DE68908419D1 - Verfahren zur bildung von loetverbindungen. - Google Patents

Verfahren zur bildung von loetverbindungen.

Info

Publication number
DE68908419D1
DE68908419D1 DE8989911727T DE68908419T DE68908419D1 DE 68908419 D1 DE68908419 D1 DE 68908419D1 DE 8989911727 T DE8989911727 T DE 8989911727T DE 68908419 T DE68908419 T DE 68908419T DE 68908419 D1 DE68908419 D1 DE 68908419D1
Authority
DE
Germany
Prior art keywords
solder connections
forming solder
forming
connections
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989911727T
Other languages
English (en)
Other versions
DE68908419T2 (de
Inventor
William Mullen
Douglas Hendricks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE68908419D1 publication Critical patent/DE68908419D1/de
Publication of DE68908419T2 publication Critical patent/DE68908419T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/444—Systems or boxes with surplus lengths
    • G02B6/4441—Boxes
    • G02B6/4442—Cap coupling boxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/44—Mechanical structures for providing tensile strength and external protection for fibres, e.g. optical transmission cables
    • G02B6/4439—Auxiliary devices
    • G02B6/4471—Terminating devices ; Cable clamps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0221—Laser welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
DE89911727T 1988-11-02 1989-09-25 Verfahren zur bildung von lötverbindungen. Expired - Fee Related DE68908419T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/266,470 US4889275A (en) 1988-11-02 1988-11-02 Method for effecting solder interconnects

Publications (2)

Publication Number Publication Date
DE68908419D1 true DE68908419D1 (de) 1993-09-16
DE68908419T2 DE68908419T2 (de) 1993-12-16

Family

ID=23014719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89911727T Expired - Fee Related DE68908419T2 (de) 1988-11-02 1989-09-25 Verfahren zur bildung von lötverbindungen.

Country Status (6)

Country Link
US (1) US4889275A (de)
EP (1) EP0441809B1 (de)
JP (1) JPH04502126A (de)
KR (1) KR930001684B1 (de)
DE (1) DE68908419T2 (de)
WO (1) WO1990005041A1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5048747A (en) * 1989-06-27 1991-09-17 At&T Bell Laboratories Solder assembly of components
US4972989A (en) * 1989-10-30 1990-11-27 Motorola, Inc. Through the lead soldering
DE4016107A1 (de) * 1990-05-18 1991-11-21 Friedrich Dieter Verfahren zum tauchbeloten von leiterplatten
US5011066A (en) * 1990-07-27 1991-04-30 Motorola, Inc. Enhanced collapse solder interconnection
JPH0770824B2 (ja) * 1991-03-04 1995-07-31 松下電器産業株式会社 電子部品接続方法
US5167361A (en) * 1991-05-16 1992-12-01 Motorola, Inc. Method and apparatus for two sided solder cladded surface mounted printed circuit boards
US5300755A (en) * 1991-08-12 1994-04-05 Yazaki Corporation Structure for welding electrical connecting portions to each other using laser light beam
US5159171A (en) * 1991-09-03 1992-10-27 Motorola, Inc. Method and apparatus for solder laser printing
US5234149A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Debondable metallic bonding method
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US5490786A (en) * 1994-03-25 1996-02-13 Itt Corporation Termination of contact tails to PC board
US5598967A (en) * 1995-04-04 1997-02-04 Motorola, Inc. Method and structure for attaching a circuit module to a circuit board
JPH09127516A (ja) * 1995-11-06 1997-05-16 Sharp Corp 液晶表示素子の製造方法
US6001724A (en) * 1996-01-29 1999-12-14 Micron Technology, Inc. Method for forming bumps on a semiconductor die using applied voltage pulses to an aluminum wire
EP0964608A3 (de) * 1998-06-12 2001-09-05 Ford Motor Company Verfahren zum Laserlöten
EP1219148A1 (de) * 1999-08-31 2002-07-03 Ford Motor Company Flexible schaltung mit reparierbarem anschlussende
US6274819B1 (en) 1999-09-01 2001-08-14 Visteon Global Technologies, Inc. Method and article for the connection and repair of flex and other circuits
SE521528C3 (sv) * 2001-08-07 2003-12-10 Ericsson Telefon Ab L M Svetsad benram
US7149090B2 (en) * 2001-09-11 2006-12-12 Brother Kogyo Kabushiki Kaisha Structure of flexible printed circuit board
DE10224266A1 (de) * 2002-05-31 2003-12-11 Conti Temic Microelectronic Elektronische Baugruppe
DE10302921A1 (de) * 2003-01-24 2004-07-29 Conti Temic Microelectronic Gmbh Elektronische Baugruppe
US6839965B2 (en) * 2003-02-06 2005-01-11 R-Tec Corporation Method of manufacturing a resistor connector
DE102004038401B4 (de) * 2003-10-14 2017-07-06 Conti Temic Microelectronic Gmbh Verfahren zum Verbinden eines flexiblen Flachleiters mit einer Leiterplatte
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
JP2015106663A (ja) * 2013-11-29 2015-06-08 住友電工デバイス・イノベーション株式会社 配線基板の接続方法、および配線基板の実装構造
DE102018213639A1 (de) * 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3589591A (en) * 1969-08-06 1971-06-29 Ibm Bonding apparatus
US3713575A (en) * 1971-06-29 1973-01-30 Western Electric Co Bonding apparatus having means for continuous monitoring of the bond
US3926360A (en) * 1974-05-28 1975-12-16 Burroughs Corp Method of attaching a flexible printed circuit board to a rigid printed circuit board
US4061263A (en) * 1976-09-22 1977-12-06 International Telephone And Telegraph Corporation Method of bonding a dielectric substrate to a metallic carrier in a printed circuit assembly
US4319708A (en) * 1977-02-15 1982-03-16 Lomerson Robert B Mechanical bonding of surface conductive layers
JPS5574147A (en) * 1978-11-29 1980-06-04 Nippon Telegr & Teleph Corp <Ntt> Terminal connection
US4412642A (en) * 1982-03-15 1983-11-01 Western Electric Co., Inc. Cast solder leads for leadless semiconductor circuits
JPS604270A (ja) * 1983-06-22 1985-01-10 Hitachi Ltd 太陽電池の製造方法
JPS607892U (ja) * 1983-06-29 1985-01-19 株式会社　タカラ 人形起立台
JPS607893U (ja) * 1983-06-29 1985-01-19 畑田　茂則 人形玩具
JPS60162573A (ja) * 1984-02-06 1985-08-24 Canon Inc レ−ザ−はんだ付け装置
JPS61219467A (ja) * 1985-03-27 1986-09-29 Hitachi Ltd フレキシブル回路基板用レ−ザはんだ付け装置
US4645114A (en) * 1985-06-17 1987-02-24 Northern Telecom Limited Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
GB8521141D0 (en) * 1985-08-23 1985-10-02 Bicc Plc Electrical contacts
US4760948A (en) * 1986-12-23 1988-08-02 Rca Corporation Leadless chip carrier assembly and method
US4752027A (en) * 1987-02-20 1988-06-21 Hewlett-Packard Company Method and apparatus for solder bumping of printed circuit boards

Also Published As

Publication number Publication date
WO1990005041A1 (en) 1990-05-17
JPH04502126A (ja) 1992-04-16
DE68908419T2 (de) 1993-12-16
KR900701457A (ko) 1990-12-03
EP0441809A1 (de) 1991-08-21
KR930001684B1 (ko) 1993-03-11
EP0441809B1 (de) 1993-08-11
US4889275A (en) 1989-12-26
EP0441809A4 (en) 1991-08-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee