DE60330709D1 - Flüssige polyimidvorläuferzusammensetzung und polyimidbeschichtung - Google Patents

Flüssige polyimidvorläuferzusammensetzung und polyimidbeschichtung

Info

Publication number
DE60330709D1
DE60330709D1 DE60330709T DE60330709T DE60330709D1 DE 60330709 D1 DE60330709 D1 DE 60330709D1 DE 60330709 T DE60330709 T DE 60330709T DE 60330709 T DE60330709 T DE 60330709T DE 60330709 D1 DE60330709 D1 DE 60330709D1
Authority
DE
Germany
Prior art keywords
polyimide
preparation composition
liquid
coating
polyimide coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330709T
Other languages
English (en)
Inventor
Koji Moriuchi
Harumi Yonemushi
Masahiko Kikuchi
Satomi Uwaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IST Corp Japan
Original Assignee
IST Corp Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IST Corp Japan filed Critical IST Corp Japan
Application granted granted Critical
Publication of DE60330709D1 publication Critical patent/DE60330709D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
DE60330709T 2002-12-27 2003-12-25 Flüssige polyimidvorläuferzusammensetzung und polyimidbeschichtung Expired - Lifetime DE60330709D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002381995 2002-12-27
JP2003137591 2003-05-15
PCT/JP2003/016678 WO2004061001A1 (ja) 2002-12-27 2003-12-25 ポリイミド前駆体液組成物及びポリイミド被膜

Publications (1)

Publication Number Publication Date
DE60330709D1 true DE60330709D1 (de) 2010-02-04

Family

ID=32716341

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330709T Expired - Lifetime DE60330709D1 (de) 2002-12-27 2003-12-25 Flüssige polyimidvorläuferzusammensetzung und polyimidbeschichtung

Country Status (6)

Country Link
US (2) US20060063908A1 (de)
EP (1) EP1577348B1 (de)
KR (1) KR100969415B1 (de)
AU (1) AU2003292790A1 (de)
DE (1) DE60330709D1 (de)
WO (1) WO2004061001A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080088601A1 (en) * 2004-05-19 2008-04-17 Tpk Touch Solutions Inc. Circuit layout on a touch panel
WO2008078620A1 (ja) * 2006-12-26 2008-07-03 Kaneka Corporation 新規なポリイミド前駆体組成物、その利用及びそれらの製造方法
TWI362398B (en) 2009-12-31 2012-04-21 Ind Tech Res Inst Polyimide polymers for flexible electrical device substrate material and flexible electrical devices comprising the same
JP5928129B2 (ja) * 2012-04-25 2016-06-01 Jnc株式会社 インクジェットインク
CN103897583B (zh) * 2012-12-31 2016-12-28 中原工学院 薄膜太阳能电池用氟化聚酰亚胺涂料及其制备方法
CN103897582B (zh) * 2012-12-31 2016-12-28 中原工学院 薄膜太阳能电池用聚酰亚胺涂料及其制备方法
TWI535768B (zh) * 2014-07-18 2016-06-01 長興材料工業股份有限公司 含溶劑之乾膜及其用途
JP2017052877A (ja) * 2015-09-09 2017-03-16 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体組成物の製造方法、及びポリイミド成形体の製造方法
KR101898455B1 (ko) 2016-03-31 2018-09-13 가부시키가이샤 아이.에스.티 폴리이미드 섬유 및 폴리이미드 섬유의 제조 방법
TWI625226B (zh) * 2016-04-01 2018-06-01 律勝科技股份有限公司 可撓性透明聚醯亞胺積層板及其製造方法
KR20180060259A (ko) * 2016-11-28 2018-06-07 한국생산기술연구원 전하 이동 복합체를 이용한 자동차용 스크래치 자기치유 클리어코트 조성물, 이를 포함하는 클리어코트 및 이의 제조방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1986002881A1 (en) * 1984-11-09 1986-05-22 Konishiroku Photo Industry Co., Ltd. Conductive laminate
GB2174399B (en) * 1985-03-10 1988-05-18 Nitto Electric Ind Co Colorless transparent polyimide shaped articles and their production
US4670342A (en) * 1985-04-08 1987-06-02 General Electric Company Method of making electrical inductive devices for use in hermetic refrigerant atmospheres
US4965337A (en) * 1987-12-31 1990-10-23 General Electric Company Very high heat thermoplastic polyetherimides containing aromatic structure
JP3386502B2 (ja) * 1993-01-07 2003-03-17 鐘淵化学工業株式会社 ポリイミド及びポリイミドフィルムの製造方法
US5554684A (en) * 1993-10-12 1996-09-10 Occidental Chemical Corporation Forming polyimide coating by screen printing
JPH09302225A (ja) * 1996-03-14 1997-11-25 Toshiba Corp ポリイミド前駆体組成物、ポリイミド膜の形成方法、電子部品および液晶素子
EP0896014B1 (de) * 1996-12-27 2004-11-17 Maruzen Petrochemical Co., Ltd. Lösliches polyimidharz, verfahren zu seiner herstellung und zusammensetzung einer polyimidharzlösung
US6232428B1 (en) * 1999-01-19 2001-05-15 I.S.T. Corporation Essentially colorless, transparent polyimide coatings and films
JP2000226517A (ja) 1999-02-08 2000-08-15 Unitika Ltd 黒色ペースト及びそれから得られる遮光性皮膜
JP2000305280A (ja) 1999-04-19 2000-11-02 Toray Ind Inc 感光性ポリイミド前駆体用現像液及びその回収方法
JP3345638B2 (ja) * 1999-11-11 2002-11-18 独立行政法人産業技術総合研究所 透明導電性膜およびその製造方法
KR100503225B1 (ko) * 2000-03-13 2005-07-22 미쯔이카가쿠 가부시기가이샤 폴리이미드의 제조방법
US6379865B1 (en) * 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
US6686106B2 (en) * 2000-06-26 2004-02-03 Ube Industries, Ltd. Photosensitive resin compositions, insulating films, and processes for formation of the films
JP2002055346A (ja) * 2000-08-11 2002-02-20 Sony Corp 液晶配向膜の形成方法および液晶表示装置の製造方法
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WO2004094499A1 (ja) * 2003-04-18 2004-11-04 Kaneka Corporation 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板
JP4769455B2 (ja) * 2003-12-30 2011-09-07 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． コーティング組成物
JP4584014B2 (ja) * 2005-04-25 2010-11-17 日立マグネットワイヤ株式会社 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法
JP4542463B2 (ja) * 2005-04-25 2010-09-15 日立マグネットワイヤ株式会社 耐部分放電性絶縁塗料、絶縁電線、及びそれらの製造方法
US20070290379A1 (en) * 2006-06-15 2007-12-20 Dueber Thomas E Hydrophobic compositions for electronic applications

Also Published As

Publication number Publication date
EP1577348A4 (de) 2007-03-07
EP1577348B1 (de) 2009-12-23
KR100969415B1 (ko) 2010-07-14
US20100140557A1 (en) 2010-06-10
EP1577348A1 (de) 2005-09-21
US20060063908A1 (en) 2006-03-23
KR20050085919A (ko) 2005-08-29
AU2003292790A1 (en) 2004-07-29
WO2004061001A1 (ja) 2004-07-22

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: MORIUCHI, KOJI, OTSU-SHI, SHIGA, JP

Inventor name: YONEMUSHI, HARUMI, OTSU-SHI, SHIGA, JP

Inventor name: KIKUCHI, MASAHIKO, OTSU-SHI, SHIGA, JP

Inventor name: UWABA, SATOMI, OTSU-SHI, SHIGA, JP

8364 No opposition during term of opposition