JP4366316B2 - ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 - Google Patents
ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 Download PDFInfo
- Publication number
- JP4366316B2 JP4366316B2 JP2004546668A JP2004546668A JP4366316B2 JP 4366316 B2 JP4366316 B2 JP 4366316B2 JP 2004546668 A JP2004546668 A JP 2004546668A JP 2004546668 A JP2004546668 A JP 2004546668A JP 4366316 B2 JP4366316 B2 JP 4366316B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier sheet
- hole
- interposer
- lga
- button
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/931—Conductive coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
- Y10T442/102—Woven scrim
- Y10T442/109—Metal or metal-coated fiber-containing scrim
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
- Y10T442/102—Woven scrim
- Y10T442/172—Coated or impregnated
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Push-Button Switches (AREA)
- Laminated Bodies (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
- Electrotherapy Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Manufacture Of Switches (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42148002P | 2002-10-24 | 2002-10-24 | |
PCT/US2003/014830 WO2004039135A1 (en) | 2002-10-24 | 2003-05-13 | Land grid array fabrication using elastomer core and conducting metal shell or mesh |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006518542A JP2006518542A (ja) | 2006-08-10 |
JP4366316B2 true JP4366316B2 (ja) | 2009-11-18 |
Family
ID=32176720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004546668A Expired - Fee Related JP4366316B2 (ja) | 2002-10-24 | 2003-05-13 | ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 |
Country Status (10)
Country | Link |
---|---|
US (2) | US7479014B2 (de) |
EP (1) | EP1554915B1 (de) |
JP (1) | JP4366316B2 (de) |
KR (1) | KR100627957B1 (de) |
CN (1) | CN100493291C (de) |
AT (1) | ATE447248T1 (de) |
AU (1) | AU2003229019A1 (de) |
DE (1) | DE60329857D1 (de) |
TW (1) | TWI223976B (de) |
WO (1) | WO2004039135A1 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100627957B1 (ko) * | 2002-10-24 | 2006-09-25 | 인터내셔널 비지네스 머신즈 코포레이션 | 탄성체 코어 및 전도성 금속 쉘 또는 망을 이용하는 랜드그리드 어레이 제조방법 |
US7771208B2 (en) | 2004-12-16 | 2010-08-10 | International Business Machines Corporation | Metalized elastomeric electrical contacts |
JP5220417B2 (ja) * | 2004-12-16 | 2013-06-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | メタライズ・エラストマ・プローブ構造体 |
US7549870B2 (en) | 2007-01-03 | 2009-06-23 | Tyco Electronics Corporation | Electrical interconnect device utilizing contact caps |
US8832936B2 (en) | 2007-04-30 | 2014-09-16 | International Business Machines Corporation | Method of forming metallized elastomeric electrical contacts |
JP5006162B2 (ja) * | 2007-11-09 | 2012-08-22 | 日本航空電子工業株式会社 | 電気接続部材 |
DE102008021347A1 (de) * | 2008-04-29 | 2009-06-10 | Siemens Medical Instruments Pte. Ltd. | Adapter für eine elektrische Baugruppe, Verwendung eines solchen Adapters und System aus diesem Adapter und der elektrischen Baugruppe |
WO2014011232A1 (en) | 2012-07-12 | 2014-01-16 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
US9276336B2 (en) | 2009-05-28 | 2016-03-01 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
US8955215B2 (en) | 2009-05-28 | 2015-02-17 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2011139619A1 (en) | 2010-04-26 | 2011-11-10 | Hsio Technologies, Llc | Semiconductor device package adapter |
US9196980B2 (en) | 2009-06-02 | 2015-11-24 | Hsio Technologies, Llc | High performance surface mount electrical interconnect with external biased normal force loading |
US8618649B2 (en) | 2009-06-02 | 2013-12-31 | Hsio Technologies, Llc | Compliant printed circuit semiconductor package |
WO2010141303A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Resilient conductive electrical interconnect |
WO2010141311A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit area array semiconductor device package |
US9184527B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Electrical connector insulator housing |
WO2010141297A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit wafer level semiconductor package |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US9414500B2 (en) | 2009-06-02 | 2016-08-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
US9232654B2 (en) | 2009-06-02 | 2016-01-05 | Hsio Technologies, Llc | High performance electrical circuit structure |
US9277654B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
WO2014011226A1 (en) | 2012-07-10 | 2014-01-16 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
US9320133B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
WO2013036565A1 (en) | 2011-09-08 | 2013-03-14 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
WO2012074963A1 (en) | 2010-12-01 | 2012-06-07 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US9320144B2 (en) | 2009-06-17 | 2016-04-19 | Hsio Technologies, Llc | Method of forming a semiconductor socket |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
US8747122B2 (en) * | 2010-06-23 | 2014-06-10 | International Business Machines Corporation | Implementing connection of two large electronic boards utilizing LGA interconnect |
US8109769B1 (en) * | 2010-12-17 | 2012-02-07 | Rogue Valley Microdevices | Micromachined flex interposers |
US8641428B2 (en) * | 2011-12-02 | 2014-02-04 | Neoconix, Inc. | Electrical connector and method of making it |
US8672688B2 (en) | 2012-01-17 | 2014-03-18 | International Business Machines Corporation | Land grid array interposer with compressible conductors |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US9559447B2 (en) | 2015-03-18 | 2017-01-31 | Hsio Technologies, Llc | Mechanical contact retention within an electrical connector |
US20170084431A1 (en) * | 2015-09-21 | 2017-03-23 | Apple Inc. | Module retention during a sputter process |
IT201700100522A1 (it) * | 2017-09-07 | 2019-03-07 | Technoprobe Spa | Elemento di interfaccia per un’apparecchiatura di test di dispositivi elettronici e relativo metodo di fabbricazione |
KR102110150B1 (ko) * | 2019-01-08 | 2020-06-08 | (주)티에스이 | 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법 |
EP3970229B1 (de) * | 2019-05-14 | 2024-08-28 | Uhland Goebel | Vorrichtung zum abstrahlen und empfangen von mikrowellen, radarvorrichtung mit solch einer vorrichtung und verfahren zur montage solch einer vorrichtung |
US12051865B2 (en) * | 2021-12-28 | 2024-07-30 | Te Connectivity Solutions Gmbh | Socket connector |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4070077A (en) * | 1976-06-01 | 1978-01-24 | E. I. Du Pont De Nemours And Company | Circuit board eyelet |
US4181385A (en) * | 1978-03-30 | 1980-01-01 | Motorola, Inc. | Low profile socket for circuit board with gas vents for fixed position soldering |
US4813129A (en) * | 1987-06-19 | 1989-03-21 | Hewlett-Packard Company | Interconnect structure for PC boards and integrated circuits |
JPH0243558A (ja) | 1988-08-04 | 1990-02-14 | Konica Corp | 電子写真感光体 |
JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
US5599193A (en) * | 1994-08-23 | 1997-02-04 | Augat Inc. | Resilient electrical interconnect |
US6271482B1 (en) * | 1994-08-23 | 2001-08-07 | Thomas & Betts International, Inc. | Conductive elastomer interconnect |
JPH08287983A (ja) | 1995-04-14 | 1996-11-01 | Whitaker Corp:The | エラストマコネクタ |
JPH08306416A (ja) | 1995-04-27 | 1996-11-22 | Whitaker Corp:The | コネクタ |
US5759047A (en) * | 1996-05-24 | 1998-06-02 | International Business Machines Corporation | Flexible circuitized interposer with apertured member and method for making same |
US5900674A (en) * | 1996-12-23 | 1999-05-04 | General Electric Company | Interface structures for electronic devices |
US6348659B1 (en) | 1999-01-07 | 2002-02-19 | Thomas & Betts International, Inc. | Resilient electrical interconnects having non-uniform cross-section |
TW480786B (en) * | 1999-07-02 | 2002-03-21 | Shinetsu Polymer Co | Tubular circuit connector |
US6264476B1 (en) * | 1999-12-09 | 2001-07-24 | High Connection Density, Inc. | Wire segment based interposer for high frequency electrical connection |
JP2003520454A (ja) * | 2000-01-20 | 2003-07-02 | グリフィクス インコーポレーティッド | フレキシブルなコンプライアンス相互連結アセンブリ |
US6375476B1 (en) * | 2000-04-21 | 2002-04-23 | Thomas & Betts International, Inc. | LGA package socket |
AU2001261436A1 (en) * | 2000-05-15 | 2001-11-26 | Molex Incorporated | Elastomeric electrical connector |
JP2002063952A (ja) * | 2000-08-15 | 2002-02-28 | Hirose Electric Co Ltd | 圧縮コネクタ |
US6312266B1 (en) * | 2000-08-24 | 2001-11-06 | High Connection Density, Inc. | Carrier for land grid array connectors |
US6814584B2 (en) * | 2001-05-11 | 2004-11-09 | Molex Incorporated | Elastomeric electrical connector |
US6595784B2 (en) * | 2001-05-15 | 2003-07-22 | International Business Machines Corporation | Interposer member having apertures for relieving stress and increasing contact compliancy |
KR100627957B1 (ko) * | 2002-10-24 | 2006-09-25 | 인터내셔널 비지네스 머신즈 코포레이션 | 탄성체 코어 및 전도성 금속 쉘 또는 망을 이용하는 랜드그리드 어레이 제조방법 |
US7113408B2 (en) * | 2003-06-11 | 2006-09-26 | Neoconix, Inc. | Contact grid array formed on a printed circuit board |
US7070419B2 (en) * | 2003-06-11 | 2006-07-04 | Neoconix Inc. | Land grid array connector including heterogeneous contact elements |
US7137827B2 (en) * | 2003-11-17 | 2006-11-21 | International Business Machines Corporation | Interposer with electrical contact button and method |
-
2003
- 2003-05-13 KR KR1020057005341A patent/KR100627957B1/ko not_active IP Right Cessation
- 2003-05-13 DE DE60329857T patent/DE60329857D1/de not_active Expired - Lifetime
- 2003-05-13 AT AT03726799T patent/ATE447248T1/de not_active IP Right Cessation
- 2003-05-13 WO PCT/US2003/014830 patent/WO2004039135A1/en active Application Filing
- 2003-05-13 JP JP2004546668A patent/JP4366316B2/ja not_active Expired - Fee Related
- 2003-05-13 AU AU2003229019A patent/AU2003229019A1/en not_active Abandoned
- 2003-05-13 CN CNB038245159A patent/CN100493291C/zh not_active Expired - Lifetime
- 2003-05-13 US US10/531,494 patent/US7479014B2/en not_active Expired - Fee Related
- 2003-05-13 EP EP03726799A patent/EP1554915B1/de not_active Expired - Lifetime
- 2003-10-17 TW TW92128884A patent/TWI223976B/zh not_active IP Right Cessation
-
2008
- 2008-10-10 US US12/249,035 patent/US7736152B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100493291C (zh) | 2009-05-27 |
US20060003648A1 (en) | 2006-01-05 |
US7479014B2 (en) | 2009-01-20 |
AU2003229019A1 (en) | 2004-05-13 |
JP2006518542A (ja) | 2006-08-10 |
EP1554915A1 (de) | 2005-07-20 |
WO2004039135A1 (en) | 2004-05-06 |
TWI223976B (en) | 2004-11-11 |
US20090042414A1 (en) | 2009-02-12 |
US7736152B2 (en) | 2010-06-15 |
ATE447248T1 (de) | 2009-11-15 |
EP1554915B1 (de) | 2009-10-28 |
DE60329857D1 (de) | 2009-12-10 |
CN1692682A (zh) | 2005-11-02 |
EP1554915A4 (de) | 2008-08-20 |
TW200414840A (en) | 2004-08-01 |
KR20050062568A (ko) | 2005-06-23 |
KR100627957B1 (ko) | 2006-09-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4366316B2 (ja) | ランド・グリッド・アレイ用のインタポーザ及びこれの製造方法 | |
US5759047A (en) | Flexible circuitized interposer with apertured member and method for making same | |
US6545226B2 (en) | Printed wiring board interposer sub-assembly | |
US6663399B2 (en) | Surface mount attachable land grid array connector and method of forming same | |
US7875811B2 (en) | High speed interposer | |
US7374428B2 (en) | Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | |
US5810607A (en) | Interconnector with contact pads having enhanced durability | |
CN1400696A (zh) | 电触点的制造方法 | |
US6723927B1 (en) | High-reliability interposer for low cost and high reliability applications | |
US5587885A (en) | Mechanical printed circuit board/laminated multi chip module interconnect apparatus | |
US20130029500A1 (en) | Connector and fabrication method thereof | |
US6954984B2 (en) | Land grid array structure | |
US20070238324A1 (en) | Electrical connector | |
JPH0831527A (ja) | 基板用コネクタ | |
US7363688B2 (en) | Land grid array structures and methods for engineering change | |
US6595784B2 (en) | Interposer member having apertures for relieving stress and increasing contact compliancy |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060427 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060427 |
|
RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20090206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090428 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090721 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090818 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090824 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120828 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130828 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |