DE60329857D1 - HERSTELLUNG EINES LAND GRID ARRAY MITTELS ELASTOMERKERN UND LEITENDER METALLHüLLE ODER -GITTER - Google Patents

HERSTELLUNG EINES LAND GRID ARRAY MITTELS ELASTOMERKERN UND LEITENDER METALLHüLLE ODER -GITTER

Info

Publication number
DE60329857D1
DE60329857D1 DE60329857T DE60329857T DE60329857D1 DE 60329857 D1 DE60329857 D1 DE 60329857D1 DE 60329857 T DE60329857 T DE 60329857T DE 60329857 T DE60329857 T DE 60329857T DE 60329857 D1 DE60329857 D1 DE 60329857D1
Authority
DE
Germany
Prior art keywords
lga
conductive
grid array
land
methods
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60329857T
Other languages
English (en)
Inventor
Gareth G Hougham
Keith E Fogel
Paul A Lauro
Joseph Zinter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE60329857D1 publication Critical patent/DE60329857D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00—Electrical connectors
    • Y10S439/931—Conductive coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102—Woven scrim
    • Y10T442/109—Metal or metal-coated fiber-containing scrim
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102—Woven scrim
    • Y10T442/172—Coated or impregnated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacture Of Switches (AREA)
  • Connecting Device With Holders (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Electrotherapy Devices (AREA)
  • Measuring Leads Or Probes (AREA)
DE60329857T 2002-10-24 2003-05-13 HERSTELLUNG EINES LAND GRID ARRAY MITTELS ELASTOMERKERN UND LEITENDER METALLHüLLE ODER -GITTER Expired - Lifetime DE60329857D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42148002P 2002-10-24 2002-10-24
PCT/US2003/014830 WO2004039135A1 (en) 2002-10-24 2003-05-13 Land grid array fabrication using elastomer core and conducting metal shell or mesh

Publications (1)

Publication Number Publication Date
DE60329857D1 true DE60329857D1 (de) 2009-12-10

Family

ID=32176720

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60329857T Expired - Lifetime DE60329857D1 (de) 2002-10-24 2003-05-13 HERSTELLUNG EINES LAND GRID ARRAY MITTELS ELASTOMERKERN UND LEITENDER METALLHüLLE ODER -GITTER

Country Status (10)

Country Link
US (2) US7479014B2 (de)
EP (1) EP1554915B1 (de)
JP (1) JP4366316B2 (de)
KR (1) KR100627957B1 (de)
CN (1) CN100493291C (de)
AT (1) ATE447248T1 (de)
AU (1) AU2003229019A1 (de)
DE (1) DE60329857D1 (de)
TW (1) TWI223976B (de)
WO (1) WO2004039135A1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE447248T1 (de) * 2002-10-24 2009-11-15 Ibm Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter
JP4709850B2 (ja) 2004-12-16 2011-06-29 インターナショナル・ビジネス・マシーンズ・コーポレーション 電気的接続デバイス及びこれの製造方法
US7771208B2 (en) 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
US7549870B2 (en) 2007-01-03 2009-06-23 Tyco Electronics Corporation Electrical interconnect device utilizing contact caps
US8832936B2 (en) 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
JP5006162B2 (ja) * 2007-11-09 2012-08-22 日本航空電子工業株式会社 電気接続部材
DE102008021347A1 (de) * 2008-04-29 2009-06-10 Siemens Medical Instruments Pte. Ltd. Adapter für eine elektrische Baugruppe, Verwendung eines solchen Adapters und System aus diesem Adapter und der elektrischen Baugruppe
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
WO2011139619A1 (en) 2010-04-26 2011-11-10 Hsio Technologies, Llc Semiconductor device package adapter
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
US9093767B2 (en) * 2009-06-02 2015-07-28 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
WO2010141295A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed flexible circuit
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
WO2013036565A1 (en) 2011-09-08 2013-03-14 Hsio Technologies, Llc Direct metalization of electrical circuit structures
US9699906B2 (en) 2009-06-02 2017-07-04 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
US9232654B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc High performance electrical circuit structure
WO2010141303A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Resilient conductive electrical interconnect
US8618649B2 (en) 2009-06-02 2013-12-31 Hsio Technologies, Llc Compliant printed circuit semiconductor package
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
US9184527B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Electrical connector insulator housing
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
WO2010141311A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
US9320133B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Electrical interconnect IC device socket
US9277654B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Composite polymer-metal electrical contacts
US9320144B2 (en) 2009-06-17 2016-04-19 Hsio Technologies, Llc Method of forming a semiconductor socket
US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US8747122B2 (en) * 2010-06-23 2014-06-10 International Business Machines Corporation Implementing connection of two large electronic boards utilizing LGA interconnect
US8109769B1 (en) * 2010-12-17 2012-02-07 Rogue Valley Microdevices Micromachined flex interposers
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US8672688B2 (en) 2012-01-17 2014-03-18 International Business Machines Corporation Land grid array interposer with compressible conductors
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US9755335B2 (en) 2015-03-18 2017-09-05 Hsio Technologies, Llc Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
US20170084431A1 (en) * 2015-09-21 2017-03-23 Apple Inc. Module retention during a sputter process
IT201700100522A1 (it) 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
KR102110150B1 (ko) * 2019-01-08 2020-06-08 (주)티에스이 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법
EP3970229A1 (de) * 2019-05-14 2022-03-23 Uhland Goebel Vorrichtung zum abstrahlen und empfangen von mikrowellen, radarvorrichtung mit solch einer vorrichtung und verfahren zur montage solch einer vorrichtung
US20230208058A1 (en) * 2021-12-28 2023-06-29 TE Connectivity Services Gmbh Socket connector

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070077A (en) * 1976-06-01 1978-01-24 E. I. Du Pont De Nemours And Company Circuit board eyelet
US4181385A (en) * 1978-03-30 1980-01-01 Motorola, Inc. Low profile socket for circuit board with gas vents for fixed position soldering
US4813129A (en) 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
JPH0243558A (ja) 1988-08-04 1990-02-14 Konica Corp 電子写真感光体
JP3400051B2 (ja) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション 異方性導電膜、その製造方法及びそれを使用するコネクタ
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same
US6271482B1 (en) * 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
JPH08287983A (ja) 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
JPH08306416A (ja) 1995-04-27 1996-11-22 Whitaker Corp:The コネクタ
US5759047A (en) * 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6348659B1 (en) 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
ATE277434T1 (de) * 1999-07-02 2004-10-15 Shinetsu Polymer Co Rohrförmiger schaltkreisverbinder
US6264476B1 (en) * 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
US6939143B2 (en) * 2000-01-20 2005-09-06 Gryphics, Inc. Flexible compliant interconnect assembly
US6375476B1 (en) * 2000-04-21 2002-04-23 Thomas & Betts International, Inc. LGA package socket
WO2001089038A2 (en) * 2000-05-15 2001-11-22 Molex Incorporated Elastomeric electrical connector
JP2002063952A (ja) * 2000-08-15 2002-02-28 Hirose Electric Co Ltd 圧縮コネクタ
US6312266B1 (en) * 2000-08-24 2001-11-06 High Connection Density, Inc. Carrier for land grid array connectors
US6814584B2 (en) * 2001-05-11 2004-11-09 Molex Incorporated Elastomeric electrical connector
US6595784B2 (en) * 2001-05-15 2003-07-22 International Business Machines Corporation Interposer member having apertures for relieving stress and increasing contact compliancy
ATE447248T1 (de) * 2002-10-24 2009-11-15 Ibm Herstellung eines land grid array mittels elastomerkern und leitender metallhülle oder - gitter
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7137827B2 (en) * 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method

Also Published As

Publication number Publication date
US20060003648A1 (en) 2006-01-05
JP4366316B2 (ja) 2009-11-18
CN1692682A (zh) 2005-11-02
US20090042414A1 (en) 2009-02-12
KR20050062568A (ko) 2005-06-23
US7479014B2 (en) 2009-01-20
EP1554915B1 (de) 2009-10-28
AU2003229019A1 (en) 2004-05-13
KR100627957B1 (ko) 2006-09-25
JP2006518542A (ja) 2006-08-10
CN100493291C (zh) 2009-05-27
ATE447248T1 (de) 2009-11-15
EP1554915A4 (de) 2008-08-20
EP1554915A1 (de) 2005-07-20
TWI223976B (en) 2004-11-11
TW200414840A (en) 2004-08-01
WO2004039135A1 (en) 2004-05-06
US7736152B2 (en) 2010-06-15

Similar Documents

Publication Publication Date Title
DE60329857D1 (de) HERSTELLUNG EINES LAND GRID ARRAY MITTELS ELASTOMERKERN UND LEITENDER METALLHüLLE ODER -GITTER
TW200603493A (en) Electrical connector in a flexible host
EP1365479A4 (de) "anisotroper leitfähiger verbinder, herstellungsverfahren dafür und sondenglied"
TWI266385B (en) Methods of making electromechanical three-trace junction devices
TW200733408A (en) Solar cell with physically separated distributed electrical contacts
EP2141511A3 (de) Strahlungsdetektor mit Gasverstärkung und Herstellungsverfahren dafür
US20160064158A1 (en) Switch having improved moveable contact
CN101752124B (zh) 膜片开关
CN205354933U (zh) 回弹性好的仪器键盘
TW200601917A (en) Method for fabricating electrical connection structure of circuit board
ATE428180T1 (de) Elektrischer schalter
CN103187195A (zh) 磁性分离式按键及其键盘
TW200627489A (en) Solid-electrolyte capacitor, manufacturing method thereof, and digital signal processing substrate using the solid-electrolyte capacitor
TW200733494A (en) Electrical connector assembly
CN102376483A (zh) 可提高接触灵敏度的输入装置
CN206349284U (zh) 一种具有击打声音的薄型键盘
TW200610466A (en) Method for fabricating conductive bumps of a circuit board
CN208385274U (zh) 消音按键模组及电子设备
CN201946470U (zh) 金属弹片按键
CN209282092U (zh) 按压开关
CN203165755U (zh) 一种无弹性硅胶体和剪刀脚支架的薄型计算机键盘
ATE311680T1 (de) Verbinder mit dauerhafter kontakthaltekraft
JPS5614386A (en) Coordinate input device
CN215680474U (zh) 一种塑料电源按键
CN216528558U (zh) 具有弹性支撑结构的键盘

Legal Events

Date Code Title Description
8320 Willingness to grant licences declared (paragraph 23)
8364 No opposition during term of opposition