DE68904679T2 - Elektroplattierung von kleinen partikeln. - Google Patents
Elektroplattierung von kleinen partikeln.Info
- Publication number
- DE68904679T2 DE68904679T2 DE8989107039T DE68904679T DE68904679T2 DE 68904679 T2 DE68904679 T2 DE 68904679T2 DE 8989107039 T DE8989107039 T DE 8989107039T DE 68904679 T DE68904679 T DE 68904679T DE 68904679 T2 DE68904679 T2 DE 68904679T2
- Authority
- DE
- Germany
- Prior art keywords
- small particles
- electroplating small
- electroplating
- particles
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63100204A JP2628184B2 (ja) | 1988-04-25 | 1988-04-25 | 微粉末に金属を電気めっきする方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68904679D1 DE68904679D1 (de) | 1993-03-18 |
DE68904679T2 true DE68904679T2 (de) | 1993-08-19 |
Family
ID=14267777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8989107039T Expired - Fee Related DE68904679T2 (de) | 1988-04-25 | 1989-04-19 | Elektroplattierung von kleinen partikeln. |
Country Status (4)
Country | Link |
---|---|
US (2) | US4908106A (de) |
EP (1) | EP0339464B1 (de) |
JP (1) | JP2628184B2 (de) |
DE (1) | DE68904679T2 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5603815A (en) * | 1994-10-04 | 1997-02-18 | Lashmore; David S. | Electrochemical fluidized bed coating of powders |
GB9508087D0 (en) * | 1995-04-20 | 1995-06-07 | Sherritt Inc | Manufacturing uniformly sized copper spheres |
JP2004156145A (ja) * | 1995-11-16 | 2004-06-03 | Sekisui Chem Co Ltd | 導電性微粒子 |
US6010610A (en) * | 1996-04-09 | 2000-01-04 | Yih; Pay | Method for electroplating metal coating(s) particulates at high coating speed with high current density |
US5911865A (en) * | 1997-02-07 | 1999-06-15 | Yih; Pay | Method for electroplating of micron particulates with metal coatings |
BE1011511A6 (fr) * | 1997-10-22 | 1999-10-05 | Cipari S A | Procede pour l'enrobage de particules conductrices de l'electricite par greffage d'une couche polymere et produits issus de ce procede. |
DE19823341A1 (de) * | 1998-05-26 | 1999-12-02 | Wolfgang Semrau | Beschichtetes Metallpulver und Verfahren zu seiner Herstellung |
US6033622A (en) * | 1998-09-21 | 2000-03-07 | The United States Of America As Represented By The Secretary Of The Air Force | Method for making metal matrix composites |
DE10130333B4 (de) * | 2001-06-26 | 2004-05-27 | Heraeus Kulzer Gmbh & Co. Kg | Galvanische Vorrichtung zur Abscheidung von Edelmetall |
US7118728B2 (en) * | 2002-05-08 | 2006-10-10 | Steward Advanced Materials, Inc. | Method and apparatus for making ferrite material products and products produced thereby |
AU2003264122A1 (en) * | 2002-09-10 | 2004-04-30 | Umicore | Ni-coated ti powders |
JP4783954B2 (ja) * | 2004-06-21 | 2011-09-28 | Dowaメタルテック株式会社 | 複合めっき材およびその製造方法 |
DE102005026267A1 (de) | 2005-06-08 | 2006-12-21 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Herstellung eines Verbundwerkstoffs |
EP2031098B1 (de) | 2007-08-28 | 2019-05-29 | Rohm and Haas Electronic Materials LLC | Zusammensetzung und entsprechendes verfahren zur galvanischen abscheidung von indiumverbundwerkstoffen |
JP5435355B2 (ja) * | 2009-09-04 | 2014-03-05 | 日立金属株式会社 | メッキ装置 |
CN101928979B (zh) * | 2010-08-06 | 2012-07-04 | 厦门大学 | 金属纳米催化剂的表面结构调控和制备方法 |
US10077390B2 (en) * | 2013-05-30 | 2018-09-18 | National Tsing Hua University | Working fluid and manufacturing method of metal particles |
GB2532914A (en) * | 2014-08-14 | 2016-06-08 | Bae Systems Plc | Improved electrodeposition |
US10648082B1 (en) * | 2014-09-21 | 2020-05-12 | Hrl Laboratories, Llc | Metal-coated reactive powders and methods for making the same |
WO2018189901A1 (ja) | 2017-04-14 | 2018-10-18 | Ykk株式会社 | めっき材及びその製造方法 |
KR102076772B1 (ko) * | 2017-12-28 | 2020-02-12 | 엔트리움 주식회사 | 금속파우더의 전해도금 방법 및 장치 |
ES2860348B2 (es) * | 2021-03-03 | 2022-04-20 | Drylyte Sl | Proceso de electrodeposicion de un metal y medio electrolitico para electrodeposicion |
CN113584547B (zh) * | 2021-08-10 | 2022-07-05 | 哈尔滨工业大学 | 一种微纳米金属颗粒表面镀层的制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3830711A (en) * | 1972-01-19 | 1974-08-20 | Bristol Aerojet Ltd | Electrodeposition of composite coatings |
JPS56156793A (en) * | 1980-05-08 | 1981-12-03 | Nippon Mining Co Ltd | Manufacture of composite powder by electroplating |
JPS59159999A (ja) * | 1983-03-02 | 1984-09-10 | Kuraray Co Ltd | 無機粉粒体の電気メツキ方法 |
JPS6318096A (ja) * | 1986-07-11 | 1988-01-25 | Nisshin Steel Co Ltd | 超微粉末に金属を被覆する方法 |
JPH056793A (ja) * | 1991-06-27 | 1993-01-14 | Matsushita Electric Ind Co Ltd | 薄膜el素子の製造方法 |
JPH0896A (ja) * | 1994-06-15 | 1996-01-09 | Kajima Corp | 緑化壁面を構成するための植栽壁ユニット |
-
1988
- 1988-04-25 JP JP63100204A patent/JP2628184B2/ja not_active Expired - Fee Related
-
1989
- 1989-04-19 DE DE8989107039T patent/DE68904679T2/de not_active Expired - Fee Related
- 1989-04-19 EP EP89107039A patent/EP0339464B1/de not_active Expired - Lifetime
- 1989-04-20 US US07/340,670 patent/US4908106A/en not_active Expired - Fee Related
- 1989-12-27 US US07/457,955 patent/US4954235A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0339464B1 (de) | 1993-02-03 |
JP2628184B2 (ja) | 1997-07-09 |
EP0339464A1 (de) | 1989-11-02 |
DE68904679D1 (de) | 1993-03-18 |
JPH01272792A (ja) | 1989-10-31 |
US4954235A (en) | 1990-09-04 |
US4908106A (en) | 1990-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |