DE 68910378T DE 68910378 D1 DE68910378 D1 DE 68910378D1
- Authority
- DE
- Germany
- Prior art keywords
- plant
- production
- thin layers
- layers
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H01L21/205—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63109195A JP2608456B2 (ja) | 1988-05-06 | 1988-05-06 | 薄膜形成装置 |
JP63156220A JP2590534B2 (ja) | 1988-06-23 | 1988-06-23 | 薄膜形成方法 |
JP63280496A JPH02129376A (ja) | 1988-11-08 | 1988-11-08 | 薄膜形成装置 |
JP63312860A JPH02159380A (ja) | 1988-12-13 | 1988-12-13 | 薄膜形成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68910378D1 true DE68910378D1 (de) | 1993-12-09 |
DE68910378T2 DE68910378T2 (de) | 1994-03-03 |
Family
ID=27469702
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89401277T Expired - Lifetime DE68910378T2 (de) | 1988-05-06 | 1989-05-05 | Anlage zur Erzeugung dünner Schichten. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4979467A (de) |
EP (1) | EP0342113B1 (de) |
KR (1) | KR920008122B1 (de) |
DE (1) | DE68910378T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5236511A (en) * | 1990-03-16 | 1993-08-17 | Schott Glaswerke | Plasma CVD process for coating a dome-shaped substrate |
EP0462730A1 (de) * | 1990-06-18 | 1991-12-27 | AT&T Corp. | Verfahren und Vorrichtung zur Herstellung planarer Schichten für integrierte Schaltungen |
JPH0817171B2 (ja) * | 1990-12-31 | 1996-02-21 | 株式会社半導体エネルギー研究所 | プラズマ発生装置およびそれを用いたエッチング方法 |
US5549780A (en) * | 1990-10-23 | 1996-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for plasma processing and apparatus for plasma processing |
US5578130A (en) * | 1990-12-12 | 1996-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus and method for depositing a film |
US5330578A (en) * | 1991-03-12 | 1994-07-19 | Semiconductor Energy Laboratory Co., Ltd. | Plasma treatment apparatus |
US5292400A (en) * | 1992-03-23 | 1994-03-08 | Hughes Aircraft Company | Method and apparatus for producing variable spatial frequency control in plasma assisted chemical etching |
JP2888026B2 (ja) * | 1992-04-30 | 1999-05-10 | 松下電器産業株式会社 | プラズマcvd装置 |
US7264850B1 (en) | 1992-12-28 | 2007-09-04 | Semiconductor Energy Laboratory Co., Ltd. | Process for treating a substrate with a plasma |
JP3513206B2 (ja) * | 1994-03-22 | 2004-03-31 | キヤノン株式会社 | 堆積膜形成方法及び堆積膜形成装置 |
JP3387616B2 (ja) * | 1994-04-18 | 2003-03-17 | キヤノン株式会社 | プラズマ処理装置 |
US5763020A (en) * | 1994-10-17 | 1998-06-09 | United Microelectronics Corporation | Process for evenly depositing ions using a tilting and rotating platform |
US6435130B1 (en) * | 1996-08-22 | 2002-08-20 | Canon Kabushiki Kaisha | Plasma CVD apparatus and plasma processing method |
DE19645912C1 (de) * | 1996-11-07 | 1997-08-28 | Dresden Ev Inst Festkoerper | Plasma-CVD-Reaktor |
DE10060002B4 (de) * | 1999-12-07 | 2016-01-28 | Komatsu Ltd. | Vorrichtung zur Oberflächenbehandlung |
WO2003100817A1 (en) | 2002-05-23 | 2003-12-04 | Lam Research Corporation | Multi-part electrode for a semiconductor processing plasma reactor and method of replacing a portion of a mutli-part electrode |
KR100615015B1 (ko) * | 2002-10-16 | 2006-08-25 | 샤프 가부시키가이샤 | 전자 디바이스, 그 제조방법 및 플라즈마처리장치 |
CN1293608C (zh) * | 2002-10-16 | 2007-01-03 | 夏普株式会社 | 半导体器件及其制造方法以及等离子加工装置 |
US20080159925A1 (en) * | 2006-12-27 | 2008-07-03 | Ngk Insulators, Ltd. | Plasma processing apparatus |
KR101415550B1 (ko) * | 2007-07-27 | 2014-07-04 | 주식회사 미코 | 접지 구조물, 이를 갖는 기판 지지 유닛 및 박막 형성 장치 |
US9175391B2 (en) * | 2011-05-26 | 2015-11-03 | Intermolecular, Inc. | Apparatus and method for combinatorial gas distribution through a multi-zoned showerhead |
US9396900B2 (en) * | 2011-11-16 | 2016-07-19 | Tokyo Electron Limited | Radio frequency (RF) power coupling system utilizing multiple RF power coupling elements for control of plasma properties |
JP2017183392A (ja) * | 2016-03-29 | 2017-10-05 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法および記録媒体 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59193265A (ja) * | 1983-03-14 | 1984-11-01 | Stanley Electric Co Ltd | プラズマcvd装置 |
JPS59193266A (ja) * | 1983-03-14 | 1984-11-01 | Stanley Electric Co Ltd | プラズマcvd装置 |
JPS59205470A (ja) * | 1983-05-02 | 1984-11-21 | Kowa Eng Kk | 硬質被膜の形成装置及びその形成方法 |
JPS59207620A (ja) * | 1983-05-10 | 1984-11-24 | Zenko Hirose | アモルフアスシリコン成膜装置 |
US4496448A (en) * | 1983-10-13 | 1985-01-29 | At&T Bell Laboratories | Method for fabricating devices with DC bias-controlled reactive ion etching |
JPS60116126A (ja) * | 1983-11-28 | 1985-06-22 | Ricoh Co Ltd | プラズマcvd装置 |
JPS60162777A (ja) * | 1984-02-06 | 1985-08-24 | Canon Inc | プラズマcvd装置 |
US4681653A (en) * | 1984-06-01 | 1987-07-21 | Texas Instruments Incorporated | Planarized dielectric deposited using plasma enhanced chemical vapor deposition |
JPS61143579A (ja) * | 1984-12-14 | 1986-07-01 | Nachi Fujikoshi Corp | プラズマイオン供給方法 |
JPS6358924A (ja) * | 1986-08-29 | 1988-03-14 | Mitsubishi Electric Corp | プラズマ気相成長装置 |
-
1989
- 1989-05-05 US US07/347,876 patent/US4979467A/en not_active Expired - Lifetime
- 1989-05-05 EP EP89401277A patent/EP0342113B1/de not_active Expired - Lifetime
- 1989-05-05 DE DE89401277T patent/DE68910378T2/de not_active Expired - Lifetime
- 1989-05-06 KR KR1019890006074A patent/KR920008122B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0342113B1 (de) | 1993-11-03 |
KR900019133A (ko) | 1990-12-24 |
EP0342113A1 (de) | 1989-11-15 |
US4979467A (en) | 1990-12-25 |
KR920008122B1 (ko) | 1992-09-22 |
DE68910378T2 (de) | 1994-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8365 | Fully valid after opposition proceedings | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FUJI XEROX CO., LTD., TOKIO/TOKYO, JP |