JP4366316B2 - ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 - Google Patents

ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 Download PDF

Info

Publication number
JP4366316B2
JP4366316B2 JP2004546668A JP2004546668A JP4366316B2 JP 4366316 B2 JP4366316 B2 JP 4366316B2 JP 2004546668 A JP2004546668 A JP 2004546668A JP 2004546668 A JP2004546668 A JP 2004546668A JP 4366316 B2 JP4366316 B2 JP 4366316B2
Authority
JP
Japan
Prior art keywords
carrier sheet
hole
interposer
lga
button
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004546668A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006518542A (ja
Inventor
ホーガム、ガレス、ジー
フォーゲル、キース、イー
ラウロ、ポール、エー
ジンター、ジョセフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JP2006518542A publication Critical patent/JP2006518542A/ja
Application granted granted Critical
Publication of JP4366316B2 publication Critical patent/JP4366316B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/10Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/7082Coupling device supported only by cooperation with PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0133Elastomeric or compliant polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0367Metallic bump or raised conductor not used as solder bump
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/0959Plated through-holes or plated blind vias filled with insulating material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10378Interposers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/931Conductive coating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102Woven scrim
    • Y10T442/109Metal or metal-coated fiber-containing scrim
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T442/00Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
    • Y10T442/10Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
    • Y10T442/102Woven scrim
    • Y10T442/172Coated or impregnated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Push-Button Switches (AREA)
  • Laminated Bodies (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)
  • Electrotherapy Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
JP2004546668A 2002-10-24 2003-05-13 ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 Expired - Fee Related JP4366316B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US42148002P 2002-10-24 2002-10-24
PCT/US2003/014830 WO2004039135A1 (en) 2002-10-24 2003-05-13 Land grid array fabrication using elastomer core and conducting metal shell or mesh

Publications (2)

Publication Number Publication Date
JP2006518542A JP2006518542A (ja) 2006-08-10
JP4366316B2 true JP4366316B2 (ja) 2009-11-18

Family

ID=32176720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004546668A Expired - Fee Related JP4366316B2 (ja) 2002-10-24 2003-05-13 ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法

Country Status (10)

Country Link
US (2) US7479014B2 (de)
EP (1) EP1554915B1 (de)
JP (1) JP4366316B2 (de)
KR (1) KR100627957B1 (de)
CN (1) CN100493291C (de)
AT (1) ATE447248T1 (de)
AU (1) AU2003229019A1 (de)
DE (1) DE60329857D1 (de)
TW (1) TWI223976B (de)
WO (1) WO2004039135A1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100627957B1 (ko) * 2002-10-24 2006-09-25 인터내셔널 비지네스 머신즈 코포레이션 탄성체 코어 및 전도성 금속 쉘 또는 망을 이용하는 랜드그리드 어레이 제조방법
US7771208B2 (en) 2004-12-16 2010-08-10 International Business Machines Corporation Metalized elastomeric electrical contacts
JP5220417B2 (ja) * 2004-12-16 2013-06-26 インターナショナル・ビジネス・マシーンズ・コーポレーション メタライズ・エラストマ・プローブ構造体
US7549870B2 (en) 2007-01-03 2009-06-23 Tyco Electronics Corporation Electrical interconnect device utilizing contact caps
US8832936B2 (en) 2007-04-30 2014-09-16 International Business Machines Corporation Method of forming metallized elastomeric electrical contacts
JP5006162B2 (ja) * 2007-11-09 2012-08-22 日本航空電子工業株式会社 電気接続部材
DE102008021347A1 (de) * 2008-04-29 2009-06-10 Siemens Medical Instruments Pte. Ltd. Adapter für eine elektrische Baugruppe, Verwendung eines solchen Adapters und System aus diesem Adapter und der elektrischen Baugruppe
WO2014011232A1 (en) 2012-07-12 2014-01-16 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
WO2011139619A1 (en) 2010-04-26 2011-11-10 Hsio Technologies, Llc Semiconductor device package adapter
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
US8618649B2 (en) 2009-06-02 2013-12-31 Hsio Technologies, Llc Compliant printed circuit semiconductor package
WO2010141303A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Resilient conductive electrical interconnect
WO2010141311A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
US9184527B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Electrical connector insulator housing
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
US9414500B2 (en) 2009-06-02 2016-08-09 Hsio Technologies, Llc Compliant printed flexible circuit
US9232654B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc High performance electrical circuit structure
US9277654B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Composite polymer-metal electrical contacts
WO2014011226A1 (en) 2012-07-10 2014-01-16 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
US9320133B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Electrical interconnect IC device socket
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
WO2013036565A1 (en) 2011-09-08 2013-03-14 Hsio Technologies, Llc Direct metalization of electrical circuit structures
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
WO2012074963A1 (en) 2010-12-01 2012-06-07 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9320144B2 (en) 2009-06-17 2016-04-19 Hsio Technologies, Llc Method of forming a semiconductor socket
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US9689897B2 (en) 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
US8747122B2 (en) * 2010-06-23 2014-06-10 International Business Machines Corporation Implementing connection of two large electronic boards utilizing LGA interconnect
US8109769B1 (en) * 2010-12-17 2012-02-07 Rogue Valley Microdevices Micromachined flex interposers
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
US8672688B2 (en) 2012-01-17 2014-03-18 International Business Machines Corporation Land grid array interposer with compressible conductors
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US9559447B2 (en) 2015-03-18 2017-01-31 Hsio Technologies, Llc Mechanical contact retention within an electrical connector
US20170084431A1 (en) * 2015-09-21 2017-03-23 Apple Inc. Module retention during a sputter process
IT201700100522A1 (it) * 2017-09-07 2019-03-07 Technoprobe Spa Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione
KR102110150B1 (ko) * 2019-01-08 2020-06-08 (주)티에스이 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법
EP3970229B1 (de) * 2019-05-14 2024-08-28 Uhland Goebel Vorrichtung zum abstrahlen und empfangen von mikrowellen, radarvorrichtung mit solch einer vorrichtung und verfahren zur montage solch einer vorrichtung
US12051865B2 (en) * 2021-12-28 2024-07-30 Te Connectivity Solutions Gmbh Socket connector

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070077A (en) * 1976-06-01 1978-01-24 E. I. Du Pont De Nemours And Company Circuit board eyelet
US4181385A (en) * 1978-03-30 1980-01-01 Motorola, Inc. Low profile socket for circuit board with gas vents for fixed position soldering
US4813129A (en) * 1987-06-19 1989-03-21 Hewlett-Packard Company Interconnect structure for PC boards and integrated circuits
JPH0243558A (ja) 1988-08-04 1990-02-14 Konica Corp 電子写真感光体
JP3400051B2 (ja) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション 異方性導電膜、その製造方法及びそれを使用するコネクタ
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same
US5599193A (en) * 1994-08-23 1997-02-04 Augat Inc. Resilient electrical interconnect
US6271482B1 (en) * 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
JPH08287983A (ja) 1995-04-14 1996-11-01 Whitaker Corp:The エラストマコネクタ
JPH08306416A (ja) 1995-04-27 1996-11-22 Whitaker Corp:The コネクタ
US5759047A (en) * 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US5900674A (en) * 1996-12-23 1999-05-04 General Electric Company Interface structures for electronic devices
US6348659B1 (en) 1999-01-07 2002-02-19 Thomas & Betts International, Inc. Resilient electrical interconnects having non-uniform cross-section
TW480786B (en) * 1999-07-02 2002-03-21 Shinetsu Polymer Co Tubular circuit connector
US6264476B1 (en) * 1999-12-09 2001-07-24 High Connection Density, Inc. Wire segment based interposer for high frequency electrical connection
JP2003520454A (ja) * 2000-01-20 2003-07-02 グリフィクス インコーポレーティッド フレキシブルなコンプライアンス相互連結アセンブリ
US6375476B1 (en) * 2000-04-21 2002-04-23 Thomas & Betts International, Inc. LGA package socket
AU2001261436A1 (en) * 2000-05-15 2001-11-26 Molex Incorporated Elastomeric electrical connector
JP2002063952A (ja) * 2000-08-15 2002-02-28 Hirose Electric Co Ltd 圧縮コネクタ
US6312266B1 (en) * 2000-08-24 2001-11-06 High Connection Density, Inc. Carrier for land grid array connectors
US6814584B2 (en) * 2001-05-11 2004-11-09 Molex Incorporated Elastomeric electrical connector
US6595784B2 (en) * 2001-05-15 2003-07-22 International Business Machines Corporation Interposer member having apertures for relieving stress and increasing contact compliancy
KR100627957B1 (ko) * 2002-10-24 2006-09-25 인터내셔널 비지네스 머신즈 코포레이션 탄성체 코어 및 전도성 금속 쉘 또는 망을 이용하는 랜드그리드 어레이 제조방법
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US7070419B2 (en) * 2003-06-11 2006-07-04 Neoconix Inc. Land grid array connector including heterogeneous contact elements
US7137827B2 (en) * 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method

Also Published As

Publication number Publication date
CN100493291C (zh) 2009-05-27
US20060003648A1 (en) 2006-01-05
US7479014B2 (en) 2009-01-20
AU2003229019A1 (en) 2004-05-13
JP2006518542A (ja) 2006-08-10
EP1554915A1 (de) 2005-07-20
WO2004039135A1 (en) 2004-05-06
TWI223976B (en) 2004-11-11
US20090042414A1 (en) 2009-02-12
US7736152B2 (en) 2010-06-15
ATE447248T1 (de) 2009-11-15
EP1554915B1 (de) 2009-10-28
DE60329857D1 (de) 2009-12-10
CN1692682A (zh) 2005-11-02
EP1554915A4 (de) 2008-08-20
TW200414840A (en) 2004-08-01
KR20050062568A (ko) 2005-06-23
KR100627957B1 (ko) 2006-09-25

Similar Documents

Publication Publication Date Title
JP4366316B2 (ja) ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法
US5759047A (en) Flexible circuitized interposer with apertured member and method for making same
US6545226B2 (en) Printed wiring board interposer sub-assembly
US6663399B2 (en) Surface mount attachable land grid array connector and method of forming same
US7875811B2 (en) High speed interposer
US7374428B2 (en) Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries
US5810607A (en) Interconnector with contact pads having enhanced durability
CN1400696A (zh) 电触点的制造方法
US6723927B1 (en) High-reliability interposer for low cost and high reliability applications
US5587885A (en) Mechanical printed circuit board/laminated multi chip module interconnect apparatus
US20130029500A1 (en) Connector and fabrication method thereof
US6954984B2 (en) Land grid array structure
US20070238324A1 (en) Electrical connector
JPH0831527A (ja) 基板用コネクタ
US7363688B2 (en) Land grid array structures and methods for engineering change
US6595784B2 (en) Interposer member having apertures for relieving stress and increasing contact compliancy

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060427

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060427

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20090206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090428

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090721

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090818

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090824

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120828

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130828

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees